Read Sony HDR-CX330 / HDR-CX330E / HDR-PJ330E / HDR-PJ340 / HDR-PJ340E / HDR-PJ350 / HDR-PJ350E Service Manual online
SERVICE MANUAL
Revision History
Published by Sony Techno Create Corporation
Sony Corporation
LEVEL
3
HDR-CX330/CX330E/PJ330E/PJ340/PJ340E/PJ350/PJ350E_L3
Check the SERVICE NOTE (LEVEL 2) before the service.
983477412.pdf
Digital HD Video Camera Recorder
The components identified by mark
0 or dotted line with mark 0 are
critical for safety.
Replace only with part number
specified.
0 or dotted line with mark 0 are
critical for safety.
Replace only with part number
specified.
Les composants identifiés par une
marque
marque
0 sont critiques pour la
sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.
Ne les remplacer que par une
pièce portant le numéro spécifié.
9-834-774-12
Ver.
Date
History
Contents
S.M. Rev.
issued
1.0
2014.01
Official Release
—
—
1.1
2014.03
Revised-1
(A1 13-208)
(A1 13-208)
• Addition of HDR-PJ350.
Page
Page
2-1
,
4-3
,
4-6
,
5-1
,
6-29
,
6-30
,
6-31
,
6-52
Yes
2014C08-1
© 2014.03
MODEL GROUP
Projector Model:
PJ330E/PJ340/PJ340E/
PJ350/
PJ350E
Non Projector Model: CX330/CX330E
Ver. 1.1 2014.03
US Model
Canadian Model
AEP Model
UK Model
North European Model
E Model
Hong Kong Model
Chinese Model
Korea Model
Brazilian Model
Tourist Model
HDR-CX330/CX330E/PJ330E/PJ340/
PJ340E/PJ350/PJ350E
Photo: HDR-CX330/ Black
Revised-1
Replace the previously issued
SERVICE MANUAL 9-834-774-11
with this Manual.
SERVICE MANUAL 9-834-774-11
with this Manual.
– 2 –
HDR-CX330/CX330E/PJ330E/PJ340/PJ340E/PJ350/PJ350E_L3
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST
ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY
SONY.
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST
ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY
SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REM-
PLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT
LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REM-
PLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT
LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes and
bridges.
bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to the
customer and recommend their replacement.
customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs of
deterioration. Point them out to the customer and recommend their
replacement.
replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
6. Flexible Circuit Board Repairing
• Set the soldering iron tip temperature to 350 °C approximately.
• Do not touch the soldering iron on the same conductor of the circuit
• Do not touch the soldering iron on the same conductor of the circuit
board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
UNLEADED SOLDER
This unit uses unleaded solder.
Boards requiring use of unleaded solder are printed with the lead free
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the
Boards requiring use of unleaded solder are printed with the lead free
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the
lead free mark due to their particular size.)
: LEAD FREE MARK
Be careful to the following points to solder or unsolder.
• Set the soldering iron tip temperature to 350 °C approximately.
If cannot control temperature, solder/unsolder at high temperature
for a short time.
for a short time.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Be sure to control soldering iron tips used for unleaded solder and
those for leaded solder so they are managed separately. Mixing un-
leaded solder and leaded solder will cause detachment phenomenon.
leaded solder and leaded solder will cause detachment phenomenon.
注意
如果电池更换不当会有爆炸危险。
只能用同样类型或等效类型的电池来更换。
务必按照说明处置用完的电池。
只能用同样类型或等效类型的电池来更换。
务必按照说明处置用完的电池。
2-1
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
HDR-CX330/CX330E/PJ330E/PJ340/PJ340E/PJ350/PJ350E_L3
NOTE:
• -XX, -X mean standardized parts, so they may have some differ-
• -XX, -X mean standardized parts, so they may have some differ-
ences from the original one.
• Items marked “*” are not stocked since they are seldom required for
routine service. Some delay should be anticipated when ordering
these items.
these items.
• The mechanical parts with no reference number in the exploded
views are not supplied.
• Due to standardization, replacements in the parts list may be dif-
ferent from the parts specified in the diagrams or the components
used on the set.
used on the set.
• CAPACITORS:
uF:
uF:
μF
• COILS
uH:
uH:
μH
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F:
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F:
nonflammable
• SEMICONDUCTORS
In each case, u: μ, for example:
uA...:
In each case, u: μ, for example:
uA...:
μA... , uPA... , μPA... ,
uPB...
,
μPB... , uPC... , μPC... ,
uPD...,
μPD...
