Read Panasonic KX-TEA308UA / KX-TE82460X / KX-TE82492X / KX-TE82493X / KX-A227X Service Manual online
KX-TEA308UA
KX-TE82460X
KX-TE82492X
KX-TE82493X
KX-A227X
KX-TE82492X
KX-TE82493X
KX-A227X
(for Ukraine)
Advanced Hybrid System
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the use of PbF and how
it might be permissible to use Pb solder during service and repair work.
it might be permissible to use Pb solder during service and repair work.
ORDER NO. KMS0508124CE
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
SUGGESTED PbF SOLDER
4
1.2.
HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
5
2 FOR SERVICE TECHNICIANS
7
3 CAUTION
8
3.1.
SAFETY PRECAUTIONS
8
3.2.
INSULATION RESISTANCE TEST
8
3.3.
BATTERY CAUTION
8
3.4.
CAUTION
8
4 SPECIFICATIONS
9
4.1.
GENERAL DESCRIPTION
9
4.2.
CHARACTERISTICS
9
4.3.
SYSTEM CAPACITY
9
5 SYSTEM OVERVIEW
10
5.1.
SYSTEM COMPONENTS
10
5.2.
SYSTEM CONNECTION DIAGRAM
11
6 NAMES AND LOCATIONS
12
7 CONNECTION
12
7.1.
SERIAL INTERFACE CONNECTION
12
8 DISASSEMBLY INSTRUCTIONS
13
8.1.
DISASSEMBLY INSTRUCTION
13
9 BLOCK DIAGRAM
15
9.1.
SYSTEM BLOCK DIAGRAM
15
9.2.
POWER BLOCK DIAGRAM
16
9.3.
KX-TEA308UA MAIN BLOCK DIAGRAM
16
9.4.
KX-TEA308UA CO BLOCK DIAGRAM
17
9.5.
KX-TEA308UA POWER SUPPLY UNIT BLOCK
DIAGRAM
17
10 EXPLANATION OF BLOCK DIAGRAM
18
10.1. MAIN UNIT (KX-TEA308UA)
18
11 CIRCUIT OPERATION
20
11.1. POWER SUPPY CIRCUIT
20
11.2. CO INTERFACE CIRCUIT
21
11.3. CROSS POINT SWITCH CIRCUIT
26
11.4. INTERCOM CIRCUIT
28
11.5. POWER FAILURE THROUGH CALL SWITCHING
CIRCUIT
29
11.6. DATA COMMUNICATION CIRCUIT
29
11.7. CONTROL CIRCUIT
31
11.8. TONE GENERATOR CIRCUIT
31
11.9. DTMF GENERATOR CIRCUIT
32
11.10. DTMF RECEIVER CIRCUIT
32
11.11. INT CALLID INTERFACE CIRCUIT
33
11.12. MODEM INTERFACE CIRCUIT
33
11.13. USB INTERFACE CIRCUIT
34
11.14. OGM INTERFACE CIRCUIT
34
11.15. RINGING SIGNAL GENERATOR CIRCUIT
35
11.16. SMDR INTERFACE CIRCUIT
35
11.17. DOORPHONE CARD INTERFACE (KX-TE82460X)
36
11.18. BUILT IN VOICE MESSAGE CARD INTERFACE (KX-
TE82492X)
36
11.19. CALL ID CARD INTERFACE (KX-TE82493X)
37
12 TROUBLESHOOTING GUIDE
38
12.1. NO OPERATION (Check POWER SUPPLY BOARD,
MAIN BOARD and 2AP BOARD)
38
12.2. NO DIAL TONE
39
12.3. CANNOT DIAL
40
12.4. CANNOT CALL EXTENSION
41
12.5. CANNOT USE PROPRIETARY TELEPHONE
41
12.6. CANNOT RECEIVE INCOMING CALL
41
12.7. CANNOT SEND DTMF DIALING
42
12.8. CANNOT RECEIVE CALL DIAL TONE
42
12.9. CANNOT SEND A HOLD ON MUSIC
43
13 IC DATA
44
13.1. IC700
44
13.2. IC7
46
13.3. IC8
46
14 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES
47
15 HOW TO REPLACE A FLAT PACKAGE IC
48
15.1. PREPARATION
48
15.2. REMOVAL PROCEDURE
48
15.3. INSTALLATION PROCEDURE
48
15.4. REMOVING SOLDER FROM BETWEEN PINS
48
16 FIXTURES AND TOOLS
