Read Sony KDL-40V3000 / KDL-46V3000 Service Manual online
HISTORY
Model Name :
SERVICE MANUAL
SERVICE MANUAL
Click on Page Number to display detail of changes.
KDL-40/46V3000
Date Part Number Description of Revisions
Version
1.0
9-927-583-01
2007.04
Original Manual.
9-927-583-02
2007.12
Change of BE1F and U2 board part numbers
(P.87) ( P.88) (P.94) (P.114) and addition of full size
schematic diagrams (Full)
2.0
9-927-583-02
2007.12
Screw for stand (
P87
), LVDS Cable Update (
P123
)
3.0
- 1 -
WAX3F
RM-ED009
SERVICE MANUAL
WAX3F
CHASSIS
MODEL
COMMANDER
DEST
MODEL
COMMANDER
DEST
KDL-40V3000
RM-ED009
UK
KDL-46V3000
RM-ED009
UK
RM-ED009
FLAT PANEL COLOR TV
KDL-40V3000 / KDL-46V3000
KDL-40V3000
RM-ED009
AEP
KDL-46V3000
RM-ED009
AEP
- 2 -
WAX3F
RM-ED009
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
1. GENERAL
...................................................................
3
Caution ................................................................
3
Specifications ......................................................
5
Connectors ..........................................................
5
Self Diagnosis .....................................................
7
2. DISASSEMBLY
2-1.
Rear Cover Removal ...........................................
8
2-2.
Stand Removal ....................................................
8
2-3.
AC Inlet Removal ...............................................
9
2-4.
Loudspeaker Removal ........................................
9
2-5.
BE1F Board Removal .........................................
10
2-6.
DF1, DF2 and G3 Board Removal ....................
11
2-7.
H3 Board Removal .............................................
11
2-8.
H1 Board Removal .............................................
12
2-9.
U2 Board Removal .............................................
12
2-10. D3 Board Removal .............................................
13
3. SET-UP ADJUSTMENTS
3-1.
How to enter Service Mode ...............................
14
3-2.
Signal Level Adjustment ....................................
14
3-2-1. Set up of AD calibration1 adjustment for
terrestrial analog ...............................................
14
3-2-2. Y signal calibration1 adjustment for
terrestrial analog ...............................................
14
3-2-3. C signal calibration1 adjustment for
terrestrial analog ...............................................
14
3-2-4. Set up of AD calibration1 adjustment for
video ................................................................
15
3-2-5. Y signal calibration1 adjustment for PAL
video ................................................................
15
3-2-6. C signal calibration1 adjustment for PAL
video ................................................................
15
3-3. Gamma Adjustment ...........................................
15
3-3-1. Preparation before Gamma Adjustment ..........
15
3-3-2. Set up mode for Gamma Adjustment ..............
15
3-3-3. Set up Trident Internal SG and Brightness
measurement ....................................................
15
3-4.
White Balance Adjustment .................................
16
3-4-1. Set up mode for White Balance Adjustment ...
16
3-4-2. White Balance of colour temperature “Cool” ..
16
3-4-3. White Balance of colour temperature
“Neutral”, “Warm1” and “Warm2” ....................
18
3-5. Panel Replacement .............................................
18
3-6.
Board Replacement ............................................
18
3-7.
TT Modes ..........................................................
18
4. DIAGRAMS
4-1.
Block Diagrams ..................................................
19
4-2.
Circuit Board Location ........................................
20
4-3.
Schematic Diagrams and Printed Wiring
Boards .................................................................
20
BE1F Board Schematic Diagram ........................
21
U2 Board Schematic Diagram ............................
60
DF1 Board Schematic Diagram (40 inches) ....... 63
DF2 Board Schematic Diagram (46 inches) ....... 67
D3 Board Schematic Diagram (46 inches) ......... 71
G3 Board Schematic Diagram ............................
73
H1 Board Schematic Diagram ............................
77
H3 Board Schematic Diagram ............................
78
BE1F Printed Wiring Board ...............................
79
U2 Printed Wiring Board .................................... 81
H1 Printed Wiring Board ....................................
81
H3 Printed Wiring Board ....................................
81
DF1 Printed Wiring Board (40 inches) .............. 82
DF2 Printed Wiring Board (46 inches) .............. 83
D3 Printed Wiring Board (46 inches) ................. 84
G3 Printed Wiring Board ....................................
85
5. EXPLODED VIEWS
5-1.
Chassis ................................................................
87
5-2.
Rear Cover, Stand & Bezel .................................
88
5-3.
D3 Board & Power Cords ..................................
89
6. ELECTRICAL PARTS LIST
.................................. 90
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
- 3 -
WAX3F
RM-ED009
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Soldered Boards
example 1
example 2
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1
CAUTION
SECTION 1 GENERAL
Lead Free Solder material must be used to comply with environmental requirements of new solder joints. Lead Free Solder is available under
the following part numbers :
the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