The components identified by mark 0
or dotted line with mark 0 are critical
for safety.
Replace only with part number specified.
Les composants identifiés par une mar-
que 0 sont critiques pour la sécurité.
Replace only with part number specified.
Les composants identifiés par une mar-
que 0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
portant le numéro spécifié.
When indicating parts by reference num-
ber, please include the board name.
ber, please include the board name.
1-889-592-11
AN-1006 FLEXIBLE BOARD
********************
A-1903-090-A CM-1004 BOARD, COMPLETE
***********************
(CP001 is not supplied, but this is included in CM-1004 COMPLETE BOARD.)
< CAPACITOR >
C6703 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C6708 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C6709 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C6710 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C6711 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C6712 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C6713 1-165-884-91 CERAMIC
CHIP 2.2uF
10% 6.3V
C6714 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C6715 1-116-724-11 CERAMIC
CHIP 4.7uF
20% 6.3V
C6716 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C6717 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C6718 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C6720 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C6728 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C6729 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C6743 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C6745 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
< CONNECTOR >
* CN6702 1-821-503-11
CONNECTOR, FPC (ZIF) 39P
< COMPOSITION CIRCUIT BLOCK >
CP001 (Not
supplied) IMX167CQL-13
< IC >
IC6703 6-715-211-01
IC MM3404A28URE
< RESISTOR >
R6707 1-218-973-11 METAL
CHIP
47K
5%
1/16W
1-887-155-11
FP-2060 FLEXIBLE BOARD (PJ340/PJ340E/
PJ350/
PJ350E)
********************
A-1903-100-A FP-2106 FLEXIBLE BOARD, COMPLETE
(Projector Model)
*******************************
< CONNECTOR >
CN5503 1-842-687-11
CONNECTOR, BOARD TO BOARD 42P
1-889-097-11
FP-2184 FLEXIBLE BOARD (Non Projector Model)
********************
1-889-184-11
FP-2190 FLEXIBLE BOARD
********************
1-889-185-11
FP-2191 FLEXIBLE BOARD
********************
1-889-187-11
FP-2193 FLEXIBLE BOARD (Projector Model)
********************
1-889-209-11
FP-2200 FLEXIBLE BOARD
********************
A-1994-762-A JK-1009 BOARD, COMPLETE
***********************
< CAPACITOR >
* C2201 1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
* C2202 1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
* C7701 1-118-033-11 CERAMIC CHIP 0.047uF 10%
10V
* C7702 1-118-033-11 CERAMIC CHIP 0.047uF 10%
10V
C7703 1-118-029-11 CERAMIC
CHIP 0.0022uF 10% 16V
* C7704 1-118-458-11 CERAMIC CHIP 0.1uF
10%
6.3V
C7705 1-118-029-11 CERAMIC
CHIP 0.0022uF 10% 16V
* C7706 1-118-458-11 CERAMIC CHIP 0.1uF
10%
6.3V
< CONNECTOR >
CN4200 1-842-897-11
CONNECTOR, FPC (ZIF) 45P
< IC >
* IC2201 6-719-361-01
IC MM3416A28URE
< SENSOR >
SE7701 8-826-002-51
GYRO SENSOR GSU-X370D/N-S (PITCH/YAW)
A-1992-197-A MM-102 BOARD, COMPLETE (
PJ350/
PJ350E)
A-1994-766-A MM-102 BOARD, COMPLETE (PJ340/PJ340E)
**********************
< CAPACITOR >
C8102 1-118-465-11 CERAMIC
CHIP 4.7uF
10% 16V
C8103 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8104 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
* C8701 1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
< CONNECTOR >
* CN8101 1-816-647-61
FFC/FPC CONNECTOR (LIF) 18P
< IC >
* IC8101 6-721-326-01
IC THGBM7G8T4JBAIRH10 (
PJ350/
PJ350E)
* IC8101 6-721-332-01
IC THGBM5G7A2JBAIRA10 (PJ340/PJ340E)
IC8701 6-716-442-11
IC MM3404A29URE
2-2. ELECTRICAL PARTS LIST
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Note 2: Replace the battery holder (BH4500 or BH4600) together
when replacing the lithium storage battery (BT4500 or
BT4600) on the PD-1028 board or PD-1029 board. (The
battery holder removed once cannot be used again.)
When mounting these parts, mount new battery holder first
and attach new lithium battery next.
BT4600) on the PD-1028 board or PD-1029 board. (The
battery holder removed once cannot be used again.)
When mounting these parts, mount new battery holder first
and attach new lithium battery next.
