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HISTORY
Model Name :
SERVICE MANUAL
SERVICE MANUAL
Click on Page Number to display detail of changes.
KDL-26/32/37S4000
Date Part Number Description of Revisions
Version
1.0
9-883-405-01
2008.07
Original Manual.
- 1 -
SERVICE MANUAL
SE2AG
CHASSIS
MODEL
DEST
RM-ED009
FLAT PANEL COLOR TV
KDL-26S4000
OIRT / UK / WE
KDL-32S4000
OIRT / UK / WE
KDL-37S4000
OIRT / UK / WE
- 2 -
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
1. GENERAL ...................................................................
3
Caution ................................................................
3
Specifications .....................................................
4
Connectors ..........................................................
5
Self Diagnosis .....................................................
7
2. DISASSEMBLY
2-1.
Rear Cover Removal ..........................................
8
2-2.
Stand Removal ...................................................
8
2-3.
Loudspeaker Removal ........................................
8
2-4.
Side Jack Bracket Assy Removal ......................
8
2-5.
BC1 Board Removal ..........................................
9
2-6.
GA2 Board Removal (26/32 inches) .................
9
2-7.
GA3 Board Removal (37 inches) .......................
9
2-8.
HM4/HM5 Board Removal ................................
9
3. ADJUSTMENTS
3-1.
How to enter the Service Mode ........................
10
3-2.
TT Modes ..........................................................
12
3-3.
TT OSD Labels .................................................
13
4. DIAGRAMS
4-1.
Block Diagram ...................................................
14
4-2.
Circuit Board Location .......................................
15
4-3.
Schematic Diagrams and Printed Wiring
Boards .................................................................
15
BC1 Board Schematic Diagram .........................
16
HM4 Board Schematic Diagram(26/32 inches)
28
HM5 Board Schematic Diagram(37 inches) ......
28
GA2 Board Schematic Diagram(26/32 inches) .
29
GA3 Board Schematic Diagram(37 inches) ......
30
BC1 Printed Wiring Board .................................
32
HM4 Printed Wiring Board(26/32 inches) ........
32
HM5 Printed Wiring Board(37 inches) .............
33
GA2 Printed Wiring Board(26/32 inches) .........
34
GA3 Printed Wiring Board(37 inches) ..............
36
5. EXPLODED VIEWS
5-1.
Chassis ................................................................
38
5-2.
Beznet Assy ........................................................
39
5-3.
Rear Cover & Power Supply Cords ...................
40
6. ELECTRICAL PARTS LIST .................................. 41
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE EXPLODED VIEWS AND IN THE PARTS LIST ARE CRITICAL
FOR SAFE OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN
THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
FOR SAFE OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN
THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING ANY
SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD DUE TO
LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS DIRECTLY
CONNECTED TO THE POWER LINE.
SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD DUE TO
LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS DIRECTLY
CONNECTED TO THE POWER LINE.
- 3 -
SECTION 1 GENERAL
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Soldered Boards
example 1
example 2
Lead Free Solder material must be used to comply with environmental requirements of new solder joints. Lead Free Solder is available under
the following part numbers :
the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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1
CAUTION
SECTION 1 GENERAL
