Read Sony BDP-S1000ES / BDP-S760 / BDP-S765 Service Manual online
Sony Corporation
Home Entertainment Business Group
SERVICE MANUAL
9-890-719-14
2009K0500-1
© 2009.11
Published by Quality Assurance Dept.
BLU-RAY DISC/DVD PLAYER
Ver. 1.3 2009.11
BDP-S760/S765/S1000ES
RMT-B106A/B106P
SPECIFICATIONS
US Model
BDP-S1000ES
Canadian Model
AEP Model
UK Model
Australian Model
BDP-S760
Russian Model
Hong Kong Model
BDP-S765
System
Laser:
Semiconductor laser
Inputs and outputs
(
Jack name:
Jack type/Output level/Load impedance)
LINE OUT R-AUDIO-L:
Phono jack/2 Vrms/10 kilohms
DIGITAL OUT (OPTICAL):
Optical output jack/–18dBm (wave length 660nm)
DIGITAL OUT (COAXIAL):
Phono jack/0.5 Vp-p/75 ohms
MULTI CHANNEL OUTPUT:
Phono jack/2 Vrms/10 kilohms
PHONES:
Stereo phone jack/10 mW/(32 ohms)
HDMI OUT:
HDMI 19-pin standard connector
COMPONENT VIDEO OUT
(Y, P
B
, P
R
) (US, Canadian):
Phono jack/Y: 1.0Vp-p/P
B
, P
R
: 0.7Vp-p/75ohms
LINE OUT VIDEO:
Phono jack/1.0 Vp-p/75 ohms
LINE OUT S VIDEO:
4-pin mini DIN/Y: 1.0Vp-p, C: 0.286Vp-p/75ohms
US, Canadian, Hong Kong:
EC1, EC2, CEK, Australian, Russian:
LAN (100):
100BASE-TX Terminal
EXT:
External memory slot (For connecting the external
memory)
DC output: 5 V 500 mA Max
memory)
DC output: 5 V 500 mA Max
USB:
USB jack Type A (For connecting digital still
camera and USB memory)
camera and USB memory)
Wireless (BDP-S760/S1000ES)
Wireless LAN standard:
IEEE802.11a/b/g
IEEE802.11n draft 2.0
IEEE802.11n draft 2.0
F
US:
Canadian:
requency range:
2.4 GHz band: Channels 1-11
5 GHz band: Channels 36-64, 100-140, 149-165
5 GHz band: Channels 36-64, 100-140, 149-165
Modulation:
DS-SS Modem and OFDM Modem
General
Power requirements:
12
11
0–240 V AC, 50/60 Hz
(Hong Kong)
0 V AC, 60 Hz (US, Canadian)
Power consumption:
32 W (BDP-S760/S1000ES)
30 W (BDP-S765)
Dimensions (approx.):
430 mm × 246 mm × 70 mm
(17 in. × 9
(17 in. × 9
3
/
4
in. × 2
13
/
16
in.)
(width/depth/height) incl. projecting parts
Mass (approx.):
3.0 kg (BDP-S760/S1000ES)
2.9 kg (BDP-S765)
Operating temperature:
5 ºC to 35 ºC (41 °F to 95 °F)
Operating humidity:
25 % to 80 %
Supplied accessories
Specifications and design are subject to change
without notice.
without notice.
2.4 GHz band: Channels 1-11
5 GHz band: Channels 36-64, 100-116, 132-140,
149-165
5 GHz band: Channels 36-64, 100-116, 132-140,
149-165
• Audio/video cable (phono plug ×3) (1) (US,
• AC power cord (1)
• External memory (1) (BDP-S1000ES)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
• External memory (1) (BDP-S1000ES)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
(Y, P
B
/C
B
, P
R
/C
R
)
(EC1, EC2, CEK, Australian,
Phono jack/Y: 1.0Vp-p/
P
B
/C
B
, P
R
/C
R
: 0.7Vp-p/75ohms
4-pin mini DIN/Y: 1.0Vp-p, C: 0.3Vp-p/75ohms
EC1, EC2, CEK:
2.4 GHz band: Channels 1-13
5 GHz band: Channels 36-64, 100-140
5 GHz band: Channels 36-64, 100-140
Australian:
2.4 GHz band: Channels 1-13
5 GHz band: Channels 36-64, 100-116, 132-140,
149-165
5 GHz band: Channels 36-64, 100-116, 132-140,
149-165
220–240 V AC, 50/60 Hz
(EC1, EC2, CEK, Australian, Russian)
Canadian, Australian, Russian, Hong Kong)
Russian, Hong Kong)
:
Photo: BDP-S1000ES
– 2 –
BDP-S760/S765/S1000ES
SAFETY CHECK-OUT
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
and bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to
the customer and recommend their replacement.
the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs
of deterioration. Point them out to the customer and recommend
their replacement.
their replacement.
5. Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6. Check the B+ voltage to see it is at the values specified.
7. Check the antenna terminals, metal trim, “metallized” knobs,
7. Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
leakage as described below.
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
safety checks before releasing the set to the customer:
1.5 k
Ω
0.15
μ
F
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
The use of optical instrument with this product will increase eye
hazard.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
This label is located on the laser
protective housing inside the
enclosure.
protective housing inside the
enclosure.
WARNING!!
WHEN SERVICING, DO NOT APPROACH THE LASER
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJEC-
TIVE LENS ON THE OPTICAL PICK-UP BLOCK.
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJEC-
TIVE LENS ON THE OPTICAL PICK-UP BLOCK.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK OR DOTTED LINE
WITH MARK ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. RE-
PLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
WITH MARK ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. RE-
PLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉ-
MENTS PUBLIÉS PAR SONY.
