KX-TDE600UC - Panasonic PBX Service Manual (repair manual). Page 2

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KX-TDE600UC
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precautions -----------------------------------------------4
1.1. For Service Technicians  ---------------------------------4
1.2. Insulation Resistance Test -------------------------------4
2 Warning --------------------------------------------------------------4
2.1. Battery Caution ---------------------------------------------4
2.2. Caution--------------------------------------------------------4
2.3. Discarding of P. C. Board --------------------------------4
2.4. About Lead Free Solder (PbF: Pb free) --------------5
2.4.1. Suggested PbF Solder -------------------------------5
3 Specifications ------------------------------------------------------6
3.1. General Description ---------------------------------------6
3.2. Characteristics ----------------------------------------------6
4 Technical Descriptions------------------------------------------7
4.1. IPCEMPR Block Diagram --------------------------------7
4.2. IPCEMPR Card Circuit Operation ------------------- 11
4.2.1. IPCEMPR Card -------------------------------------- 11
4.2.2. Description of Each Part--------------------------- 12
4.2.3. Circuit Description----------------------------------- 13
4.3. Back Board Circuit Operation ------------------------- 16
4.4. Outline ------------------------------------------------------ 17
4.4.1. General Description--------------------------------- 17
4.4.2. IPCEMPR Card -------------------------------------- 17
4.4.3. Back Board-------------------------------------------- 17
4.4.4. Power Supply Unit ---------------------------------- 17
4.4.5. System Control--------------------------------------- 18
4.4.6. Back Board Signal Connection Diagram ------ 21
5 Location of Controls and Components------------------ 24
5.1. Name and Locations ------------------------------------ 24
6 Installation Instructions--------------------------------------- 25
6.1. System Construction ------------------------------------ 25
6.1.1. Basic System ----------------------------------------- 25
6.2. System Overview----------------------------------------- 29
6.2.1. System Configurations ----------------------------- 29
6.2.2. System Connection Diagram --------------------- 30
6.2.3. System Components ------------------------------- 32
6.2.4. System Capacity------------------------------------- 34
7 Test Mode---------------------------------------------------------- 38
7.1. Utility--------------------------------------------------------- 38
7.1.1. Utility-Diagnosis-------------------------------------- 38
8 Troubleshooting Guide---------------------------------------- 50
8.1. IPCEMPR Card------------------------------------------- 50
8.1.1. Startup-------------------------------------------------- 50
8.1.2. Phone Call -------------------------------------------- 58
8.1.3. Paging-------------------------------------------------- 59
8.1.4. Using MOH-------------------------------------------- 63
8.1.5. LAN ----------------------------------------------------- 66
8.1.6. SVM----------------------------------------------------- 67
8.1.7. RS-232C----------------------------------------------- 68
8.1.8. SD card IF--------------------------------------------- 69
8.1.9. Other---------------------------------------------------- 70
8.1.10. BUS-M Card ------------------------------------------ 71
8.2. MEC Card -------------------------------------------------- 72
9 Service Fixture & Tools --------------------------------------- 73
9.1. Extension Boards for Servicing----------------------- 73
10 Disassembly and Assembly Instructions--------------- 74
10.1. IPCEMPR Card------------------------------------------- 74
10.2. Back Board ------------------------------------------------ 75
11 Miscellaneous ---------------------------------------------------- 77
11.1. How To Replace a Flat Package IC----------------- 77
11.1.1. Preparation ------------------------------------------- 77
11.1.2. Removal Procedure -------------------------------- 77
11.1.3. Procedure--------------------------------------------- 77
11.1.4. Removing Solder From Between Pins--------- 77
11.2. How to Replace the LLP (Leadless Leadframe
Package) IC and IC ground plate-------------------- 78
11.2.1. Preparation ------------------------------------------- 78
11.2.2. Caution ------------------------------------------------ 78
11.2.3. How to Remove the IC ---------------------------- 78
11.2.4. How to Install the IC-------------------------------- 78
11.2.5. How to Remove a Solder Bridge---------------- 79
11.3. Terminal Guide of the ICs Transistors and
Diodes ------------------------------------------------------ 80
11.4. memo ------------------------------------------------------- 81
12 Schematic Diagram -------------------------------------------- 82
12.1. Block Diagram -------------------------------------------- 82
12.2. IPCEMPR Card No.1 ----------------------------------- 84
12.3. IPCEMPR Card No.2 ----------------------------------- 86
12.4. IPCEMPR Card No.3 ----------------------------------- 88
12.5. IPCEMPR Card No.4 ----------------------------------- 90
12.6. IPCEMPR Card No.5 ----------------------------------- 92
12.7. IPCEMPR Card No.6 ----------------------------------- 94
12.8. IPCEMPR Card No.7 ----------------------------------- 96
12.9. IPCEMPR Card No.8 ----------------------------------- 98
12.10. IPCEMPR Card No.9 ----------------------------------100
12.11. IPCEMPR Card No.10 --------------------------------102
12.12. IPCEMPR Card No.11---------------------------------104
12.13. IPCEMPR Card No.12 --------------------------------106
12.14. IPCEMPR Card No.13 --------------------------------108
12.15. IPCEMPR Card No.14 -------------------------------- 110
12.16. IPCEMPR Card No.15 -------------------------------- 112
12.17. IPCEMPR Card No.16 -------------------------------- 114
12.18. Memo ------------------------------------------------------ 115
12.19. BB-B1 (Back) Board No.1 ---------------------------- 116
12.20. BB-B1 (LED) Board No.2 ----------------------------- 118
12.21. BB-B2 Board---------------------------------------------120
12.22. Memo ------------------------------------------------------121
12.23. MEC Card ------------------------------------------------ 122
12.24. Waveform-------------------------------------------------124
13 Printed Circuit Board-----------------------------------------126
13.1. IPCEMPR Card -----------------------------------------126
13.1.1. Component View-----------------------------------126
13.1.2. Flow Solder Side View----------------------------127
13.2. BB-B1 (Back/LED) Board-----------------------------128
13.2.1. Component View-----------------------------------128
13.3. BB-B2 Board---------------------------------------------129
13.3.1. Component View-----------------------------------129
13.4. MEC Card ------------------------------------------------ 130
13.4.1. Component View-----------------------------------130
13.4.2. Flow Solder Side View----------------------------130
14 Appendix Information of Schematic Diagram -------131
15 Exploded View and Replacement Parts List----------132
15.1. IC Data ----------------------------------------------------132
15.1.1. IC101--------------------------------------------------132
15.2. Cabinet and Electric Parts----------------------------140
15.3. Accessories and Packing Materials----------------142
15.4. Replacement Parts List ------------------------------- 143
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