Read Sony CPD-G520 Service Manual online
CPD-G520
– 5 –
Note: Hand degauss must be used on stand-by or power-off condition.
This model has an automatic earth magnetism correction function by using an earth
magnetism sensor and a LCC coil. When using a hand degauss while monitor (LCC
coil) is being operated, it sometimes gets magnetized, and the system may not work
properly as a result.
Section
Title
Page
TABLE OF CONTENTS
Section
Title
Page
1. GENERAL
................................................................. 1-1
2. DISASSEMBLY
2-1.
Cabinet Removal ............................................... 2-1
2-2.
A1 Board (C Block) Removal ........................... 2-1
2-3.
A1 Board, US Board Removal .......................... 2-2
2-4.
Bezel Assembly, H1 Board,
Magnetic Sensor Removal ................................ 2-3
2-5.
D Board Removal .............................................. 2-3
2-6.
Service Position .................................................. 2-4
2-7.
Picture Tube Removal ........................................ 2-5
2-8.
Harness Location ............................................... 2-6
3. SAFETY RELATED ADJUSTMENT
............. 3-1
4. ADJUSTMENTS
..................................................... 4-1
5. DIAGRAMS
5-1.
Block Diagrams .................................................. 5-1
5-2.
Frame Schematic Diagram ................................. 5-7
5-3.
Circuit Boards Location ..................................... 5-9
5-4.
Schematic Diagrams and Printed Wiring
Boards ................................................................. 5-9
(1)
Schematic Diagram of A1 Board ...................... 5-11
(2)
Schematic Diagram of US Board
(Only AEP, NH, SH, EQ models) .................... 5-15
(3)
Schematic Diagram of DA Board ..................... 5-17
(4)
Schematic Diagram of N Board ........................ 5-19
(5)
Schematic Diagrams of
D (a, b, c) Board ........................................ 5-21
(6)
Schematic Diagram of H1 Board ....................... 5-29
(7)
Schematic Diagram of L2 Board ....................... 5-31
5-5.
Semiconductors ................................................. 5-33
6. EXPLODED VIEWS
6-1-1. Chassis < U/C model Japan made-set and
NH, SH, EQ models > ....................................... 6-1
6-1-2. Picture Tube < U/C model Japan made-set and
NH, SH, EQ models > ....................................... 6-2
6-1-3. Packing Materials < U/C model Japan
made-set and NH, SH, EQ models > ................. 6-3
6-2-1. Chassis
#3 < U/C model Mexico made-set >
... 6-4
6-2-2. Picture Tube
#3 < U/C model Mexico made-set >
................. 6-5
6-2-3. Packing Materials
#3 < U/C model Mexico made-set >
.................. 6-6
6-3-1. Chassis
#4 < AEP model >
............................... 6-7
6-3-2. Picture Tube
#4 < AEP model >
....................... 6-8
6-3-3. Packing Materials
#4 < AEP model >
............... 6-9
7. ELECTRICAL PARTS LIST
............................ 7-1
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