Read Sony DAV-DZ119 / DAV-DZ410 / HCD-DZ119 / HCD-DZ410 Service Manual online
SERVICE MANUAL
Sony Corporation
Home Audio Division
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
AEP Model
HCD-DZ119/DZ410
UK Model
HCD-DZ410
DVD RECEIVER
9-887-190-02
2006I16-1
© 2006.09
© 2006.09
Ver. 1.1 2006.09
HCD-DZ119/DZ410
• HCD-DZ119 is the amplifier, DVD/CD and
tuner section in DAV-DZ119.
• HCD-DZ410 is the amplifier, DVD/CD and
tuner section in DAV-DZ410.
SPECIFICATIONS
Model Name Using Similar Mechanism
HCD-DZ110
Mechanism Type
CDM85-DVBU102
Optical Pick-up Name
KHM-310CAA
This system incorporates with Dolby*
1
Digital and Dolby Pro Logic (II)
adaptive matrix surround decoder and the DTS*
2
Digital Surround
System.
*1 Manufactured under license from Dolby Laboratories.
*1 Manufactured under license from Dolby Laboratories.
“Dolby,” “Pro Logic,” and the double-D symbol are trademarks of
Dolby Laboratories.
Dolby Laboratories.
*2 Manufactured under license from Digital Theater Systems, Inc.
“DTS” and “DTS Digital Surround” are trademarks of Digital
Theater Systems, Inc.
Theater Systems, Inc.
Stereo mode (rated)
108 W + 108 W (3 ohms at
1 kHz, 1 % THD)
Surround mode (reference) RMS output power, 10 %
THD
Front: 142 W + 142 W
(with SS-TS53)
Center*: 142 W
(with SS-CT51)
Surround*: 142 W + 142 W
(with SS-TS53)
Subwoofer*: 140 W
(with SS-WS51)
Front: 142 W + 142 W
(with SS-TS53)
Center*: 142 W
(with SS-CT51)
Surround*: 142 W + 142 W
(with SS-TS53)
Subwoofer*: 140 W
(with SS-WS51)
* Depending on the sound field settings and the source,
there may be no sound output.
Inputs (Analog)
LINE (AUDIO IN)
LINE (AUDIO IN)
Sensitivity: 450/250 mV
AUDIO IN
Sensitivity: 250/125 mV
Outputs (Analog)
Phones
Phones
Accepts low-and high-
impedance headphones.
impedance headphones.
DVD system
Laser
Semiconductor laser
(DVD:
(DVD:
λ = 650 nm)
(CD:
λ = 790 nm)
Emission duration:
continuous
continuous
Signal format system
PAL
Tuner section
System
PLL quartz-locked digital
synthesizer system
FM tuner section
Tuning range
Tuning range
87.5 – 108.0 MHz (50 kHz
step)
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals 75 ohms, unbalanced
Intermediate frequency
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Tuning range
531 – 1,602 kHz (with the
interval set at 9 kHz)
interval set at 9 kHz)
Antenna (aerial)
AM loop antenna (aerial)
Intermediate frequency
450 kHz
Video section
Outputs
VIDEO: 1 Vp-p 75 ohms
R/G/B: 0.7 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
R/G/B: 0.7 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
P
B
/C
B
, P
R
/C
R
: 0.7 Vp-p
75 ohms
Amplifier section
General
Power requirements
220 – 240 V AC, 50/60 Hz
Power consumption
On: 150 W
Standby: 0.3 W (at the
Power Saving mode)
Standby: 0.3 W (at the
Power Saving mode)
Dimensions (approx.)
430
× 55 × 360 mm (w/h/d)
incl. projecting parts
Mass (approx.)
3.8 kg
Design and specifications are subject to change
without notice.
without notice.
DZ119
DZ410
Stereo mode (rated)
108 W + 108 W (3 ohms at
1 kHz, 1 % THD)
1 kHz, 1 % THD)
Surround mode (reference) RMS output power, 10 %
THD
Front: 142 W + 142 W
(with SS-TS51)
Center*: 142 W
(with SS-CT51)
Surround*: 142 W + 142 W
(with SS-TS51)
Subwoofer*: 140 W
(with SS-WS51)
Front: 142 W + 142 W
(with SS-TS51)
Center*: 142 W
(with SS-CT51)
Surround*: 142 W + 142 W
(with SS-TS51)
Subwoofer*: 140 W
(with SS-WS51)
Photo : HCD-DZ410
2
HCD-DZ119/DZ410
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
This marking is located on
the bottom exterior.
a CLASS 1 LASER product.
