Read Sony KLV-S19A10E / KLV-S19A10U Service Manual online
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WAX
RM-EA002
SERVICE MANUAL
WAX
CHASSIS
MODEL
COMMANDER
DEST
MODEL
COMMANDER
DEST
KLV-S19A10U
RM-EA002
UK
FLAT PANEL COLOR TV
KLV-S19A10
KLV-S19A10E
RM-EA002
AEP
RM-EA002
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WAX
RM-EA002
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
Caution ................................................................
3
Specifications ......................................................
4
Connectors ..........................................................
5
Self Diagnosis .....................................................
6
1. GENERAL ...................................................................
7
2. DISASSEMBLY
2-1.
Stand Removal ....................................................
16
2-2.
Rear Cover Removal ...........................................
16
2-3.
VESA Bracket and Bottom Bracket
Assy Removal .....................................................
17
2-4.
A1E Board Removal ...........................................
17
2-5.
Shield Cover Removal ........................................
18
2-6.
TU Board Removal .............................................
18
2-7.
BE Board Removal .............................................
19
2-8.
H1E Board Removal ...........................................
19
2-9.
H3 Board Removal .............................................
20
2-10. Speaker Removal ................................................
20
2-11. Display Cover Removal ......................................
21
3. SET-UP ADJUSTMENTS
3-1.
Signal Adjustment .............................................
22
3-1-1. Pal auto adjustment (CVBS) ...........................
22
3-1-2. Pal auto adjustment (RGB) ..............................
22
3-1-3. Secam auto adjustment (CVBS) ......................
22
3-2.
White Balance Adjustment .................................
22
3-2-1. White Balance adjustment (H/L) .....................
22
3-2-2. White Balance adjustment (C/O) .....................
23
3-2-3. Secam White Balance adjustment (H/L) ..........
23
3-2-4. Secam White Balance adjustment (C/O) ..........
24
3-3.
Test Test Mode ..................................................
24
4. DIAGRAMS
4-1.
Block Diagrams(1) .............................................
25
Block Diagrams(2) .............................................
26
Block Diagrams(3) .............................................
27
4-2.
Circuit Board Location ........................................
27
4-3.
Schematic Diagrams and Printed Wiring
Boards .................................................................
27
A1E Board Schematic Diagram ..........................
28
A1E Printed Wiring Board ...............................
34
BE Board Schematic Diagram ............................
36
BE Printed Wiring Board ..................................
42
TU Board Schematic Diagram ............................
43
TU Printed Wiring Board .................................
44
H3 Board Schematic Diagram ............................
43
H3 Printed Wiring Board ..................................
44
H1E Board Schematic Diagram ..........................
43
H1E Printed Wiring Board ...............................
44
4-4. Semiconductors ..................................................
45
5. EXPLODED VIEWS
5-1.
Chassis ..............................................................
47
5-2.
Rear Cover and Stand .........................................
48
6. ELECTRICAL PARTS LIST .................................. 49
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
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WAX
RM-EA002
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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