Read Sony KDL-S40A11E / KDL-S40A12U / KLV-S40A10E Service Manual online
- 1 -
WAX
RM-EA002 / RM-ED002
SERVICE MANUAL
WAX
CHASSIS
MODEL
COMMANDER
DEST
MODEL
COMMANDER
DEST
KDL-S40A12U
RM-ED002
UK
RM-ED002
FLAT PANEL COLOR TV
KLV-S40A10E / KDL-S40A11E / KDL-S40A12U
KLV-S40A10E
RM-EA002
AEP
KDL-S40A11E
RM-ED002
AEP
RM-EA002
- 2 -
WAX
RM-EA002 / RM-ED002
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
Caution ................................................................
3
Specifications ......................................................
4
Connectors ..........................................................
6
Self Diagnosis .....................................................
7
1. GENERAL ...................................................................
8
2. DISASSEMBLY
2-1.
Rear Cover Removal ...........................................
17
2-2.
Stand Removal ....................................................
17
2-3.
Shield Cover Removal ........................................
18
2-4.
Speaker Removal ................................................
18
2-5.
A2E4 Removal ....................................................
19
2-6.
BE Board Removal .............................................
19
2-7.
G3 Board Removal .............................................
20
2-8.
GE2 Board Removal ...........................................
20
2-9.
H1E Board Removal ...........................................
21
2-10. H2 Board Removal .............................................
21
2-11. H3 Board Removal .............................................
22
2-12. N Board Removal (Digital models only) ............
22
2-13. N1 Board Removal (Digital models only) ..........
23
3. SET-UP ADJUSTMENTS
3-1.
Signal Adjustment .............................................
24
3-1-1. Pal auto adjustment (CVBS) ...........................
24
3-1-2. Pal auto adjustment (RGB) ..............................
24
3-1-3. Secam auto adjustment (CVBS) ......................
24
3-2.
White Balance Adjustment .................................
24
3-2-1. White Balance adjustment (H/L) .....................
24
3-2-2. White Balance adjustment (C/O) .....................
25
3-2-3. Secam White Balance adjustment (H/L) ..........
25
3-2-4. Secam White Balance adjustment (C/O) ..........
26
3-3.
Test Test Mode ..................................................
26
4. DIAGRAMS
4-1.
Block Diagrams(1) .............................................
27
Block Diagrams(2) .............................................
28
Block Diagrams(3) .............................................
29
Block Diagrams(4) .............................................
30
Block Diagrams(5) .............................................
31
4-2.
Circuit Board Location ........................................
31
4-3.
Schematic Diagrams and Printed Wiring
Boards .................................................................
31
A2E4 Board Schematic Diagram ........................
32
A2E4 Printed Wiring Board .............................
37
BE Board Schematic Diagram ............................
39
BE Printed Wiring Board ....................................
45
G3 Board Schematic Diagram ............................
46
G3 Printed Wiring Board ....................................
48
GE2 Board Schematic Diagram ..........................
50
GE2 Printed Wiring Board .................................
51
H1E Board Schematic Diagram ..........................
52
H1E Printed Wiring Board .................................
53
H2 Board Schematic Diagram ............................
52
H2 Printed Wiring Board ..................................
53
H3 Board Schematic Diagram ............................
52
H3 Printed Wiring Board ....................................
53
N Board Schematic Diagram
(Digital models only) ..........................................
54
N Printed Wiring Board (Digital models only) ..
61
N1 Schematic Diagram (Digital models only) ....
62
N1 Printed Wiring Board (Digital models only)
63
4-4.
Semiconductors ...................................................
64
5. EXPLODED VIEWS
5-1.
Chassis ..............................................................
66
5-2.
Rear Cover and Stand .........................................
68
6. ELECTRICAL PARTS LIST .................................. 69
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
- 3 -
WAX
RM-EA002 / RM-ED002
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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- 4 -
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