Read Panasonic KX-TCD305RU / KX-TCD307RU / KX-TCA130RU Service Manual online
KX-TCD305RU
KX-TCD307RU
KX-TCA130RU
KX-TCD307RU
KX-TCA130RU
Digital Cordless Phone
RUF-Blue Metic Version
RUS-Silver Version
RUT-Titanium Black Version
(for Russia)
Telephone Equipment
ORDER NO. KM40501589CE
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1. Suggested PbF Solder
4
1.2. How to Recognize that Pb Free Solder is Used
5
2 FOR SERVICE TECHNICIANS
6
3 CAUTION
6
4 BATTERY
7
4.1. Battery Installation
7
4.2. Battery Charge
7
4.3. Battery Life
7
4.4. Battery Replacement
8
5 LOCATION OF CONTROLS
9
5.1. Base Unit
9
5.2. Handset
9
6 SETTINGS
11
6.1. Connections
12
6.2. Guide to Settings
13
6.3. Ringer Volume
14
6.4. Night Mode
15
6.5. PIN Code
16
6.6. Reset
17
6.7. Key Lock
19
6.8. R Button to Use the Recall Feature
19
6.9. Pause Button for PBX/Long Distance Service Users
19
6.10. Setting Call Restriction
19
6.11. Turning Call BAR On/Off (Call Prohibition)
20
6.12. Changing the Display Language
20
6.13. Changing the Recall Time
20
6.14. Setting Dialling Mode (tone/pulse)
21
6.15. ARS (Automatic Route Selection)
22
7 DISPLAY
24
7.1. Display Icons
24
7.2. Menu Icons
24
7.3. AOH and Caller ID Display
24
7.4. Screen Saver Mode
25
8 OPERATIONS
26
8.1. Turning the Power On/Off
26
8.2. Setting the Date and Time
26
8.3. Redialling
26
8.4. Phonebook
27
8.5. Registering a Handset to a Base Unit
31
8.6. Selecting a Base Unit
32
9 TROUBLESHOOTING
33
10 DISASSEMBLY INSTRUCTIONS
35
10.1. Base Unit
35
10.2. Handset
36
10.3. Charger Unit
37
11 ASSEMBLY INSTRUCTIONS
38
11.1. Fix the LCD to the Main P.C.Board (Handset)
38
12 TROUBLESHOOTING FLOWCHART
39
12.1. Check Power
40
12.2. Check Battery Charge
41
12.3. Check Link
42
12.4. Check Handset Transmission
46
12.5. Check Handset Reception
46
12.6. Check Caller ID
46
12.7. Bell Reception
47
13 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
48
13.1. Check Point (Base Unit)
48
13.2. The Setting Method of JIG (Base Unit)
52
13.3. Adjustment Standard (Base Unit)
53
13.4. Check Point (Charger Unit)
54
13.5. Adjustment Standard (Charger Unit)
54
14 TROUBLESHOOTING BY SYMPTOM (HANDSET)
55
14.1. Check Point (Handset)
55
14.2. Troubleshooting for Speakerphone
58
14.3. The Setting Method of JIG (Handset)
59
14.4. Adjustment Standard (Handset)
60
15 THINGS TO DO AFTER REPLACING IC
61
15.1. Base Unit
61
15.2. Handset
61
16 RF SPECIFICATION
62
16.1. Base Unit
62
16.2. Handset
62
Note:
Because CONTENTS 4 to 10 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page
Page
2
KX-TCD305RU / KX-TCD307R U / KX-TCA130RU
17 HOW TO CHECK THE HANDSET SPEAKER OR RECEIVER 63
18 FREQUENCY TABLE (MHz)
63
19 BLOCK DIAGRAM (BASE UNIT)
64
20 CIRCUIT OPERATION (BASE UNIT)
65
20.1. Outline
65
20.2. Power Supply Circuit
66
20.3. Telephone Line Interface
67
20.4. Transmitter/Receiver
67
20.5. Pulse Dialling
67
21 BLOCK DIAGRAM (HANDSET)
68
22 CIRCUIT OPERATION (HANDSET)
69
22.1. Outline
69
22.2. Power Supply Circuit/Reset Circuit
69
22.3. Charge Circuit
69
22.4. Battery Low/Power Down Detector
69
22.5. Speakerphone
69
23 CIRCUIT OPERATION (CHARGER UNIT)
70
23.1. Power Supply Circuit
70
24 SIGNAL ROUTE
71
25 CPU DATA (BASE UNIT)
72
25.1. IC8 (BBIC)
72
26 CPU DATA (HANDSET)
74
26.1. IC1 (BBIC)
74
27 ENGINEERING MODE
76
27.1. Base Unit
76
27.2. Handset
79
28 EEPROM LAYOUT (BASE UNIT)
81
28.1. Scope
81
28.2. Introduction
81
28.3. EEPROM Layout
81
29 EEPROM LAYOUT (HANDSET)
86
29.1. Scope
86
29.2. Introduction
86
29.3. EEPROM contents
86
30 HOW TO REPLACE FLAT PACKAGE IC
89
30.1. PREPARATION
89
30.2. FLAT PACKAGE IC REMOVALPROCEDURE
89
30.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
90
30.4. BRIDGE MODIFICATION PROCEDURE
90
31 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
91
32 CABINET AND ELECTRICAL PARTS LOCATION (HANDSET)92
33 CABINET AND ELECTRICAL PARTS LOCATION (CHARGER
UNIT)
93
34 ACCESSORIES AND PACKING MATERIALS
94
34.1. KX-TCD305RUF/RUS/RUT
94
34.2. KX-TCD307RUS/RUT
95
34.3. KX-TCA130RUF/RUS/RUT
96
35 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
97
35.1. Base Unit
97
35.2. Handset
97
35.3. Charger Unit
97
36 REPLACEMENT PARTS LIST
98
36.1. Base Unit
98
36.2. Handset
100
36.3. Charger Unit
101
36.4. Accessories and Packing Materials
102
36.5. Fixtures and Tools
102
37 FOR SCHEMATIC DIAGRAM
103
37.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
103
37.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
103
37.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
103
38 SCHEMATIC DIAGRAM (BASE UNIT)
104
39 SCHEMATIC DIAGRAM (HANDSET)
106
40 SCHEMATIC DIAGRAM (CHARGER UNIT)
108
41 CIRCUIT BOARD (BASE UNIT)
109
41.1. Component View
109
41.2. Flow Solder Side View
110
42 CIRCUIT BOARD (HANDSET)
111
42.1. Component View
111
42.2. Flow Solder Side View
112
43 CIRCUIT BOARD (CHARGER UNIT)
113
43.1. Component View
113
43.2. Flow Solder Side View
113
3
KX-TCD305RU / KX-TCD307R U / KX-TCA130RU
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
•
PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
•
•
•
•
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
•
•
•
•
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
•
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD305RU / KX-TCD307R U / KX-TCA130RU
