47LN549E, 47LP620H (CHASSIS:LB3AZ) - LG TV Service Manual (repair manual)

Model
47LN549E 47LP620H (CHASSIS:LB3AZ)
Pages
40
Size
5.39 MB
Type
PDF
Document
Service Manual
Brand
Device
TV / LCD
File
47ln549e-47lp620h-chassis-lb3az.pdf
Date

View LG 47LN549E / 47LP620H (CHASSIS:LB3AZ) Service Manual online

P/NO : MFL67715812 (1306-REV00)
CHASSIS : LB3AZ
MODEL : 47LP620H   
47LP620H-TA
47LN549E   
47LN549E-TA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TV
SERVICE MANUAL
- 2 -
CONTENTS
CONTENTS  .............................................................................................. 2
SAFETY PRECAUTIONS  ........................................................................ 3
SERVICING PRECAUTIONS  ................................................................... 4
SPECIFICATION  ...................................................................................... 6
ADJUSTMENT INSTRUCTION  ............................................................. 10
TROUBLESHOOTING GUIDE ................................................................ 15
BLOCK DIAGRAM  ................................................................................. 21
EXPLODED VIEW  .................................................................................. 22
SCHEMATIC CIRCUIT DIAGRAM  ..............................................................
- 3 -
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by      in the 
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent 
Shock, Fire, or other Hazards. 
Do not modify the original design without permission of manufacturer.
General Guidance
An 
isolation  Transformer  should  always  be  used  during  the 
servicing of a receiver whose chassis is not isolated from the AC 
power  line.  Use  a  transformer  of  adequate  power  rating  as  this 
protects  the  technician  from  accidents  resulting  in  personal  injury 
from electrical shocks.
It  will  also  protect  the  receiver  and  it's  components  from  being 
damaged  by  accidental  shorts  of  the  circuitry  that  may  be 
inadvertently introduced during the service operation.
If  any  fuse  (or  Fusible  Resistor)  in  this  TV  receiver  is  blown, 
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, 
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer, 
Always  perform  an 
AC  leakage  current  check  on  the  exposed 
metallic parts of the cabinet, such as antennas, terminals, etc., to 
be  sure  the  set  is  safe  to  operate  without  damage  of  electrical 
shock. 
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an 
electrical  jumper  across  the  two AC  plug  prongs.  Place  the AC 
switch in the on position, connect one lead of ohm-meter to the AC 
plug prongs tied together and touch other ohm-meter lead in turn to 
each  exposed  metallic  parts  such  as  antenna  terminals,  phone 
jacks, etc. 
If  the  exposed  metallic  part  has  a  return  path  to  the  chassis,  the 
measured resistance should be between 1 MΩ and 5.2 MΩ. 
When  the  exposed  metal  has  no  return  path  to  the  chassis  the 
reading must be infinite.
An  other  abnormality  exists  that  must  be  corrected  before  the 
receiver is returned to the customer.
Leakage Current Hot Check 
(See below Figure) 
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. 
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor 
between  a  known  good  earth  ground  (Water  Pipe,  Conduit,  etc.) 
and the exposed metallic parts.
Measure  the AC  voltage  across  the  resistor  using AC  voltmeter 
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage 
measurements  for  each  exposed  metallic  part.  Any  voltage 
measured must not exceed 0.75 volt RMS which is corresponds to 
