Read Sony DPP-FP55 Service Manual online
SERVICE MANUAL
DIGITAL PHOTO PRINTER
Link
Link
Revision History
Revision History
Sony EMCS Co.
DPP-FP55
How to use
Acrobat Reader
How to use
Acrobat Reader
SPECIFICATIONS
REPAIR PARTS LIST
FIRMWARE WRITING AND
VERSION UPGRADE
VERSION UPGRADE
SERVICE NOTE
TROUBLESHOOTING
DISASSEMBLY
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
East European Model
Russian Model
Korean Model
Ver. 1.4 2007. 08
2007H0800-1
©2007.08
Published by Kohda TEC
9-852-118-12
DPP-FP55
• Notes on BGA board replacement
• Notes on thermal printer (MD) and MAIN board replacement
• Notes on LCD adjustment after replacement
Revised-1
Replace the previously issued
SERVICE MANUAL 9-852-118-11
and 9-852-118-82 with this Manual.
SERVICE MANUAL 9-852-118-11
and 9-852-118-82 with this Manual.
— 2 —
DPP-FP55
SPECIFICATIONS
x
Printer
Printing method
Dye sublimation printing (Yellow/
Magenta/Cyan 3 pass)
Magenta/Cyan 3 pass)
Resolution
300 (H) x 300 (V) dpi
Equivalent to
3 color Ink-Jet 4800 dpi x 4800 dpi
Equivalent to
3 color Ink-Jet 4800 dpi x 4800 dpi
*1
6 color Ink-Jet 3810 dpi x 3810 dpi
*2
Image processing per dot
256 levels (8 bits for each Yellow/
Magenta/Cyan), approx. 16 770 000
colors
Magenta/Cyan), approx. 16 770 000
colors
Printing size
Post Card (4 x 6 inch) size:
101.6 x 152.4 mm (maximum,
borderless)
borderless)
Printing time (per sheet)
Post Card (4 x 6 inch) size: approx. 67
seconds
(When printing from a memory card
inserted in the printer ’s slot,
excluding the time for data processing
and transferring)
inserted in the printer ’s slot,
excluding the time for data processing
and transferring)
Input/Output connectors
USB for PC connection USB 1.1
(Type B)
(Type B)
Highspeed is not supported.
PictBridge connector
Slot
“Memory Stick” insertion slot
SD Card insertion slot
SD Card insertion slot
Compatible image file formats
JPEG: DCF 2.0 compatible, Exif
2.21
compatible, JFIF
*3
TIFF:
Exif 2.21 compatible
BMP
*4
: 24bit Windows format
Some image file formats are not
compatible.
compatible.
Maximum number of pixels to be
handled
handled
6 400(H) x 4 800(V) dots
(Excluding Index Print and part of
Creative Print)
(Excluding Index Print and part of
Creative Print)
Maximum number of files to be handled
9 999 files for a memory card/an
external device
external device
Print cartridge/Print Paper
See “Preparing the print pack” on
page 11.
page 11.
LCD panel
5.0 cm (2.0 type) TFT drive
Total number of dots:
86636 (358 x 242) dots
Total number of dots:
86636 (358 x 242) dots
Power requirements
DC IN jack, DC 24V
(On standby mode, less than 1W)
(On standby mode, less than 1W)
Operating temperature
5 ˚C to 35 ˚C (41 ˚F to 95 ˚F)
Dimensions
Approx. 175 x 60 x 137 mm
(7 x 2
(7 x 2
3
/
8
x 5
1
/
2
inches)
(w/h/d, excluding protruding parts)
(306 mm (12
(306 mm (12
1
/
8
inches) of depth when
the paper tray is installed.)
Mass
Approx. 1.1 kg (2 lb 7 oz)
(excluding the paper tray, print
cartridge, AC power adaptor)
(excluding the paper tray, print
cartridge, AC power adaptor)
Supplied accessories
See page 4-5.
AC power adaptor AC-S2425
Power requirements
AC 100 to 240 V, 50/60 Hz, 1.5 to
0.75 A
0.75 A
Rated output voltage
DC 24 V, 2.2 A
Operating temperature
5 ˚C to 35 ˚C (41 ˚F to 95 ˚F)
Dimensions
Approx. 60 x 30.5 x 122 mm
(2
(2
3
/
8
x 1
1
/
4
x 4
7
/
8
inches)
(w/h/d, excluding protruding parts)
Mass
Approx. 305 g (11 oz)
Design and specifications are subject to
change without notice.
change without notice.
*1:
When the 16 x 16 matrix is used: 300 x 16 =
4,800 dpi
4,800 dpi
*2:
When the 12.7 x 12.7 matrix is used: 300 x
12.7 = 3,810 dpi
12.7 = 3,810 dpi
*3:
Baseline JPEG with 4:4:4, 4:2:2, or 4:2:0
format
format
*4:
You cannot print using the Picture Motion
Browser.
Browser.
These specifications are extracted from Operating
Instructions of DPP-FP55 (2-682-264-11 (1)).
Instructions of DPP-FP55 (2-682-264-11 (1)).
— 3 —
DPP-FP55
1.
Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
connections. Check the entire board surface for solder splashes
and bridges.
2.
Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
"pinched" or contact high-wattage resistors.
3.
Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair. Point
them out to the customer and recommend their replacement.
transistors, that were installed during a previous repair. Point
them out to the customer and recommend their replacement.
4.
Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
of deterioration. Point them out to the customer and
recommend their replacement.
5.
Check the B+ voltage to see it is at the values specified.
6.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE
0
SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
— 4 —
DPP-FP55
TABLE OF CONTENTS
1.
SERVICE NOTE
························································ 1-1
1-1.
SERVICE MODE ···························································· 1-2
2.
TROUBLESHOOTING
2-1.
ELECTRICAL TROUBLESHOOTING ························· 2-1
2-2.
MECHANICAL TROUBLESHOOTING ······················· 2-2
3.
DISASSEMBLY
3-1.
LID UPPER SECTION ··················································· 3-3
3-2.
PRINTER SECTION ······················································ 3-4
4.
REPAIR PARTS LIST
4-1.
EXPLODED VIEWS ······················································ 4-3
5.
FIRMWARE WRITING AND VERSION
UPGRADE
UPGRADE
··································································· 5-1
