CPD-G500 - Sony Monitor Service Manual (repair manual). Page 5

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CPD-G500
– 5 –
Note: Hand degauss must be used on stand-by or power-off condition.
This model has an automatic earth magnetism correction function by using an earth
magnetism sensor and a LCC coil. When using a hand degauss while monitor (LCC
coil) is being operated, it sometimes gets magnetized, and the system may not work
properly as a result.
TABLE  OF  CONTENTS
Section
Title
Page
1. GENERAL
................................................................. 1-1
2. DISASSEMBLY
2-1.
Cabinet Removal ............................................... 2-1
2-2.
D Board Removal .............................................. 2-1
2-3.
G Board Removal .............................................. 2-2
2-4.
A Board, I/O Terminal Board Assembly
Removal ............................................................. 2-2
2-5.
N Board Removal .............................................. 2-3
2-6.
Service Position .................................................. 2-3
2-7.
Bezel Assembly, H1 Board Removal ................ 2-4
2-8.
Picture Tube Removal ....................................... 2-4
2-9.
J Board Removal ............................................... 2-5
2-10. Harness Location ............................................... 2-6
3. SAFETY  RELATED  ADJUSTMENT
............. 3-1
4. ADJUSTMENTS
..................................................... 4-1
5. DIAGRAMS
5-1.
Block Diagrams .................................................. 5-1
5-2.
Frame Shcematic Diagram ................................. 5-7
5-3.
Circuit Boards Location ..................................... 5-9
5-4.
Schematic Diagrams and Printed Wiring
Boards ................................................................. 5-9
(1)
Schematic Diagram of A Board ........................ 5-11
(2)
Schematic Diagrams of H1, J Boards ............... 5-17
(3)
Schematic Diagram of D Board ........................ 5-19
(4)
Schematic Diagrams of N (a, b, c) Board .. 5-23
(5)
Schematic Diagram of G Board ........................ 5-31
5-5.
Semiconductors ................................................. 5-35
6. EXPLODED  VIEWS
6-1.
Chassis ............................................................... 6-1
6-2.
Picture Tube ...................................................... 6-2
6-3.
Packing Materials ............................................... 6-3
7. ELECTRICAL  PARTS  LIST
............................ 7-1
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