0.5 mA.
In  case  any  measurement  is  out  of  the  limits  specified,  there  is 
possibility  of  shock  hazard  and  the  set  must  be  checked  and 
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS
- 4 -
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service 
manual and its supplements and addenda, read and follow the 
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the 
following servicing precautions and any of the safety precautions 
on page 3 of this publication, always follow the safety precau-
tions. Remember: Safety First.
General Servicing Precautions
1.  Always unplug the receiver AC power cord from the AC power 
source before;
a.  Removing or reinstalling any component, circuit board 
module or any other receiver assembly.
b.  Disconnecting or reconnecting any receiver electrical plug 
or other electrical connection.
c.  Connecting a test substitute in parallel with an electrolytic 
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity 
installation of electrolytic capacitors may result in an explo-
sion hazard.
2.  Test high voltage only by measuring it with an appropriate 
high voltage meter or other voltage measuring device (DVM, 
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3.  Do not spray chemicals on or near this receiver or any of its 
assemblies.
4.  Unless specified otherwise in this service manual, clean 
electrical contacts only by applying the following mixture to the 
contacts with a pipe cleaner, cotton-tipped stick or comparable 
non-abrasive applicator; 10 % (by volume) Acetone and 90 % 
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication 
of contacts in not required.
5.  Do not defeat any plug/socket B+ voltage interlocks with which 
receivers covered by this service manual might be equipped.
6.  Do not apply AC power to this instrument and/or any of its 
electrical assemblies unless all solid-state device heat sinks 
are correctly installed.
7.  Always connect the test receiver ground lead to the receiver 
chassis ground before connecting the test receiver positive 
lead.
Always remove the test receiver ground lead last.
8.  Use with this receiver only the test fixtures specified in this 
service manual.
CAUTION: Do not connect the test fixture ground strap to any 
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called 
Electrostatically Sensitive (ES) Devices. Examples of typical ES 
devices are integrated circuits and some field-effect transistors 
and semiconductor “chip” components. The following techniques 
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1.  Immediately before handling any semiconductor component or 
semiconductor-equipped assembly, drain off any electrostatic 
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent 
potential shock reasons prior to applying power to the unit 
under test.
2.  After removing an electrical assembly equipped with ES 
devices, place the assembly on a conductive surface such as 
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3.  Use only a grounded-tip soldering iron to solder or unsolder 
ES devices.
4.  Use only an anti-static type solder removal device. Some sol-
der removal devices not classified as “anti-static” can generate 
electrical charges sufficient to damage ES devices.
5.  Do not use freon-propelled chemicals. These can generate 
electrical charges sufficient to damage ES devices.
6.  Do not remove a replacement ES device from its protective 
package until immediately before you are ready to install it. 
(Most replacement ES devices are packaged with leads elec-
trically shorted together by conductive foam, aluminum foil or 
comparable conductive material).
