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DMD chip, FM-PCB and TIR prism Replacing Procedure
DMD chip, FM-PCB and TIR prism Replacing Procedure
8
1. 2. FM-PCB mounting
Heat dissipation compound :
Shin-Etsu Silicone [ G-776 ] grade 0.05g
Apply heat dissipation compound
DMD heatsink type
DMD radiator pump type
2) Clean up on the rear of the DMD chip
t Remove the old heat dissipantion compound on the rear
surface of the DMD chip cleanly.
1. Preparation
1) DMD heatsink or DMD radiator pump preparation
t Remove the old heat dissipantion punpound on the rear
surface of DMD heatsink or DMD radiator pump and apply
new one evenly.
t Take care that compound does not stick out.
Interposer
Remove the
remaining com-
pound cleanly.
Caution!
Do not touch the part of the metal pin on the interposer and the
contact part on the FM-PCB. Cause the poor contact outbreak
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