Read Harman Kardon HK 3700 (serv.man4) EMC - CB Certificate online
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Report No 248608.
IEC 60065
Clause
Requirement + Test
Result - Remark
Verdict
TRF No. IEC60065K
10 Insulation
requirements
10.1
Insulation resistance (MΩ) at least 2 MΩ min. after
surge test for basic and 4 MΩ min. for reinforced
insulation ................................................................. :
surge test for basic and 4 MΩ min. for reinforced
insulation ................................................................. :
Basic: >2.6 MΩ,
Reinforced: >5.2 MΩ after
surge test.
Reinforced: >5.2 MΩ after
surge test.
P
10.2
Humidity treatment 48 h or 120 h .......................... :
Performed for 120 h at temp.
40 ºC and humidity 93 %.
40 ºC and humidity 93 %.
P
10.3
Insulation resistance and dielectric strength between
mains terminals
mains terminals
(see appended table 10.3)
P
Insulation Resistance and dielectric strength across
BASIC or SUPPLEMENTARY insulation (Class I)
BASIC or SUPPLEMENTARY insulation (Class I)
Class II apparatus
N/A
Insulation resistance and dielectric strength across
REINFORCED insulation (Class II)
REINFORCED insulation (Class II)
(see appended table 10.3)
P
11 Fault
conditions
11.1
No shock hazard under fault condition
No electric shock hazard
under fault conditions.
under fault conditions.
P
11.2
Heating under fault condition
(see appended table 11.2)
P
Flames extinguish within 10 seconds
No flames.
P
No hazard from softening solder
No softening solder.
P
Soldered terminations not used as protective
mechanism
mechanism
No soldered terminations.
P
11.2.1
Measurement of temperature rises
(see appended table 11.2)
P
11.2.2
Temperature rise of accessible parts
(see appended table 11.2)
P
11.2.3
Temperature rise of parts, other than windings and
printed boards, providing electrical insulation
printed boards, providing electrical insulation
(see appended table 11.2)
P
11.2.4
Temperature rise of parts acting as a support or
mechanical barrier
mechanical barrier
(see appended table 11.2)
P
11.2.5
Temperature rise of windings
(see appended table 11.2)
P
11.2.6
Temperature rise of printed boards shall not exceed
the limits of table 3 by max. 100 K for max. 5 min
the limits of table 3 by max. 100 K for max. 5 min
No exceeding the limits of
Table 3.
Table 3.
N/A
Printed circuit boards (PCB) classified as V-0
according to 60695-11-10 or Clause G.1 may
exceed the limit in table 3 in case a) and b):
according to 60695-11-10 or Clause G.1 may
exceed the limit in table 3 in case a) and b):
N/A
a) Temperature rise of printed circuit boards
exceeding the limits of table 3 by not more than
100 K for an area not greater than 2 cm² ................ :
exceeding the limits of table 3 by not more than
100 K for an area not greater than 2 cm² ................ :
No area where temperature
exceeds 100 K above limits.
exceeds 100 K above limits.
N/A
b) Temperature rise of printed circuit boards
exceeding the limits of table 3 up to 300 K for an
area not greater than 2 cm² for a maximum of 5 min
exceeding the limits of table 3 up to 300 K for an
area not greater than 2 cm² for a maximum of 5 min
No area where temperature
exceeds 300 K above limits.
exceeds 300 K above limits.
N/A
Meets all the special conditions if conductors on
printed circuit boards are interrupted
printed circuit boards are interrupted
No conductors are
interrupted/peeled/loosened
during fault conditions.
interrupted/peeled/loosened
during fault conditions.
N/A
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