Note1 : Be sure to read “Precautions for Replacement of Imager”
on page 6-1 when changing the imager.
AN-1006
CM-1004
FP-2060
FP-2106
FP-2184
FP-2190
FP-2191
FP-2193
FP-2200
JK-1009
MM-102
The components identified by mark contain confidential information.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
Destroy and discard the prescribed board and IC after they are
replaced.
paired and/or replaced.
Destroy and discard the prescribed board and IC after they are
replaced.
Les composants identifiés par le symbole contiennent des infor-
mations confidentielles.
Suivez scrupuleusement les instructions chaque fois qu'un com-
posant est remplacé et / ou réparé.
Veuillez détruire et éliminer les circuits imprimés et / ou les circuits
intégrés que vous avez remplacés.
Suivez scrupuleusement les instructions chaque fois qu'un com-
posant est remplacé et / ou réparé.
Veuillez détruire et éliminer les circuits imprimés et / ou les circuits
intégrés que vous avez remplacés.
标识有
的元件包含机密信息。
更换或维修元件时，请严格遵守指⽰。
更换后的电路板和IC，应予以报废。
更换后的电路板和IC，应予以报废。
注意
如果电池更换不当会有爆炸危险。
只能用同样类型或等效类型的电池来更换。
务必按照说明处置用完的电池。
只能用同样类型或等效类型的电池来更换。
务必按照说明处置用完的电池。
The changed portions from
Ver. 1.0 are shown in blue.
Ver. 1.0 are shown in blue.
Ver. 1.1 2014.03
2-2
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
HDR-CX330/CX330E/PJ330E/PJ340/PJ340E/PJ350/PJ350E_L3
< RESISTOR >
R8101 1-218-965-11 METAL
CHIP
10K
5%
1/16W
R8103 1-218-990-81 SHORT
CHIP
0
R8104 1-218-990-81 SHORT
CHIP
0
R8105 1-218-990-81 SHORT
CHIP
0
R8106 1-218-990-81 SHORT
CHIP
0
R8107 1-218-990-81 SHORT
CHIP
0
R8108 1-218-990-81 SHORT
CHIP
0
R8109 1-218-990-81 SHORT
CHIP
0
R8110 1-218-990-81 SHORT
CHIP
0
R8112 1-218-990-81 SHORT
CHIP
0
< COMPOSITION CIRCUIT BLOCK >
RB8101 1-242-962-21
RES, NETWORK 82 (1005X4)
RB8102 1-242-962-21
RES, NETWORK 82 (1005X4)
A-1994-877-A PD-1028 BOARD, COMPLETE (SERVICE)
(Non Projector Model)
******************************
(S4501 is not supplied, but this is included in PD-1028 COMPLETE BOARD
(SERVICE).)
(BT4500 is not included in PD-1028 COMPLETE BOARD (SERVICE).)
(SERVICE).)
(BT4500 is not included in PD-1028 COMPLETE BOARD (SERVICE).)
< BATTERY HOLDER >
BH4500 1-251-928-21
SOCKET, BATTERY
< BATTERY >
BT4500 1-756-134-15
BATTERY, LITHIUM (SECONDARY)
< CAPACITOR >
* C4501 1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
* C4503 1-118-458-11 CERAMIC CHIP 0.1uF
10%
6.3V
C8040 1-118-045-11 CERAMIC
CHIP 2.2uF
10% 25V
C8041 1-116-729-11 CERAMIC
CHIP 2.2uF
20% 10V
C8042 1-118-462-11 CERAMIC
CHIP 1uF
10% 10V
C8043 1-118-462-11 CERAMIC
CHIP 1uF
10% 10V
C8044 1-118-040-11 CERAMIC
CHIP 2.2uF
10% 16V
C8045 1-116-729-11 CERAMIC
CHIP 2.2uF
20% 10V
C8046 1-118-039-11 CERAMIC
CHIP 1uF
10% 25V
C8047 1-116-729-11 CERAMIC
CHIP 2.2uF
20% 10V
C8048 1-116-729-11 CERAMIC
CHIP 2.2uF
20% 10V
C8049 1-118-039-11 CERAMIC
CHIP 1uF
10% 25V
< CONNECTOR >
* CN4500 1-821-503-11
CONNECTOR, FPC (ZIF) 39P
* CN8040 1-821-503-11
CONNECTOR, FPC (ZIF) 39P
< COIL >
* L4500 1-481-102-21 INDUCTOR
10uH
< RESISTOR >
R4503 1-218-954-11 METAL
CHIP
1.2K
5%
1/16W
R4508 1-218-960-11 METAL
CHIP
3.9K
5%
1/16W
R4510 1-218-964-81 METAL
CHIP
8.2K
5%
1/16W
R4513 1-218-977-11 METAL
CHIP
100K
5%
1/16W
< COMPOSITION CIRCUIT BLOCK >
RB4500 1-234-375-21
RES, NETWORK 1K (1005X4)
RB4501 1-234-388-21
RES, NETWORK 1.5K (1005X4)
< SWITCH >
* S4500 1-786-914-51 SWITCH, TACTILE
S4501 (Not
S4501 (Not
supplied) SWITCH,
TACTILE
< SENSOR >
* SE4500 1-487-118-31 GMR SENSOR
A-1994-888-A PD-1029 BOARD, COMPLETE (SERVICE)
(Projector Model)
******************************
(IC8010 and S4601 are not supplied, but they are included in PD-1029 COMPLETE
BOARD (SERVICE).)
