Read Panasonic DMR-EH49EC / DMR-EH49EE / DMR-EH49EP / DMR-EH59EC / DMR-EH59EE / DMR-EH59EM / DMR-EH59EP / DMR-EH495EG / DMR-EH595EG Service Manual online
DMR-EH49EE
DMR-EH49EP
DMR-EH59EC
DMR-EH59EE
DMR-EH59EM
DMR-EH59EP
DMR-EH495EG
DMR-EH595EG
(S).......................Silver Type (Except EE/EM)
(K).......................Black Type
2.3. Service caution based on legal restrictions----------6
3.2. Caution for DivX --------------------------------------------7
5 Location of Controls and Components------------------ 10
6 Operating Instructions ---------------------------------------- 12
button-------------------------------------------------------- 12
9 Disassembly and Assembly Instructions --------------- 30
9.2. P.C.B. Positions------------------------------------------- 31
9.3. Top Cover -------------------------------------------------- 32
9.4. Front Panel ------------------------------------------------ 32
9.5. Front (L) P.C.B., Front (R) P.C.B. -------------------- 33
9.6. HDD, ATAPI P.C.B. -------------------------------------- 33
9.7. Rear Panel, Fan Motor --------------------------------- 34
9.8. RAM/Digital P.C.B. Module ---------------------------- 34
9.9. Power P.C.B. ---------------------------------------------- 36
10.2. Caution for Replacing Parts--------------------------- 41
10.3. Standard Inspection Specifications after
lic cabinet part on the equipment such as screwheads,
connectors, control shafts, etc. When the exposed metal-
lic part has a return path to the chassis, the reading
should be between 1M
(See Figure 1.)
as shown in Figure 1.
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliampere. In case a mea-
surement is outside of the limits specified, there is a pos-
sibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the cus-
tomer.
(ES) Devices
trostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand semi-
conductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
which should be removed for potential shock reasons prior to applying power to the unit under test.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
ble conductive material).
Caution
to damage an ES device).