Read Sony GDM-17SE2T (serv.man2) Service Manual online
CHASSIS
SERVICE MANUAL
MICROFILM
SPECIFICATIONS
GDM-17SE2T
TRINITRON
®
COLOR GRAPHIC DISPLAY
N-2
R E V I S E D
US Model
Canadian Model
AEP Model
UK Model
Chassis No. SCC-J37A-A
S. Hemisphere Model
Chassis No. SCC-J75C-A
GDM-17SE2T
– 2 –
PRIMARY MODE
PRIMARY
MODE AT PRODUCTION
MODE1
MODE2
MODE3
MODE4
MODE5
MODE6
MODE7
MODE8
MODE9
MODE10
RESOLUTION
640 X 480
720 X 400
640 X 480
832 X 624
800 X 600
1024 X 768
1280 X 1024
1024 X 768
1152 X 870
1280 X 1024
CLOCK
25.175 MHz
28.322 MHz
36.000 MHz
57.285 MHz
56.250 MHz
80.000 MHz
108.500 MHz
94.500 MHz
100.000 MHz 135.000 MHz
— HORIZONTAL —
H-FREQ
31.469 kHz
31.469 kHz
43.269 kHz
49.727 kHz
53.674 kHz
60.241 kHz
63.974 kHz
68.677 kHz
68.681 kHz
79.976 kHz
usec
usec
usec
usec
usec
usec
usec
usec
usec
usec
H. TOTAL
31.778
31.777
23.111
20.110
18.631
16.600
15.631
14.561
14.560
12.504
H. BLK
6.356
6.355
5.333
5.586
4.409
3.800
3.834
3.725
3.040
3.022
H. FP
0.636
0.636
1.556
0.559
0.569
0.550
0.590
0.508
0.320
0.119
H. SYNC
3.813
3.813
1.556
1.117
1.138
1.200
1.180
1.016
1.280
1.067
H. BP
1.907
1.907
2.222
3.910
2.702
2.050
2.065
2.201
1.440
1.837
H. ACTIV
25.422
25.422
17.778
14.524
14.222
12.800
11.797
10.836
11.520
9.481
— VERTICAL —
V. FREQ(HZ)
59.940 Hz
70.087 Hz
85.008 Hz
74.553 Hz
85.061 Hz
74.927 Hz
60.013 Hz
84.997 Hz
75.062 Hz
75.025 Hz
lines
lines
lines
lines
lines
lines
lines
lines
lines
lines
V. TOTAL
525
449
509
667
631
804
1066
808
915
1066
V. BLK
45
49
29
43
31
36
42
40
45
42
V. FP
10
13
1
3
1
3
1
1
3
1
V. SYNC
2
2
3
3
3
3
3
3
3
3
V. BP
33
34
25
37
27
30
38
36
39
38
V. ACTIV
480
400
480
624
600
768
1024
768
870
1024
— SYNC —
INT(G)
NO
NO
NO
NO
NO
NO
NO
NO
NO
NO
EXT(H/V)/POLARITY
YES N/N
YES N/P
YES N/N
YES N/N
YES P/P
YES N/N
YES P/P
YES P/P
YES N/N
YES P/P
EXT(CS) /POLARITY
NO
NO
NO
NO
NO
NO
NO
NO
NO
NO
INT/NON INT
NON INT
NON INT
NON INT
NON INT
NON INT
NON INT
NON INT
NON INT
NON INT
NON INT
96.11.26 VER.
TIMING SPECIFICATION
DIAGNOSIS
Failure
HV failure
Horizontal/Vertical deflection failure, thermal
protector
protector
ABL protector
Aging/Self Test
Aging Mode: Raster aging
During Power Save, press “OPTION” Key for longer than 2 seconds.
Self Test: OSD color-bar indication
During Power Save, press “CONTRAST+(l)” Key for longer than 2 seconds.
Power Saving LED
Off
Blink Amber
Blink Amber
Off
Power LED
Blink Amber
Off
Blink Amber
Blink Amber, Off, Green and Off
POWER SAVING FUNCTION
This monitor is capable of three states of reduced power consumption. By sensing the absence of video signals and one or both sync signals
coming from the host computer, it will reduce power consumption as follows.
coming from the host computer, it will reduce power consumption as follows.
Recovery time
–
Approx. 3 sec.
Approx. 3 sec.
Approx. 10 sec.
–
Power consumption
≤
140 W
≤
100 W
≤
15 W
≤
5 W
0 W
Power consumption
state
state
1 Normal operation
2 Standby (1st state)
3 Suspend (2nd state)
4 Active-off (3rd state)
5 Power-off
u
power indicator
Green on
Green on
Green on
Off
Off
power saving indicator
Off
Orange on
Orange on
Orange on
Off
– 3 –
GDM-17SE2T
SAFETY CHECK-OUT
(US Model only)
1.5 k
Ω
0.15 µF
AC
Voltmeter
(0.75 V)
Voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
1.
Check the area of your repair for unsoldered or poorly-sol-
dered connections. Check the entire board surface for solder
splashes and bridges.
2.
Check the interboard wiring to ensure that no wires are
“pinched” or contact high-wattage resistors.
3.