(BT4600 is not included in PD-1029 COMPLETE BOARD (SERVICE).)
BOARD (SERVICE).)
(BT4600 is not included in PD-1029 COMPLETE BOARD (SERVICE).)
< BATTERY HOLDER >
BH4600 1-251-928-21
SOCKET, BATTERY
< BATTERY >
BT4600 1-756-134-15
BATTERY, LITHIUM (SECONDARY)
< CAPACITOR >
C3700 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C3701 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
* C4601 1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
* C4603 1-118-458-11 CERAMIC CHIP 0.1uF
10%
6.3V
C8040 1-118-045-11 CERAMIC
CHIP 2.2uF
10% 25V
C8041 1-116-729-11 CERAMIC
CHIP 2.2uF
20% 10V
C8042 1-118-462-11 CERAMIC
CHIP 1uF
10% 10V
C8043 1-118-462-11 CERAMIC
CHIP 1uF
10% 10V
C8044 1-118-040-11 CERAMIC
CHIP 2.2uF
10% 16V
C8045 1-116-729-11 CERAMIC
CHIP 2.2uF
20% 10V
C8046 1-118-039-11 CERAMIC
CHIP 1uF
10% 25V
C8047 1-116-729-11 CERAMIC
CHIP 2.2uF
20% 10V
C8048 1-116-729-11 CERAMIC
CHIP 2.2uF
20% 10V
C8049 1-118-039-11 CERAMIC
CHIP 1uF
10% 25V
< CONNECTOR >
CN3700 1-821-652-11
CONNECTOR, BOARD TO BOARD (REC
* CN4600 1-821-501-11
CONNECTOR, FPC (ZIF) 51P
* CN8040 1-821-503-11
CONNECTOR, FPC (ZIF) 39P
< FERRITE BEAD >
FB3700 1-469-580-21
INDUCTOR, FERRITE BEAD (1005)
< IC >
IC8010 (Not supplied) IC BU79R272-E2
< COIL >
* L4600 1-481-102-21 INDUCTOR
10uH
< RESISTOR >
R3706 1-240-683-91 METAL
CHIP
100
5%
1/20W
R4607 1-218-977-11 METAL
CHIP
100K
5%
1/16W
R4608 1-218-954-11 METAL
CHIP
1.2K
5%
1/16W
R4613 1-218-960-11 METAL
CHIP
3.9K
5%
1/16W
R4614 1-218-964-81 METAL
CHIP
8.2K
5%
1/16W
R4619 1-218-970-81 METAL
CHIP
27K
5%
1/16W
< COMPOSITION CIRCUIT BLOCK >
RB4600 1-234-375-21
RES, NETWORK 1K (1005X4)
RB4601 1-234-388-21
RES, NETWORK 1.5K (1005X4)
< SWITCH >
* S4600 1-786-914-51 SWITCH, TACTILE
S4601 (Not
S4601 (Not
supplied) SWITCH,
TACTILE
* S4602 1-786-914-51 SWITCH, TACTILE
< SENSOR >
* SE4600 1-487-118-31 GMR SENSOR
A-1994-765-A PJ-1009 BOARD, COMPLETE (Projector Model)
**********************
(IC8504, IC8605, IC8606, IC8801 and R8815 are not supplied, but they are included in
PJ-1009 COMPLETE BOARD.)
PJ-1009 COMPLETE BOARD.)