This marking is located on
the bottom exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
MODEL IDENTIFICATION
– Rear Panel –
– Rear Panel –
COAXIAL
AM
FM 75
SPEAKER
EURO AV
FRONT R
FRONT L
Part No.
SUR R
SUR L
CENTER
WOOFER
OUTPUT(TO TV)
COMPONENT VIDEO OUT
Y
P
B
/C
B
P
R
/C
R
(DVD ONLY)
R
L
AUDIO IN
LINE
Model
Part No.
HCD-DZ119
2-661-239-0
[]
HCD-DZ410
2-661-238-3
[]
3
HCD-DZ119/DZ410
TABLE OF CONTENTS
1.
SERVICING NOTE
...................................................
4
2.
GENERAL
...................................................................
9
3.
DISASSEMBLY
3-1.
Disassembly Flow ........................................................... 12
3-2.
Case, Front Panel Assy .................................................... 13
3-3.
FL Board .......................................................................... 14
3-4.
JACK Board, SW Board .................................................. 14
3-5.
I/O SCART Board ........................................................... 15
3-6.
MAIN Board .................................................................... 15
3-7.
DC Fan, Tuner Unit ......................................................... 16
3-8.
POWER Board ................................................................ 16
3-9.
DVD Mechanism Deck (CDM85-DVBU102) ................ 17
3-10. Tray .................................................................................. 17
3-11. Belt, MS-203 Board ........................................................ 18
3-12. Optical Pick-up (KHM-310CAA) ................................... 19
3-11. Belt, MS-203 Board ........................................................ 18
3-12. Optical Pick-up (KHM-310CAA) ................................... 19
4.
TEST MODE
............................................................... 20
5.
ELECTRICAL ADJUSTMENT
............................. 24
6.
DIAGRAMS
6-1.
Block Diagram – RF Section – ....................................... 26
6-2.
Block Diagram – AMP Section – ................................... 27
6-3.
Block Diagram – AUDIO Section – ............................... 28
6-4.
Block Diagram – VIDEO Section – ............................... 29
6-5.
Block Diagram – POWER Section – .............................. 30
6-6.
Printed Wiring Board – MAIN Board (Side A) – ............ 31
6-7.
Printed Wiring Board – MAIN Board (Side B) – ............ 32
6-8.
Schematic Diagram – MAIN Board (1/10) – ................. 33
6-9.
Schematic Diagram – MAIN Board (2/10) – ................. 34
6-10. Schematic Diagram – MAIN Board (3/10) – ................. 35
6-11. Schematic Diagram – MAIN Board (4/10) – ................. 36
6-12. Schematic Diagram – MAIN Board (5/10) – ................. 37
6-13. Schematic Diagram – MAIN Board (6/10) – ................. 38
6-14. Schematic Diagram – MAIN Board (7/10) – ................. 39
6-15. Schematic Diagram – MAIN Board (8/10) – ................. 40
6-16. Schematic Diagram – MAIN Board (9/10) – ................. 41
6-17. Schematic Diagram – MAIN Board (10/10) – ............... 42
6-18. Printed Wiring Board – I/O SCART Board (Side A) – ... 43
6-19. Printed Wiring Board – I/O SCART Board (Side B) – ... 44
6-20. Schematic Diagram – I/O SCART Board – .................... 45
6-21. Printed Wiring Board – PANEL Section – ...................... 46
6-22. Schematic Diagram – PANEL Section – ....................... 47
6-23. Printed Wiring Board – SPEAKER Board – ................... 48
6-24. Schematic Diagram – SPEAKER Board – .................... 48
6-25. Printed Wiring Board – MS-203 Board – ........................ 49
6-26. Schematic Diagram – MS-203 Board – ........................ 49
6-27. Printed Wiring Board – POWER Board – ....................... 50
6-28. Schematic Diagram – POWER Board – ........................ 51
6-11. Schematic Diagram – MAIN Board (4/10) – ................. 36
6-12. Schematic Diagram – MAIN Board (5/10) – ................. 37
6-13. Schematic Diagram – MAIN Board (6/10) – ................. 38
6-14. Schematic Diagram – MAIN Board (7/10) – ................. 39
6-15. Schematic Diagram – MAIN Board (8/10) – ................. 40
6-16. Schematic Diagram – MAIN Board (9/10) – ................. 41
6-17. Schematic Diagram – MAIN Board (10/10) – ............... 42
6-18. Printed Wiring Board – I/O SCART Board (Side A) – ... 43
6-19. Printed Wiring Board – I/O SCART Board (Side B) – ... 44
6-20. Schematic Diagram – I/O SCART Board – .................... 45
6-21. Printed Wiring Board – PANEL Section – ...................... 46
6-22. Schematic Diagram – PANEL Section – ....................... 47
6-23. Printed Wiring Board – SPEAKER Board – ................... 48
6-24. Schematic Diagram – SPEAKER Board – .................... 48
6-25. Printed Wiring Board – MS-203 Board – ........................ 49
6-26. Schematic Diagram – MS-203 Board – ........................ 49
6-27. Printed Wiring Board – POWER Board – ....................... 50
6-28. Schematic Diagram – POWER Board – ........................ 51
7.