Check that all control knobs, shields, covers, ground straps,
and mounting hardware have been replaced. Be absolutely
certain that you have replaced all the insulators.
4.
Look for unauthorized replacement parts, particularly tran-
sistors, that were installed during a previous repair. Point
them out to the customer and recommend their replacement.
5.
Look for parts which, though functioning, show obvious
signs of deterioration. Point them out to the customer and
recommend their replacement.
6.
Check the line cords for cracks and abrasion. Recommend
the replacement of any such line cord to the customer.
7.
Check the B+ and HV to see if they are specified values.
Make sure your instruments are accurate; be suspicious of
your HV meter if sets always have low HV.
8.
Check the antenna terminals, metal trim, “metallized”
knobs, screws, and all other exposed metal parts for AC
Leakage. Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground
and from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.
1.
A commercial leakage tester, such as the Simpson 229 or
RCA WT-540A. Follow the manufacturers’ instructions to
use these instruments.
2.
A battery-operated AC milliammeter. The Data Precision
245 digital multimeter is suitable for this job.
3.
Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are
examples of a passive VOMs that are suitable. Nearly all
battery operated digital multimeters that have a 2 V AC
range are suitable. (See Fig. A)
WARNING!!
NEVER TURN ON THE POWER IN A CONDITION IN
WHICH THE DEGAUSS COIL HAS BEEN REMOVED.
WHICH THE DEGAUSS COIL HAS BEEN REMOVED.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY SHADING AND MARK
¡
ON THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS
AND IN THE PARTS LIST ARE CRITICAL FOR SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY. CIRCUIT ADJUSTMENTS THAT
ARE CRITICAL FOR SAFE OPERATION ARE IDENTIFIED
IN THIS MANUAL. FOLLOW THESE PROCEDURES
WHENEVER CRITICAL COMPONENTS ARE REPLACED
OR IMPROPER OPERATION IS SUSPECTED.
AND IN THE PARTS LIST ARE CRITICAL FOR SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY. CIRCUIT ADJUSTMENTS THAT
ARE CRITICAL FOR SAFE OPERATION ARE IDENTIFIED
IN THIS MANUAL. FOLLOW THESE PROCEDURES
WHENEVER CRITICAL COMPONENTS ARE REPLACED
OR IMPROPER OPERATION IS SUSPECTED.
AVERTISSEMENT!!
NE JAMAIS METTRE SOUS TENSION QUAND LA
BOBINE DE DEMAGNETISATION EST ENLEVÉE.
BOBINE DE DEMAGNETISATION EST ENLEVÉE.
ATTENTION AUX COMPOSANTS RELATIFS À LA
SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE TRAME ET
UNE MARQUE
UNE MARQUE
¡
SONT CRITIQUES POUR LA
SÉCURITÉ. NE LES REMPLACER QUE PAR UNE PIÈCE
PORTANT LE NUMÉRO SPECIFIÉ. LES RÉGLAGES DE
CIRCUIT DONT L’IMPORTANCE EST CRITIQUE POUR
LA SÉCURITÉ DU FONCTIONNEMENT SONT
IDENTIFIÉS DANS LE PRÉSENT MANUEL. SUIVRE CES
PROCÉDURES LORS DE CHAQUE REMPLACEMENT DE
COMPOSANTS CRITIQUES, OU LORSQU’UN MAUVAIS
FONCTIONNE-MENT EST SUSPECTÉ.
PORTANT LE NUMÉRO SPECIFIÉ. LES RÉGLAGES DE
CIRCUIT DONT L’IMPORTANCE EST CRITIQUE POUR
LA SÉCURITÉ DU FONCTIONNEMENT SONT
IDENTIFIÉS DANS LE PRÉSENT MANUEL. SUIVRE CES
PROCÉDURES LORS DE CHAQUE REMPLACEMENT DE
COMPOSANTS CRITIQUES, OU LORSQU’UN MAUVAIS
FONCTIONNE-MENT EST SUSPECTÉ.
GDM-17SE2T
– 4 –
TABLE OF CONTENTS
Section
Title
Page
1. GENERAL
..................................................................
5
2. DISASSEMBLY
2-1.
Cabinet Removal .................................................. 10
2-2.
A Board Removal ................................................ 10
2-3.
Rear Panel Removal ............................................. 11
2-4.
D Board Removal ................................................ 11
2-5.
Service Position .................................................... 12
2-6.
Bezel Assy Removal ............................................. 12
2-7.
Picture Tube Removal .......................................... 13
3. SAFETY RELATED ADJUSTMENT
............. 14
4. ADJUSTMENTS
...................................................... 15
5. DIAGRAMS
5-1.
Block Diagram
(With Frame Schematic Diagram) ........................ 17
5-2.
Circuit Boards Location ........................................ 20
5-3.
Schematic Diagrams and Printed Wiring Boards
(1) Schematic Diagram of D Board ............................ 23
(2) Schematic Diagram of A, N Boards ..................... 27
5-4.
Semiconductors ..................................................... 33
6. EXPLODED VIEWS
7-1.
Chassis ................................................................. 35
7-2.
Picture Tube ......................................................... 36
7-3.
Accessories and Packing Materials ....................... 37
7. ELECTRICAL PARTS LIST
............................ 38
