Read Sony KD-49X8000C Service Manual online
APPENDIX-4
BMFW board
How to disassembly Heat sink
BMFW board
HEAT SINK (MUFF)
HEAT SINK (MUFF C)
HEAT SINK (MUFF C)
HOLDER, HS WS (MUF)
4-548-743-01
4-548-743-01
HOLDER, (HS MUF)
4-549-188-01
4-549-188-01
<NOTE>
HEAT SINK are already attached to the B board for service.
If you need to disassemble HEAT SINK from B board,
Please cut HOLDER,HS WS(MUF) with tool (nippers) from B side of B board.
If you need to disassemble HEAT SINK from B board,
Please cut HOLDER,HS WS(MUF) with tool (nippers) from B side of B board.
,
(
)
( pp
)
However, please it carefully because some damage may be given
to the neighborhood parts or the B board itself.
to the neighborhood parts or the B board itself.
Do not reuse both HOLDER. Please replace to new parts.
Potting is necessary for re-assembly of HEAT SINK.
Please follow
Please follow
SBR "New Potting TIM Operation for board repair"
for details.
nipper
119
g
p
p