HK 3380 (serv.man10) - Harman Kardon Audio EMC - CB Certificate (repair manual). Page 21

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 - 
IEC 60065, 6th edition : 1998
 - 
- Page 16 of 37 - 
 
 
   
 Order 
No. 
14649
 
 
 
 
 
a) Temperature rise of printed circuit 
boards (PCB) to 20.1.3, exceeding the 
limits of Table 2 by not more than 
100 K for an area not greater than 
2 cm²   
 
 
b) Temperature rise of printed circuit 
boards (PCB) to 20.1.3 up to 300 K for 
an area not greater than 2 cm² for a 
maximum of 5 min   
 
 
Meets all the special conditions if 
conductors on printed circuit boards are 
interrupted  
No conductors are interrupted/peeled/loosened during 
fault conditions 
11.2.4 
Temperature rise of parts acting as a 
support or mechanical barrier   
Temperature rises are within the limits. 
11.2.5 
Temperature rise of windings   
See Fault Condition tests 
11.2.6 
Temperature rise of parts not subject to 
the limits of 11.2.1 to 11.2.5,   
table 2 item e).   
No excessive temperature observed/measured on other 
parts. 
 
 
12 MECHANICAL 
STRENGTH 
 
 
12.1.1 
Bump test (>7kg) 
No damage in the sense of this standard 
12.1.2 
Vibration test (portable, musical 
amplifiers, metal enclosure) 
Assessed to be satisfactory constructed. 
12.1.3 
Impact test (0.5J) 
No damage in the sense of this standard 
12.2 
Fixing of knobs, push buttons, keys and 
levers  
Normal use will not impair the protection against electric 
shock. 
12.3 
Remote controls with hazardous live 
parts  
No remote control containing hazardous live parts 
12.4 
Drawers (pull test 50 N, 10 s)   
No drawers 
12.5 
Antenna coaxial sockets providing 
isolation  
No antenna socket which insolate hazardous live parts 
from accessible parts. 
 
13 
CLEARANCES AND CREEPAGE 
DISTANCES 
 
13.1.1 
Clearances and creepage distances in 
accordance with 13.2 (fig. 9); minimum 
distance    
See 13.2 
 
Reduction applied if the 3 conditions 
are met   
No reduction applied 
 
Reduction applied for Grade 2 winding 
wire  
No 
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