7.  Immediately before removing the protective material from the 
leads of a replacement ES device, touch the protective mate-
rial to the chassis or circuit assembly into which the device will 
be installed.
CAUTION: Be sure no power is applied to the chassis or cir-
cuit, and observe all other safety precautions.
8.  Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the 
brushing together of your clothes fabric or the lifting  of your 
foot from a carpeted floor can generate static electricity suf-
ficient to damage an ES device.)
General Soldering Guidelines
1.  Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within 
the range or 500 °F to 600 °F.
2.  Use an appropriate gauge of RMA resin-core solder composed 
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4.  Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5.  Use the following unsoldering technique
a.  Allow the soldering iron tip to reach normal temperature. 
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c.  Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit 
board printed foil.
6.  Use the following soldering technique.
a.  Allow the soldering iron tip to reach a normal temperature 
(500 °F to 600 °F)
b.  First, hold the soldering iron tip and solder the strand 
against the component lead until the solder melts.
c.  Quickly move the soldering iron tip to the junction of the 
component lead and the printed circuit foil, and hold it there 
only until the solder flows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit 
board printed foil.
d.  Closely inspect the solder area and remove any excess or 
splashed solder with a small wire-bristle brush.
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through 
which the IC leads are inserted and then bent flat against the cir-
cuit foil. When holes are the slotted type, the following technique 
should be used to remove and replace the IC. When working with 
boards using the familiar round hole, use the standard technique 
as outlined in paragraphs 5 and 6 above.
Removal
1.  Desolder and straighten each IC lead in one operation by 
gently prying up on the lead with the soldering iron tip as the 
solder melts.
2.  Draw away the melted solder with an anti-static suction-type 
solder removal device (or with solder braid) before removing 
the IC.
Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and 
solder it.
3.  Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close 
as possible to the component body.
2.  Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding 
leads extending from the circuit board and crimp the "U" with 
long nose pliers to insure metal to metal contact then solder 
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit 
board.
4.  Insert new transistor in the circuit board.
5.  Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.
Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2.  Bend the two remaining leads perpendicular y to the circuit 
board.
3.  Observing diode polarity, wrap each lead of the new diode 
around the corresponding lead on the circuit board.
4.  Securely crimp each connection and solder it.
5.  Inspect (on the circuit board copper side) the solder joints of 
the two "original" leads. If they are not shiny, reheat them and 
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow 
stake.
2.  Securely crimp the leads of replacement component around 
notch at stake top.
3.  Solder the connections.
CAUTION: Maintain original spacing between the replaced 
component and adjacent components and the circuit board to 
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit 
board will weaken the adhesive that bonds the foil to the circuit 
board causing the foil to separate from or "lift-off" the board. The 