EXPLODED VIEWS
7-1.
Overall Section ................................................................ 63
7-2.
Front Panel Section ......................................................... 64
7-3.
Chassis Section ................................................................ 65
7-4.
DVD Mechanism Deck Section (CDM85-DVBU102) ... 66
8.
ELECTRICAL PARTS LIST
.................................. 67
4
HCD-DZ119/DZ410
SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH
1. Open the cover and turn POWER on with no disc inserted.
2. Confirm that the following operation is performed while
2. Confirm that the following operation is performed while
observing the objecting lens.
1)
1)
Confirm that laser beam is spread.
2)
Up and down motion of the objective lens. (3 times)
DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
disc in the store is equipped.
Setting Procedure :
1. Press the ?/1 button to turn the set on.
2. Press the [FUNCTION] button to set DVD function.
3. Insert a disc.
4. Press the
2. Press the [FUNCTION] button to set DVD function.
3. Insert a disc.
4. Press the
x
button and the
A
button simultaneously for five
seconds.
5. The message “LOCKED” is displayed and the tray is locked.
Releasing Procedure :
1. Press the
x
button and the
A
button simultaneously for five
seconds again.
2. The message “UNLOCKED” is displayed and the tray is
unlocked.
Note:
When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the ?/1 button.
turning power on/off with the ?/1 button.
Note on MAIN board replacement
New part of EEP ROM (IC1103) on the MAIN board cannot be used.
Therefore, if the mounted MAIN board (A-1144-739-A, etc.) is replaced,
Therefore, if the mounted MAIN board (A-1144-739-A, etc.) is replaced,
exchange new EEP ROM (IC1103) with that used before the replacement.
When the self-diagnosis function is activated to
prevent the system from malfunctioning, a 5-
character service number (e.g., C 13 50) with a
combination of a letter and 4 digits appears on
the screen and the front panel display. In this
case, check the following table.
prevent the system from malfunctioning, a 5-
character service number (e.g., C 13 50) with a
combination of a letter and 4 digits appears on
the screen and the front panel display. In this
case, check the following table.
When displaying the version
number on the screen
number on the screen
When you turn on the system, the version
number [VER.X.XX] (X is a number) may
appear on the screen. Although this is not a
malfunction and for Sony service use only,
normal system operation will not be possible.
Turn off the system, and then turn on the system
again to operate.
number [VER.X.XX] (X is a number) may
appear on the screen. Although this is not a
malfunction and for Sony service use only,
normal system operation will not be possible.
Turn off the system, and then turn on the system
again to operate.
Self-diagnosis Function
(When letters/numbers appear in the
display)
display)
First 3
characters of
the service
number
characters of
the service
number
Cause and/or corrective action
C 13
The disc is dirty.
,Clean the disc with a soft cloth
C 31
The disc is not inserted correctly.
,Restart the system, then re-insert
the disc correctly.
E XX
(xx is a number)
To prevent a malfunction, the
system has performed the self-
diagnosis function.
system has performed the self-
diagnosis function.
,Contact your nearest Sony
dealer or local authorized Sony
service facility and give the 5-
character service number.
service facility and give the 5-
character service number.
Example: E 61 10
C:13:50
VER.X.XX
