Read Sony BDP-S1200 / BDP-S4200 Service Manual online
BDP-S1200/S4200
RMT- B126A
System
Laser: Semiconductor laser
Inputs and outputs
( Jack name:
Jack type/Output level/Load impedance)
Jack type/Output level/Load impedance)
DIGITAL OUT (COAXIAL):
Phono jack/0.5 Vp-p/75 ohms
HDMI OUT:
HDMI 19-pin standard connector
LAN (100):
100BASE-TX Terminal
USB:
USB jack Type A (For connecty card reader,
digital still camera, and digital video camera)
AC adaptor:
Input: 100 V - 240 V ~ 50/60 Hz,240 mA
Output: 12 V, 800 mA
Operating temperature: 0 ºC - 45 ºC
Operating temperature: 0 ºC - 45 ºC
DC IN::
BDP-S1200: 12 V DC,600 mA
BDP-S4200: 12 V DC,650 mA
BDP-S4200: 12 V DC,650 mA
General
Power requirements:
Power requirements:
BDP-S1200: 12 V DC (direct current),
600 mA (with AC adaptor)
BDP-S4200: 12 V DC (direct current),
650 mA (with AC adaptor)
600 mA (with AC adaptor)
BDP-S4200: 12 V DC (direct current),
650 mA (with AC adaptor)
Power consumption (when using ACadaptor):
BDP-S1200: 8.8 W
BDP-S4200: 9.5 W
BDP-S4200: 9.5 W
Dimensions (app rox.):
265 mm × 199 mm × 43 mm
(width/depth/height)incl. projecting parts
(width/depth/height)incl. projecting parts
Mass (approx.):
0.9kg
Operating temperature:
5ºC to 35ºC
Operating humidity:
25 % to 80 %
Supplied accessories
High Speed HDMI (high-de
fi nition
multimedia interface) Cable (1)
Remote commander (remote) (1)
R03 (size AAA) batteries (2)
Plug adaptor *(1)
AC adaptor (AC-M1208WW) (1)
AC power cord (1)
Remote commander (remote) (1)
R03 (size AAA) batteries (2)
Plug adaptor *(1)
AC adaptor (AC-M1208WW) (1)
AC power cord (1)
Speci
fi cations and design are subject to change without notice.
SPECIFICATIONS
2014D6900-1
© 201404
Published by Manual Design Dept.
Blu-ray Disc™ / DVD Player
Sony Corporation
Home Entertainment Business Group
9-930-413-11
Photo: BDP-S4200
Remote : RMT-B126A
Ver. 1.0 2014.04
SERVICE MANUAL
Brazillian Model
* This plug adaptor is not for the use in Chile.
Please use this plug adaptor in the countries
where it is necessary.
Please use this plug adaptor in the countries
where it is necessary.
2
BDP-S1200/S4200
SAFETY CHECK-OUT
LEAKAGE TEST (Test together with Supplied AC Adaptor)
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
and bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to
the customer and recommend their replacement.
the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs
of deterioration. Point them out of the customer and recommend
their replacement.
their replacement.
5. Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6. Check the B+ voltage to see it is at the values specified.
7. Check the antenna terminals, metal trim, “metallized” knobs,
7. Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
leakage as described below.
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
safety checks before releasing the set to the customer:
Ω
μ
Fig. A. Using an AC voltmeter to check AC leakage.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40°C higher than
Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
The use of optical instrument with this product will increase eye
hazard.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
This label is located on the laser
protective housing inside the
enclosure.
protective housing inside the
enclosure.
WARNING!!
WHEN SERVICING, DO NOT APPROACH THE LASER
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJEC-
TIVE LENS ON THE OPTICAL PICK-UP BLOCK.
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJEC-
TIVE LENS ON THE OPTICAL PICK-UP BLOCK.
For customers in European countries
product. The CLASS 1 LASER PRODUCT
MARKING is located on the rear exterior.
MARKING is located on the rear exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
OR DOTTED LINE WITH
MARK
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLE-
MENTS PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLE-
MENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
For customers in Taiwan
For customers in China
3
BDP-S1200/S4200
Section.
Title.
Page.
