Read JBL CS EMC - CB Certificate online
Page 10 of 45
Report No. 703637
IEC
60065
Clause
Requirement – Test
Result - Remark
Verdict
TRF No.: IEC60065F
TRF Originator: ASTA BEAB
a) Temperature rise of printed circuit boards (PCB)
to 20.1.3, exceeding the limits of table 3 by not more
than 100 K for an area not greater than 2 cm²
to 20.1.3, exceeding the limits of table 3 by not more
than 100 K for an area not greater than 2 cm²
N/A
b) Temperature rise of printed circuit boards (PCB)
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
N/A
Meets all the special conditions if conductors on
printed circuit boards are interrupted
printed circuit boards are interrupted
N/A
Class I protective earthing maintained
N/A
11.2.4
Temperature rise of parts acting as a support or
mechanical barrier
mechanical barrier
P
11.2.5
Temperature rise of windings
P
11.2.6 Temperature
rise
of
parts not subject to the limits of
11.2.1 to 11.2.5 Table 3 e) "Other Parts"
P
12 MECHANICAL
STRENGTH
12.1.1
Bump test where mass >7 kg
P
12.1.2
Vibration test (portable, metal, musical amps)
No connection of part, which
might impair safety, can
become loose.
might impair safety, can
become loose.
P
12.1.3
Impact hammer test
P
Steel ball test (for non-ventilated solid areas)
P
12.1.4
Drop test for portable apparatus where mass ≤ 7 kg
N/A
12.1.5
Thermoplastic enclosures stress relief test
N/A
12.2
Fixing of knobs, push buttons, keys and levers
P
12.3
Remote controls with hazardous live parts
N/A
12.4
Drawers (pull test 50 N, 10 s)
N/A
12.5
Antenna coaxial sockets providing isolation
N/A
12.6
Telescoping or rod antennas construction
N/A
12.6.1
Telescoping or rod antennas securement
N/A
Click on the first or last page to see other CS service manuals if exist.