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the 
following procedure to install a jumper wire on the copper pattern 
side of the circuit board. (Use this technique only on IC connec-
tions).
1.  Carefully remove the damaged copper pattern with a sharp 
knife. (Remove only as much copper as absolutely necessary).
2.  Carefully scratch away the solder resist and acrylic coating (if 
used) from the end of the remaining copper pattern.
3.  Bend a small "U" in one end of a small gauge jumper wire and 
carefully crimp it around the IC pin. Solder the IC connection.
4.  Route the jumper wire along the path of the out-away copper 
pattern and let it overlap the previously scraped end of the 
good copper pattern. Solder the overlapped area and clip off 
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern 
at connections other than IC Pins. This technique involves the 
installation of a jumper wire on the component side of the circuit 
board.
1.  Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous 
condition will not exist if the jumper wire opens.
2.  Trace along the copper pattern from both sides of the pattern 
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3.  Connect insulated 20-gauge jumper wire from the lead of the 
nearest component on one side of the pattern break to the 
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the 
it does not touch components or sharp edges.
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This  specification  is  applied  to  the  LCD  TV  used  LB3AZ 
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4)  Specification and performance of each parts are followed 
each  drawing  and  specification  by  part  number  in 
accordance with BOM.
(5)  The receiver must be operated for about 5 minutes prior to 
the adjustment.
3. Test method
(1) Performance: LGE TV test method followed 
(2) Demanded other specification 
- Safety : CE, IEC specification
- EMC : CE, IEC 
4. Model General Specification
No.
Item
Specification
Remarks
1
Market
Australia, New Zealand, Singapore,
Malaysia, Vietnam, Indonesia, 
► Only Analog for A-ASIA
2.
Broadcasting system
1) PAL/SECAM-B/G/D/K
2) PAL-I
3) NTSC-M
4) DVB-T
5) DVB-C
► PAL
3
Receiving system
Analog : Upper Heterodyne
Digital : COFDM(DVB-T)
► DVB-T
- Guard Interval(Bitrate_Mbit/s)
  1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
  QPSK    :  1/2, 2/3, 3/4, 5/6, 7/8
  16-QAM  :  1/2, 2/3, 3/4, 5/6, 7/8
  64-QAM  :  1/2, 2/3, 3/4, 5/6, 7/8
► DVB-C
- Symbol rate : 4.0Msymbols/s to 7.2Msymbols/s
- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM
4
Scart Jack
PAL, SECAM, NTSC
► Spec Out
5
Component Input
Y/Cb/Cr, Y/Pb/Pr
6
RGB Input
RGB-PC
► Analog(D-SUB 15PIN)
7
HDMI Input (3EA)
HDMI1-DTV/DVI
HDMI2-DTV
HDMI3-DTV
► PC
-. HD Model : HDMI version 0.7
-. FHD Model : HDMI version 0.7
► Support HDCP
► The number of Input ports is different by model.
8
Audio Input (1EA)
RGB/DVI Audio
AV
► Common Port in AV & PC input.
9.
SDPIF out
S
10
Earphone out (1EA)
Antenna, AV1, AV2, Component, RGB,
HDMI1, HDMI2, HDMI3
11
USB (1EA)
For My Media(Movie/Photo/Music List)
or For SVC
► JPEG, MP3, DivX HD
12
USB (1EA)
For Wireless dongle
► Only for EzSign TV(32/42/47/55/60LN549E-TA)
13
External Speaker
Max 1W @ 8 ohm
► Stereo ,SE output
14
RS232C(1EA)
Interactive mode support
- 7 -
5. Supported video resolutions (2D)
5.1. Component Input (Y, C
B
/P
B
, C
R
/P
R
)
5.2. RGB Input (PC)
No.
Resolution
H-freq(kHz)
V-freq(Hz)
Pixel clock(MHz)
Proposed
1
720*480
15.73
60.00
13.5135
SDTV ,DVD 480I
2
720*480
15.73
59.94
13.50
SDTV ,DVD 480I
3
720*480
31.50
60.00
27.027
SDTV 480P
4
720*480
31.47
59.94
27.00
SDTV 480P
5
1280*720
45.00
60.00
74.25
HDTV 720P
6
1280*720
44.96
59.94
74.176
HDTV 720P
