Read Sony KDL-40X3000 / KDL-46X3000 Service Manual online
HISTORY
Model Name :
SERVICE MANUAL
SERVICE MANUAL
Click on Page Number to display detail of changes.
KDL-40/46X3000
Date Part Number Description of Revisions
Version
1.0
9-927-561-01
2007.10
Original Manual.
- 1 -
FIX2
RM-ED010
SERVICE MANUAL
FIX2
CHASSIS
MODEL
COMMANDER
DEST
MODEL
COMMANDER
DEST
KDL-40X3000
RM-ED010
UK
KDL-46X3000
RM-ED010
UK
RM-ED010
FLAT PANEL COLOR TV
KDL-40X3000 / KDL-46X3000
KDL-40X3000
RM-ED010
AEP
KDL-46X3000
RM-ED010
AEP
- 2 -
FIX2
RM-ED010
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
1. GENERAL ...................................................................
3
Caution ................................................................
3
Specifications ......................................................
4
Connectors ..........................................................
5
Self Diagnosis .....................................................
7
2. DISASSEMBLY
2-1.
Stand Removal ....................................................
8
2-2.
Rear Cover Removal ...........................................
8
2-3.
AC Inlet Removal ...............................................
9
2-4.
Loudspeaker Removal ........................................
9
2-5.
AE Board Removal .............................................
10
2-6.
AVC and FB2 Board Removal ...........................
10
2-7.
CI Board Removal ..............................................
11
2-8.
DF1/DF2 and GF1 Board Removal ...................
11
2-9.
DF3 Board Removal ...........................................
12
2-10. H1 Board Removal .............................................
12
2-11. H3 Board Removal .............................................
13
2-12. H4 Board Removal .............................................
13
2-13. HW2 Board Removal .........................................
14
2-14. TUE Board Removal ..........................................
14
2-15. UB1 Board Removal ..........................................
15
2-16. Front Cabinet and Bezel Assy Removal .............
15
3. ADJUSTMENTS
3-1.
How to enter Service Mode ................................
16
3-2.
Changing TVM Data Settings ............................
16
3-3.
Writing TVM Data ..............................................
16
3-4.
Entering BEM Service Menu ..............................
16
3-5.
Changing BEM Data Settings .............................
16
3-6.
Writing BEM Data ..............................................
17
3-7.
Setting Shipping Condition .................................
17
3-8.
Trouble Shooting ................................................
17
3-8-1. No Power ........................................................
17
3-8-2. Set Reboots ......................................................
17
3-8-3. Power OVP .....................................................
17
3-8-4. Power Error .....................................................
17
3-8-5. T-Con Error .....................................................
17
3-8-6. Back Light Error ..............................................
17
3-8-7. Temperature Error ............................................
17
3-8-8. Audio Error .....................................................
17
3-8-9. Balancer Error ..................................................
17
3-8-10. Communication Error ....................................
17
Trouble Shooting Flow Chart .........................
18
Software Update .............................. ..............
22
4. DIAGRAMS
4-1.
Block Diagram ....................................................
31
4-2.
Circuit Board Location ........................................
32
4-3.
Schematic Diagrams and Printed Wiring
Boards .................................................................
32
AE Board Schematic Diagram ............................
33
AVC Board Schematic Diagram .........................
50
CI Board Schematic Diagram .............................
64
DF1 Board Schematic Diagram (40 inches) .......
67
DF2 Board Schematic Diagram (46 inches) ....... 71
DF3 Board Schematic Diagram (46 inches) ....... 75
FB2 Board Schematic Diagram ..........................
77
GF1 Board Schematic Diagram ......................... 123
HW2 Board Schematic Diagram ......................... 127
H1 Board Schematic Diagram ............................ 131
H4 Board Schematic Diagram ............................ 131
H3 Board Schematic Diagram ............................ 132
TUE Board Schematic Diagram .......................... 133
UB1 Board Schematic Diagram .......................... 138
AE Printed Wiring Board ................................... 150
AVC Printed Wiring Board ................................ 152
CI Printed Wiring Board ..................................... 152
DF1 Printed Wiring Board (40 inches) .............. 153
DF2 Printed Wiring Board (46 inches) .............. 154
DF3 Printed Wiring Board (46 inches) .............. 155
FB2 Printed Wiring Board .................................. 156
H1 Printed Wiring Board .................................... 158
H3 Printed Wiring Board .................................... 158
H4 Printed Wiring Board .................................... 158
HW2 Printed Wiring Board ................................ 158
GF1 Printed Wiring Board (40/46 inches) ......... 159
TUE Printed Wiring Board ................................. 161
UB1 Printed Wiring Board ................................. 161
5. EXPLODED VIEWS
5-1.
Chassis ................................................................ 162
5-2.
Rear Cover, Stand & Bezel ................................. 163
5-3.
Front Cabinet Assy & LCD Panel ...................... 164
6. ELECTRICAL PARTS LIST .................................. 165
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
- 3 -
FIX2
RM-ED010
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Soldered Boards
example 1
example 2
Lead Free Solder material must be used to comply with environmental requirements of new solder joints. Lead Free Solder is available under
the following part numbers :
the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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1
CAUTION
SECTION 1 GENERAL