TABLE OF CONTENTS
1. SERVICE NOTE
1-1. Drive Repairing ......................................................................................1-1
1-1-1. Preparation ............................................................................................1-1
1-1-2. Checking Flow ~ Drive (BU) section ~ ................................................1-1
1-1-3. BU Check Flow [zz] ~...........................................................................1-2
1-1-4. BU (Optical Block) Repair Guide .........................................................1-2
1-1-5. BU Adjustment Flow [yy] ~ ..................................................................1-3
1-1-7. BU Data Decode Jig ..............................................................................1-4
1-2 Work when optical device are replaced .....................................................1-4
1-2-1 Laser Caution Label ...............................................................................1-5
1-2-2. In case of BU assy replacement ............................................................1-5
1-2-3. Fact fi nding ............................................................................................1-5
1-2-4. New service method ..............................................................................1-5
1-2-5. BU Data .............................................................................................. 1-5E
2. DISASSEMBLY
2-1. Disassembly Flow .............................................................................................. 2-1
2-2. Top Panel And Tray Cover Assy ........................................................................ 2 -1
2-3. Front Panel, Fr-1303 Board And Wlan Module .................................................. 2-2
2-4. Mb-1301 Board and BD Drive ............................................................................ 2-2
2-5. Circuit Board Location ......................................................................................2-3E
2-2. Top Panel And Tray Cover Assy ........................................................................ 2 -1
2-3. Front Panel, Fr-1303 Board And Wlan Module .................................................. 2-2
2-4. Mb-1301 Board and BD Drive ............................................................................ 2-2
2-5. Circuit Board Location ......................................................................................2-3E
3. BLOCK DIAGRAMS
3-1. Frame Harness .................................................................................................. 3-1
3-2. Overall Block Diagram ....................................................................................... 3-2
3-3. Power Block Diagram .......................................................................................3-2E
3-2. Overall Block Diagram ....................................................................................... 3-2
3-3. Power Block Diagram .......................................................................................3-2E
4. PRINTED WIRING BOARDS
4-1. This Note Is Common For Printed Wiring Boards .............................................. 4-1
4-2. FR-1303 Board (FRONT RIGHT) Printed Wiring Board .................................... 4-2
4-4. MB-1301 Board(MAIN) Printed Wiring Board (Side A) ....................................... 4-3
4-5. MB-1301 Board (MAIN) Printed Wiring Board (Side B) ...................................4-4E
4-2. FR-1303 Board (FRONT RIGHT) Printed Wiring Board .................................... 4-2
4-4. MB-1301 Board(MAIN) Printed Wiring Board (Side A) ....................................... 4-3
4-5. MB-1301 Board (MAIN) Printed Wiring Board (Side B) ...................................4-4E
5. SERVICE MODE AND ERROR LOG LIST .................... 5-1
6. TROUBLESHOOTING ................................................... 6-1
7. REPAIR PARTS LIST
7-1. Exploded
Views
......................................................................................7-1
7-1-1. Case Section and Main Chassis Section ................................................7-1
7-1-2. BD Section ............................................................................................7-3
7-1-3. Accessories ......................................................................................... 7-4E
No
No
Yes
Yes
Yes
Yes
No
No
No
Yes
1-1
BDP-S1200/S4200
SECTION 1
SERVICE NOTE
1-1 DRIVE REPAIRING
1-1-1. Preparation
•
ESD Measures
It is necessary to check the working space ESD condition
before starting the Drive Part (BU) repairs
The ESD-resistance of BD Laser is weaker than DVD/CD Laser
To prevent ESD destruction, please make sure the working
space and human ESD.
It is necessary to check the working space ESD condition
before starting the Drive Part (BU) repairs
The ESD-resistance of BD Laser is weaker than DVD/CD Laser
To prevent ESD destruction, please make sure the working
space and human ESD.
1-1-2. Checking Flow ~ Drive (BU) section ~
BDP Player
can play the BD-disc
BDP Player
can play the DVD/CD-disc
Check Drive Power Supply
IC210 Pin 3: 5V
Q211 Pin 6: 12V
Check / replace the FFC cable, then check
BDP Player
operates normally
OK
Check PS201
Replace PS when open
Check the Optical Block Unit (BU) by
service mode. (Flowchart zz)
BU IOP is OK?
Replace the Optical Block Unit (BU)
Optical Block Unit (BU) replace
(Flowchart yy)
BLX-104
Drive fl owchart
DVD: HLX-513
CD: HLX-A1
CD: HLX-A1
Optical Block Unit or BU No problem