7
1920*1080
33.75
60.00
74.25
HDTV 1080I
8
1920*1080
33.72
59.94
74.176
HDTV 1080I
9
1920*1080
67.50
60.00
148.50
HDTV 1080P
10
1920*1080
67.432
59.94
148.352
HDTV 1080P
11
1920*1080
27.00
24.00
74.25
HDTV 1080P
12
1920*1080
26.97
23.94
74.176
HDTV 1080P
13
1920*1080
33.75
30.00
74.25
HDTV 1080P
14
1920*1080
33.71
29.97
74.176
HDTV 1080P
No.
Resolution
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
Proposed
DDC
1
640*350
31.468
70.09
25.17
EGA
X
2
720*400
31.469
70.08
28.32
DOS
O
3
640*480
31.469
59.94
25.17
VESA(VGA)
O
4
800*600
37.879
60.31
40.00
VESA(SVGA)
O
5
1024*768
48.363
60.00
65.00
VESA(XGA)
O
6
1280*768
47.776
59.870
79.50
CVT(WXGA)
X
7
1360*768
47.712
60.015
85.50
VESA (WXGA)
X
8
1280*1024
63.981
60.020
108.0
VESA (SXGA)
O
9
1600*1200
75.00
60.00
162.0
VESA (UXGA)
X
10
1920*1080
66.587
59.934
138.5
HDTV 1080P
O
- 8 -
5.3. HDMI Input(PC/DTV)
No.
Resolution
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
Proposed
Remark
PC(DVI)
DDC
1
640*350
31.468
70.09
25.17
EGA
X
2
720*400
31.469
70.08
28.32
DOS
O
3
640*480
31.469
59.94
25.17
VESA(VGA)
O
4
800*600
37.879
60.31
40.00
VESA(SVGA)
O
5
1024*768
48.363
60.00
65.00
VESA(XGA)
O
6
1280*768
47.776
59.870
79.50
CVT(WXGA)
Х
7
1360*768
47.712
60.015
85.50
VESA (WXGA)
O
8
1280*1024
63.981
60.020
108.0
VESA (SXGA)
O
9
1600*1200
75.00
60.00
162.0
VESA (UXGA)
X
10
1920*1080
67.50
60.00
148.5
HDTV 1080P
O
DTV
1
720*480
31.50
60.00
27.027
SDTV 480P
2
720*480
31.47
59.94
27.00
SDTV 480P
3
1280*720
45.00
60.00
74.25
HDTV 720P
4
1280*720
44.96
59.94
74.176
HDTV 720P
5
1920*1080
33.75
60.00
74.25
HDTV 1080I
6
1920*1080
33.72
59.94
74.176
HDTV 1080I
7
1920*1080
67.50
60.00
148.50
HDTV 1080P
8
1920*1080
67.432
59.94
148.352
HDTV 1080P
9
1920*1080
27.00
24.00
74.25
HDTV 1080P
10
1920*1080
26.97
23.976
74.176
HDTV 1080P
11
1920*1080
33.75
30.00
74.25
HDTV 1080P
- 9 -
ADJUSTMENT INSTRUCTION
1. Application Range
This  specification  sheet  is  applied  to  all  of  the  LCD TV  with 
LB3AZ chassis.
2. Designation
(1)  The  adjustment  is  according  to  the  order  which  is 
designated and which must be followed, according to the 
plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation : Above 5 Minutes (Heat Run)
  Temperature : at 25 °C ± 5 °C
  Relative humidity : 65 ± 10 %
  Input voltage : 220 V, 60 Hz
(6)  Adjustment  equipments:  Color  Analyzer  (CA-210  or 
CA-110), DDC Adjustment Jig, Service remote control.
(7) Push the "IN STOP" key - For memory initialization.
3. Main PCB check process
▪ APC - After Manual-Insert, executing APC
* Boot file Download
(1)  Execute  ISP  program  "Mstar  ISP  Utility"  and  then  click 
"Config" tab.
(2)  Set as below, and then click "Auto Detect" and check "OK" 
message.
If "Error" is displayed, check connection between computer, 
jig, and set.
(3)  Click  "Read"  tab,  and  then  load  download  file(XXXX.bin) 
by clicking "Read".
(4)  Click "Connect" tab. If "Can't" is displayed, check connection 
between computer, jig, and set.
(5) Click "Auto" tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.
* USB DOWNLOAD
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
-  If your downloaded program version in USB Stick is Low, 
it didn't work. But your downloaded version is High, USB 
data is automatically detecting.
(3) Show the message "Copying files from memory".
(4) Updating is starting.
(5) Updating Completed, The TV will restart automatically.
(6)  If  your TV  is  turned  on,  check  your  updated  version  and 
Tool option. (explain the Tool option, next stage)
*  If downloading version is more high than your TV have, TV 
can lost all channel data. In this case, you have to channel 
recover. if all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
 
