CDX-GT40U, CDX-GT40UW, CDX-GT42UE, CDX-GT44U, CDX-GT45U, CDX-GT47UE - Sony Car Audio Service Manual (repair manual). Page 3

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

NOTE  FOR  REPLACEMENT  OF  THE  SERVO  BOARD
When repairing, the complete SERVO board should be replaced 
since any parts in the SERVO board cannot be repaired.

NOTE  FOR  REPLACEMENT  OF  THE  SENSOR  BOARD
When the SENSOR board is defective, exchange the MECHANI-
CAL BLOCK (Z) ASSY 08 (Former type) or MECHANICAL 
BLOCK (11CA) ASSY (New type).

Note: As for the mechanism deck (MG-101CA-188) carried in this 

unit, component parts have been changed from the midway 
of production. When you perform repair exchange of the 
mechanism deck (MG-101CA-188), refer to “ABOUT THE 
MG-101CA-188 OF FORMER AND NEW” on page 6.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

If the optical pick-up block is defective, please replace the whole 
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical 
pick-up block.

TEST  DISCS
Use following TEST DISC when this unit confi rms the operation 
and checks it.

Part No.

   

Description

3-702-101-01 

DISC (YEDS-18), TEST (for CD)

4-225-203-01 

DISC (PATD-012), TEST (for CD)

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.