Read Sony KDL-26P2520 / KDL-26P2530 / KDL-32P2520 / KDL-32P2530 / KDL-40P2530 Service Manual online
HISTORY
Model Name :
SERVICE MANUAL
SERVICE MANUAL
Click on Page Number to display detail of changes.
KDL-26/32P2520, KDL-26/32/40P2530
Date Part Number Description of Revisions
Version
1.0
9-927-542-01
2007.01
Original Manual
- 1 -
SE-1
RM-ED007
SERVICE MANUAL
SE-1
CHASSIS
MODEL
COMMANDER
DEST
MODEL
COMMANDER
DEST
KDL-26P2520
RM-ED007
UK
KDL-32P2520
RM-ED007
UK
KDL-26P2530
RM-ED007
UK
KDL-32P2530
RM-ED007
UK
KDL-40P2530
RM-ED007
UK
RM-ED007
FLAT PANEL COLOR TV
KDL-26P2520 / KDL-32P2520
KDL-26P2530 / KDL-32P2530 / KDL-40P2530
KDL-26P2530 / KDL-32P2530 / KDL-40P2530
KDL-26P2520
RM-ED007
AEP
KDL-32P2520
RM-ED007
AEP
KDL-26P2530
RM-ED007
AEP
KDL-32P2530
RM-ED007
AEP
KDL-40P2530
RM-ED007
AEP
- 2 -
SE-1
RM-ED007
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
Caution ................................................................
3
Specifications ......................................................
4
Connectors ..........................................................
6
Self Diagnosis .....................................................
7
1. GENERAL ...................................................................
8
2. DISASSEMBLY
2-1.
Stand Removal ....................................................
16
2-2.
Rear Cover Removal ...........................................
16
2-3.
Speaker Removal ................................................
17
2-4.
A1/A1P Board Removal .....................................
17
2-5.
BDTR-2 Board Removal ....................................
18
2-6.
G1 or G2 Board Removal ...................................
18
2-7.
H1/H1P Board Removal .....................................
19
2-8.
H2/H2P Board Removal .....................................
19
2-9.
H3/H3P Board Removal .....................................
20
2-10. LCD Panel Removal ...........................................
20
3. CIRCUIT ADJUSTMENTS
3-1.
Electrical Adjustments .......................................
21
3-2.
Test Mode 2 .......................................................
23
3-3.
TT OSD Labels ..................................................
24
4. DIAGRAMS
4-1.
Block Diagrams(1) .............................................
25
Block Diagrams(2) .............................................
26
Block Diagrams(3) .............................................
27
Block Diagrams(4) .............................................
28
Block Diagrams(5) .............................................
29
4-2.
Circuit Board Location ........................................
29
4-3.
Schematic Diagrams and Printed Wiring
Boards .................................................................
29
A1/A1P Board Schematic Diagram ....................
30
A1/A1P Printed Wiring Board ...........................
33
BDTR-2 Board Schematic Diagram ...................
34
BDTR-2 Printed Wiring Board ...........................
44
G1 Board Schematic Diagram
(KDL-26/32P2520/30) .......................................
46
G1 Printed Wiring Board
(KDL-26/32P2520/30) .......................................
48
G2 Board Schematic Diagram
(KDL-40P2530) .................................................
50
G2 Printed Wiring Board (KDL-40P2530) ........
52
H1/H1P Board Schematic Diagram ....................
54
H1/H1P Printed Wiring Board ...........................
55
H2/H2P Board Schematic Diagram ....................
54
H2/H2P Printed Wiring Board ...........................
55
H3/H3P Board Schematic Diagram ....................
54
H3/H3P Printed Wiring Board ...........................
55
4-4.
Semiconductors ..................................................
56
5. EXPLODED VIEWS
5-1.
Chassis ................................................................
58
5-2.
Stand, Rear Cover, Power Leads ........................
60
6. ELECTRICAL PARTS LIST .................................. 61
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
- 3 -
SE-1
RM-ED007
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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