(1) 
 
filexxx.bin
(4) 
 
(5)
(6)
(7)...........OK
filexxx.bin
 
(2) 
 
(3) 
 
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
Case1 : Software version up
1.  After downloading S/W by USB , TV set will reboot 
automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1.  When TV set is entering on the assembly line, Push 
“In-stop” key at first.
2. Push “Power on” key for turning it on.
→  If you push “Power on” key, TV set will recover 
channel information by itself.
3. After function inspection, Push “In-stop” key.
- 10 -
* After downloading, have to adjust Tool Option again.
(1) Push "IN-START" key in service remote control.
(2) Select "Tool Option 1" and push "OK" key.
(3) Punch in the number. (Each model has their number)
3.1. ADC Process
(1) ADC
- Enter Service Mode by pushing "ADJ" key,
Calibration".
<Caution>  Using  "P-ONLY"  key  of  the Adjustment  remote 
control, power on TV.
If there is no Component Input, disappear “ADC Comp” message.
* ADC Calibration Protocol (RS232)
Adjust Sequence
▪ aa 00 00 [Enter Adjust Mode]
▪ xb 00 40 [Component1 Input (480i)]
▪ ad 00 10 [Adjust 480i Comp1]
▪ xb 00 60 [RGB Input (1024*768)]
▪ ad 00 10 [Adjust 1024*768 RGB]
▪ aa 00 90 End Adjust mode
* Required equipment : Adjustment remote control.
3.2. Function Check
3.2.1. Check display and sound 
■ Check Input and Signal items. (cf. work instructions) 
1. TV
2. AV
3. COMPONENT (480i)
4. RGB (PC : 1024 x 768 @ 60hz)
5. HDMI
6. PC Audio In 
* Display and Sound check is executed by Remote controller
Caution :  Not to push the INSTOP key after completion if the 
function inspection.
4. Total Assembly line process
4.1. Adjustment Preparation
▪ W/B Equipment condition
CA210
: CCFL/EEFL -> CH9, Test signal: Inner pattern(80IRE)
  LED -> CH14, Test signal: Inner pattern(80IRE)
▪  Above 5 minutes H/run in the inner pattern. (“power on” key 
of adjust remote control)
▪  Edge  LED  W/B Table  in  process  of  aging  time  (Only  LGD 
Edge LED Module except AUO, CMI, IPS Module) 
  CA210 : CH 14, Test signal : Inner pattern (80IRE)
Normal line
* Check the Table Data and the Spec after H/R
Aging chamber
* Check the Table Data and the Spec after H/R
NO
Item
CMD 1 CMD 2 Data 0
Enter Adjust 
MODE
Adjust 
‘Mode In’
A
A
0
0 When transfer the  ‘Mode In’, 
Carry the command.
ADC adjust ADC Adjust
A
D
1
0 Automatically adjustment
(The use of a internal pattern)
Mode
Temp
Coordinate spec
Cool
13,000 K
X=0.271 (±0.002)
Y=0.270 (±0.002)
<Test Signal>
Inner pattern
(204gray,
80IRE)
Medium
9,300 K
X=0.285 (±0.002)
Y=0.293 (±0.002)
Warm
6,500 K
X=0.310 (±0.002)
Y=0.325 (±0.002)
NC4.0
Aging 
time
(Min)
Cool
Medium
Warm
X
y
x
y
x
y
271
270
285
293
313
329
1
0-2
281 
287 
295
310
320
342
2
3-5
280 
285 
294
308
319
340
3
6-9
278 
284 
292
307
317
339
4
10-19
276 
281 
290
304
315
336
5
20-35
275 
277 
289
300
314
332
6
36-49
274 
274 
288
297
313
329
7
50-79
273 
272 
287
295
312
327
8
80-119
272 
271 
286
294
311
326
9
Over 120
271 
270 
285
293
310
325
NC4.0
Aging 
time
(Min)
Cool
Medium
Warm
X
y
x
y
x
y
271
270
285
293
313
329
1
0-5
280 
285 
294
308
319
340
2
6-10
276 
280 
290 
303 
315 
335 
3
11-20
272 
275 
286 
298 
311 
330 
4
21-30
269 
272 
283 
295 
308 
327 
5
31-40
267 
268 
281 
291 
306 
323 
6
41-50
266 
265 
280 
288 
305 
320 
7
51-80
265 
263 
279 
286 
304 
318 
8
81-119
264 
261 
278 
284 
303 
316 
9
Over 120
264 
260 
278 
283 
303 
315 
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option Commercial
6. Country Group
7. Area Option
8. ADC Calibration   
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L
13. Sub B/C
14. Ext. Input Adjust
ADC Calibration
ADC Comp 480i
ADC Comp 1080p
ADC RGB
Start
NG
NG
NG
Reset

Download LG 47LN549E / 47LP620H (CHASSIS:LB3AZ) Service Manual (Repair Manual)

Here you can view online and download LG 47LN549E / 47LP620H (CHASSIS:LB3AZ) Service Manual in PDF. 47LN549E / 47LP620H (CHASSIS:LB3AZ) service manual will guide through the process and help you recover, restore, fix, disassemble and repair LG 47LN549E / 47LP620H (CHASSIS:LB3AZ) LCD. Information contained in service manuals typically includes schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb.