Read Sony CX-LDB75 Service Manual online
SERVICE MANUAL
Sony Corporation
Personal Audio Group
Published by Sony Engineering Corporation
Published by Sony Engineering Corporation
AEP Model
E Model
COMPACT DISC DECK RECEIVER
9-879-582-01
2005C1678-1
© 2005.03
© 2005.03
Ver. 1.0 2005.03
SPECIFICATIONS
CX-LDB75
CX-LDB75 is the Amplifier, CD player, Tape
Deck and Tuner section in XR-DB75.
Deck and Tuner section in XR-DB75.
— Continued on next page —
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM69CV-F4BD81B2
Section
Base Unit Name
BU-F4BD81B2
Optical Pick-up Name
KSM-215CFP/C2NP
TAPE
Model Name Using Similar Mechanism
CX-LMN75
Section
Tape Transport Mechanism Type
CMAL1Z250A
Amplifier section
European model:
DIN power output (rated): 60 + 60 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
80 + 80 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Music power output (reference):
140 + 140 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Other models:
The following measured at 220 – 240 V AC, 50/60 Hz
DIN power output (rated): 60 + 60 W
DIN power output (rated): 60 + 60 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
80 + 80 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Inputs
AUX IN (RCA pin jacks): Sensitivity 1 V,
AUX IN (RCA pin jacks): Sensitivity 1 V,
impedance 47 kilohms
Outputs
PHONES (stereo mini jack):
PHONES (stereo mini jack):
accepts headphones with
an impedance of 32 ohms
or more
an impedance of 32 ohms
or more
SPEAKER:
accepts impedance of
6 ohms
6 ohms
SUB WOOFER OUT:
voltage 1.9 V
CD player section
System
Compact disc and digital
audio system
audio system
Laser Diode Properties
Emission duration:
continuous
Laser Output*:
Less than 44.6
continuous
Laser Output*:
Less than 44.6
µW
* This output is the value measurement at a distance of
200 mm from the objective lens surface on the
Optical Pick-up Block with 7 mm aperture.
Optical Pick-up Block with 7 mm aperture.
Frequency response
20 Hz – 20 kHz
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
100 – 10,000 Hz, using
Sony TYPE I cassettes
Sony TYPE I cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range:
87.5 – 108.0 MHz
(50-kHz step)
(50-kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
2
CX-LDB75
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
AM tuner section
Tuning range
Latin-American model:
Latin-American model:
530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,710 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 10 kHz)
531 – 1,710 kHz
(with the tuning interval
set at 9 kHz)
European model:
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 9 kHz)
Other models:
530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna
AM loop antenna, external
antenna terminal
antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
European model:
European model:
230 V AC, 50/60 Hz
Other models:
120 V, 220 V or
230 – 240 V AC, 50/60 Hz
Adjustable with voltage
selector
230 – 240 V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
European model:
European model:
85 W
0.3 W (in Power Saving
mode)
0.3 W (in Power Saving
mode)
Other models:
85 W
Dimensions (w/h/d) incl. projecting parts and controls
Amplifier/Tuner/Tape/CD section:
Amplifier/Tuner/Tape/CD section:
Approx. 190
× 277 ×
361.4 mm
Mass
Amplifier/Tuner/Tape/CD section:
Amplifier/Tuner/Tape/CD section:
Approx. 6.4 kg
Design and specifications are subject to change
without notice.
without notice.
Standby power consumption: 0.3 W
Halogenated flame retardants are not
used in the certain printed wiring boards.
Lead-free solder is used for soldering
certain parts.
Halogenated flame retardants are not
used in cabinets.
3
CX-LDB75
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
7
3-2.
Side Panel (L) (R), Top Panel, Back Panel ......................
8
3-3.
CD Mechanism Section ...................................................
8
3-4.
Front Panel Section .........................................................
9
3-5.
FRONT Board .................................................................
9
3-6.
Cassette Deck Mechanism ............................................... 10
3-7.
Cassette Panel .................................................................. 10
3-8.
Power Transformer .......................................................... 11
3-9.