< CAPACITOR >
* C8510 1-116-720-11 CERAMIC CHIP 10uF
20%
6.3V
C8540 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
* C8543 1-118-035-11 CERAMIC CHIP 0.1uF
10%
25V
C8545 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C8547 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8548 1-118-462-11 CERAMIC
CHIP 1uF
10% 10V
C8549 1-118-462-11 CERAMIC
CHIP 1uF
10% 10V
C8551 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8602 1-164-856-81 CERAMIC
CHIP 18PF
5%
50V
C8603 1-164-856-81 CERAMIC
CHIP 18PF
5%
50V
C8605 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8606 1-118-459-11 CERAMIC
CHIP 0.01uF 10% 25V
C8607 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8609 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8610 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8618 1-118-462-11 CERAMIC
CHIP 1uF
10% 10V
C8619 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8627 1-118-462-11 CERAMIC
CHIP 1uF
10% 10V
C8628 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8701 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8703 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8710 1-118-462-11 CERAMIC
CHIP 1uF
10% 10V
C8801 1-118-462-11 CERAMIC
CHIP 1uF
10% 10V
C8803 1-118-037-11 CERAMIC
CHIP 0.22uF 10% 25V
C8804 1-118-039-11 CERAMIC
CHIP 1uF
10% 25V
C8805 1-116-729-11 CERAMIC
CHIP 2.2uF
20% 10V
C8806 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8810 1-116-729-11 CERAMIC
CHIP 2.2uF
20% 10V
* C8814 1-116-720-11 CERAMIC CHIP 10uF
20%
6.3V
C8816 1-118-462-11 CERAMIC
CHIP 1uF
10% 10V
C8817 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8818 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C8824 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
< CONNECTOR >
* CN8502 1-816-643-51
FFC/CONNECTOR, FPC (LIF) 10P
CN8503 1-822-395-51
CONNECTOR, BOARD TO BOARD 60P
CN8504 1-842-897-11
CONNECTOR, FPC (ZIF) 45P
< DIODE >
D8501
6-503-126-01
DIODE DA2S10100K8
D8801
6-502-934-01
DIODE DB2S31100K8
< FERRITE BEAD >
FB8601 1-481-984-21
EMI FERRITE (SMD)(1005)
< IC >
IC8504 (Not supplied) IC MM3411A10URE
IC8605 (Not supplied) IC DPP2601
IC8606 (Not supplied) IC W25X40CLPYA1
* IC8701 6-721-275-01
IC8605 (Not supplied) IC DPP2601
IC8606 (Not supplied) IC W25X40CLPYA1
* IC8701 6-721-275-01
IC W948D6FBHX5E-ER25
IC8801 (Not supplied) IC PAD1000YFFR
< COIL >
L8801 1-481-035-11 INDUCTOR
10uH
L8802 1-457-526-11 INDUCTOR
2.2uH
<
TRANSISTOR
>
Q301 6-550-576-01 TRANSISTOR SSM6E01TU
< RESISTOR >
R8518 1-218-959-11 METAL
CHIP
3.3K
5%
1/16W
R8519 1-218-977-11 METAL
CHIP
100K
5%
1/16W
R8520 1-220-398-11 METAL
CHIP
1.5M
5%
1/16W
R8521 1-218-967-11 METAL
CHIP
15K
5%
1/16W
R8522 1-218-968-11 METAL
CHIP
18K
5%
1/16W
R8524 1-218-977-11 METAL
CHIP
100K
5%
1/16W
R8611 1-218-941-81 METAL
CHIP
100
5%
1/16W
R8612 1-250-567-11 METAL
CHIP
1M
1%
1/16W
R8620 1-218-935-11 METAL
CHIP
33
5%
1/16W
R8621 1-218-935-11 METAL
CHIP
33
5%
1/16W
R8635 1-218-990-81 SHORT
CHIP
0
R8638 1-218-977-11 METAL
CHIP
100K
5%
1/16W
R8639 1-218-977-11 METAL
CHIP
100K
5%
1/16W
R8640 1-218-977-11 METAL
CHIP
100K
5%
1/16W
R8702 1-218-971-11 METAL
CHIP
33K
5%
1/16W
R8813 1-218-977-11 METAL
CHIP
100K
5%
1/16W
R8815
(Not supplied) METAL CHIP
0.1
1%
0.12W
R8818 1-218-935-11 METAL
CHIP
33
5%
1/16W
< COMPOSITION CIRCUIT BLOCK >
RB8601 1-234-381-11
RES, NETWORK 100K (1005X4)
RB8604 1-234-381-11
RES, NETWORK 100K (1005X4)
< VIBRATOR >
X8601
1-814-480-11
QUARTZ CRYSTAL OSCILLATOR (16.66667MHz)
MM-102
PD-1028
PD-1029
PJ-1009