49
17 CABINET AND ELECTRICAL PARTS LOCATION
50
18 ACCESSORIES AND PACKING MATERIALS
51
19 REPLACEMENT PARTS LIST (KX-TEA308UA)
52
19.1. CABINET AND ELECTRICAL PARTS
52
19.2. ACCESSORIES AND PACKING MATERIALS
52
19.3. MAIN BOARD PARTS
52
19.4. CO BOARD PARTS
59
19.5. POWER SUPPLY BOARD PARTS
61
19.6. FIXTURES AND TOOLS
62
19.7. MEMO
63
20 FOR THE SCHEMATIC DIAGRAM
64
21 SCHEMATIC DIAGRAM (KX-TEA308UA)
66
21.1. MAIN No.1 (Extention A-D Block)
66
21.2. MAIN No.2 (Extention E-H Block)
70
21.3. MAIN No.3 (Cross-Point Block)
74
21.4. MAIN No.4 (ASIC, Memory Block)
78
21.5. MAIN No.5 (CO Block)
82
21.6. POWER SUPPLY
86
21.7. MEMO
87
22 PRINTED CIRCUIT BOARD (KX-TEA308UA)
88
22.1. MAIN BOARD
88
22.2. CO BOARD
90
22.3. POWER SUPPLY
92
23 KX-TE82460X (2-PORT DOORPHONE CARD)
93
23.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
94
CONTENTS
Page
Page
2
KX-TEA308UA
23.2. LOCATION OF OPTIONAL CARDS
95
23.3. DOORPHONE/DOOROPENER CARD BLOCK DIAGRAM
96
23.4. EXPLANATION OF BLOCK DIAGRAM/CIRCUIT
OPERATIONS
96
23.5. TROUBLESHOOTING GUIDE
97
23.6. IC DATA
98
23.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES
100
23.8. ACCESSORIES AND PACKING MATERIALS
100
23.9. REPLACEMENT PARTS LIST (KX-TE82460X)
101
23.10. FOR THE SCHEMATIC DIAGRAM
103
23.11. SCHEMATIC DIAGRAM (KX-TE82460X)
104
23.12. PRINTED CIRCUIT BOARD (KX-TE82460X)
106
24 KX-TE82492X (2-CHANNEL VOICE MESSAGE CARD)
107
24.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
108
24.2. LOCATION OF OPTIONAL CARDS
109
24.3. BLOCK DIAGRAM
110
24.4. CIRCUIT OPERATIONS
111
24.5. TROUBLESHOOTING GUIDE
112
24.6. IC DATA
114
24.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES
115
24.8. ACCESSORIES AND PACKING MATERIALS
115
24.9. REPLACEMENT PARTS LIST (KX-TE82492X)
116
24.10. FOR THE SCHEMATIC DIAGRAM
117
24.11. SCHEMATIC DIAGRAM (KX-TE82492X)
118
24.12. PRINTED CIRCUIT BOARD (KX-TE82492X)
120
25 KX-TE82493X (3-PORT CALLER ID CARD)
121
25.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
122
25.2. LOCATION OF OPTIONAL CARDS
123
25.3. BLOCK DIAGRAM
124
25.4. CIRCUIT OPERATIONS
124
25.5. TROUBLESHOOTING GUIDE
125
25.6. IC DATA
126
25.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES
128
25.8. ACCESSORIES AND PACKING MATERIALS
128
25.9. REPLACEMENT PARTS LIST (KX-TE82493X)
129
25.10. FOR THE SCHEMATIC DIAGRAM
131
25.11. SCHEMATIC DIAGRAM (KX-TE82493X)
132
25.12. PRINTED CIRCUIT BOARD (KX-TE82493X)
134
26 KX-A227X (BACK-UP BATTERY CABLE)
135
26.1. ACCESSORIES AND PACKING MATERIALS
136
26.2. REPLACEMENT PARTS LIST (KX-A227X)
137
3
KX-TEA308UA
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
•
•
•
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
•
•
•
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TEA308UA