MAIN Board Section ....................................................... 11
3-10. CD Mechanism Deck (CDM69CV-F4BD81B2) ............. 12
3-11. Optical Pick-up Section ................................................... 12
3-12. Base Unit (BU-F4BD81B2) ............................................ 13
3-13. BD Board, Optical Pick-up (KSM-215CFP/C2NP) ........ 13
3-14. SW Board, Bracket (Top) Assy ....................................... 14
3-15. CONNECTOR Board ...................................................... 14
3-16. Motor (Stocker) Assy (Stocker)(M761) .......................... 15
3-17. Motor (Roller) Assy (Roller)(M781) ............................... 15
3-18. Motor (Mode) Assy (Mode)(M771) ................................ 16
3-19. Rubber Roller (Slider) Assy ............................................ 16
3-20. Timing Belt (Front/Rear) ................................................. 17
3-21. Cam (Gear) ...................................................................... 17
3-22. SENSOR Board ............................................................... 18
3-11. Optical Pick-up Section ................................................... 12
3-12. Base Unit (BU-F4BD81B2) ............................................ 13
3-13. BD Board, Optical Pick-up (KSM-215CFP/C2NP) ........ 13
3-14. SW Board, Bracket (Top) Assy ....................................... 14
3-15. CONNECTOR Board ...................................................... 14
3-16. Motor (Stocker) Assy (Stocker)(M761) .......................... 15
3-17. Motor (Roller) Assy (Roller)(M781) ............................... 15
3-18. Motor (Mode) Assy (Mode)(M771) ................................ 16
3-19. Rubber Roller (Slider) Assy ............................................ 16
3-20. Timing Belt (Front/Rear) ................................................. 17
3-21. Cam (Gear) ...................................................................... 17
3-22. SENSOR Board ............................................................... 18
4.
ASSEMBLY
4-1.
How to Install the Cam (Eject Lock) ............................... 19
4-2.
How to Install the Cam (Gear) ........................................ 19
4-3.
How to Install the Gear (Mode C) ................................... 20
4-4.
How to Install the Gear (Mode Cam) .............................. 20
4-5.
How to Install the Rotary Encoder (S702),
Gear (Stocker Communication) ....................................... 21
Gear (Stocker Communication) ....................................... 21
4-6.
How to Install the Stocker Assy ...................................... 21
5.
TEST MODE
............................................................... 22
6.
MECHANICAL ADJUSTMENTS
......................... 23
7.
ELECTRICAL ADJUSTMENTS
.......................... 23
8.
DIAGRAMS
................................................................. 27
8-1.
Block Diagram — BD/Changer Section — .................... 28
— MAIN Section — ....................................................... 29
— MAIN Section — ....................................................... 29
8-2.
Printed Wiring Board — BD Section — ......................... 30
8-3.
Schematic Diagram — BD Section — ............................ 31
8-4.
Printed Wiring Boards — Changer Section — ............... 32
8-5.
Schematic Diagram — Changer Section — .................... 33
8-6.
Printed Wiring Board — FRONT Section — .................. 34
8-7.
Schematic Diagram — FRONT Section — .................... 35
8-8.
Printed Wiring Boards — MAIN Section — .................. 36
8-9.
Schematic Diagram — MAIN Section 1 — .................... 37
8-10. Schematic Diagram — MAIN Section 2 — .................... 38
8-11. Schematic Diagram — MAIN Section 3 — .................... 39
8-12. Schematic Diagram — MAIN Section 4 — .................... 40
8-13. Schematic Diagram — MAIN Section 5 — .................... 41
8-14. Schematic Diagram
8-11. Schematic Diagram — MAIN Section 3 — .................... 39
8-12. Schematic Diagram — MAIN Section 4 — .................... 40
8-13. Schematic Diagram — MAIN Section 5 — .................... 41
8-14. Schematic Diagram
— MAIN Section 6/Power Section — ............................ 42
8-15. Printed Wiring Board — Power Section — .................... 43
9.
EXPLODED VIEWS
9-1.
Panel Section ................................................................... 49
9-2.
Front Section ................................................................... 50
9-3.
Chassis Section ................................................................ 51
9-4.
CD Mechanism Deck Section 1
(CDM69CV-F4BD81B2) ................................................ 52
(CDM69CV-F4BD81B2) ................................................ 52
9-5.
CD Mechanism Deck Section 2
(CDM69CV-F4BD81B2) ................................................ 53
(CDM69CV-F4BD81B2) ................................................ 53
9-6.
CD Mechanism Deck Section 3
(CDM69CV-F4BD81B2) ................................................ 54
(CDM69CV-F4BD81B2) ................................................ 54
9-7.
CD Mechanism Deck Section 4
(CDM69CV-F4BD81B2) ................................................ 55
(CDM69CV-F4BD81B2) ................................................ 55
9-8.
CD Mechanism Deck Section 5
(CDM69CV-F4BD81B2) ................................................ 56
(CDM69CV-F4BD81B2) ................................................ 56
9-9.
CD Mechanism Deck Section 6
(CDM69CV-F4BD81B2) ................................................ 57
(CDM69CV-F4BD81B2) ................................................ 57
9-10. CD Mechanism Deck Section 7
(CDM69CV-F4BD81B2) ................................................ 58
9-11. Optical Pick-up Section ................................................... 59
10. ELECTRICAL PARTS LIST
.................................. 60
4
CX-LDB75
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
that the S curve waveforms is output three times.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270
°
C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on the
exterior.
The CLASS 1 LASER PRODUCT MARKING is located on the
exterior.