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉ-
MENTS PUBLIÉS PAR SONY.
This appliance is classified as a
CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT
MARKING is located on the laser
protective housing inside the
enclosure.
(EC1, EC2, CEK, Australian)
CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT
MARKING is located on the laser
protective housing inside the
enclosure.
(EC1, EC2, CEK, Australian)
– 3 –
BDP-S760/S765/S1000ES
TABLE OF CONTENTS
Section Title
Page
Section Title
Page
1.
SERVICE NOTE
1-1. Disc Removal Procedure If The Tray Cannot Be
Ejected (Forced Ejection) ............................................. 1-1
1-2. Work when optical device are replaced ........................ 1-1
1-3. Test
1-3. Test
Disc
.......................................................................
1-2
1-3-1. Operation and Display ............................................. 1-2
1-4. Drive
1-4. Drive
Repairing.............................................................
1-15
1-4-1. Preparation .............................................................. 1-15
1-4-2. Checking Flow ~ Drive (BU) section ~ .................... 1-15
1-4-3. BU Check Flow [zz] ~ .............................................. 1-16
1-4-4. BU (Optical Block) Repair Guide ............................. 1-16
1-4-5. BU Adjustment Flow [yy] ~ ...................................... 1-17
1-4-6. KEM-430AAA/C2RP Packing Spec. ....................... 1-17
1-4-7. KEM-430AAA/C2RP Folding Motor FFC ................ 1-18
1-4-8. KEM-430AAA/C2RP Packing .................................. 1-18
1-4-9. BU Data Decode Jig ................................................ 1-19
1-4-10. Loading For Service ................................................ 1-19
1-4-11. Laser Caution Label ................................................ 1-20
1-4-12. Useful service mode function .................................. 1-20
1-5. BU Service Policy ......................................................... 1-21
1-4-2. Checking Flow ~ Drive (BU) section ~ .................... 1-15
1-4-3. BU Check Flow [zz] ~ .............................................. 1-16
1-4-4. BU (Optical Block) Repair Guide ............................. 1-16
1-4-5. BU Adjustment Flow [yy] ~ ...................................... 1-17
1-4-6. KEM-430AAA/C2RP Packing Spec. ....................... 1-17
1-4-7. KEM-430AAA/C2RP Folding Motor FFC ................ 1-18
1-4-8. KEM-430AAA/C2RP Packing .................................. 1-18
1-4-9. BU Data Decode Jig ................................................ 1-19
1-4-10. Loading For Service ................................................ 1-19
1-4-11. Laser Caution Label ................................................ 1-20
1-4-12. Useful service mode function .................................. 1-20
1-5. BU Service Policy ......................................................... 1-21
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................
2-1
2-2. Panels,
Top
Shield
........................................................ 2-2
2-3. Front Panel Block ......................................................... 2-3
2-4. AV-139
2-4. AV-139
Board
...............................................................
2-3
2-5. HU-014 Board Block..................................................... 2-4
2-6. Rear Panel Block.......................................................... 2-4
2-7. Switching
2-6. Rear Panel Block.......................................................... 2-4
2-7. Switching
Regulator
.....................................................
2-5
2-8. BD
Drive
.......................................................................
2-5
2-9. MB-128
Board
..............................................................
2-6
2-10. Circuit Boards Location ................................................ 2-6
3.
BLOCK DIAGRAMS
3-1. Overall Block Diagram (1/2) ......................................... 3-1
3-2. Overall Block Diagram (2/2) ......................................... 3-2
3-3. DSP Block Diagram ...................................................... 3-3
3-4. VIDEO OUT Block Diagram ......................................... 3-4
3-5. AUDIO OUT Block Diagram ......................................... 3-5
3-6. HP OUT Block Diagram ............................................... 3-6
3-7. USB/ETHER, FL Block Diagram .................................. 3-7
3-8. Power Block Diagram (1/3) .......................................... 3-8
3-9. Power Block Diagram (2/3) .......................................... 3-9
3-10. Power Block Diagram (3/3) .......................................... 3-10
3-2. Overall Block Diagram (2/2) ......................................... 3-2
3-3. DSP Block Diagram ...................................................... 3-3
3-4. VIDEO OUT Block Diagram ......................................... 3-4
3-5. AUDIO OUT Block Diagram ......................................... 3-5
3-6. HP OUT Block Diagram ............................................... 3-6
3-7. USB/ETHER, FL Block Diagram .................................. 3-7
3-8. Power Block Diagram (1/3) .......................................... 3-8
3-9. Power Block Diagram (2/3) .......................................... 3-9
3-10. Power Block Diagram (3/3) .......................................... 3-10
4.
SCHEMATIC DIAGRAMS
4-1. This Note Is Common For Schematic Diagrams .......... 4-1
4-2. Frame Schematic Diagram........................................... 4-2
4-3. ANT-005 Board (ANTENNA) Schematic Diagram
(S760/S1000ES)
4-2. Frame Schematic Diagram........................................... 4-2
4-3. ANT-005 Board (ANTENNA) Schematic Diagram
(S760/S1000ES)
..........................................................
4-3
4-4. ANT-006 Board (ANTENNA) Schematic Diagram
(S760/S1000ES)
(S760/S1000ES)
..........................................................
4-4
4-5. AV-139 Board (AUDIO) Schematic Diagram (1/2) ........ 4-5
4-6. AV-139 Board (VIDEO OUT)
4-6. AV-139 Board (VIDEO OUT)
Schematic Diagram (2/2).............................................. 4-6
4-7. FL-198 Board (SWITCH) Schematic Diagram ............. 4-7
4-8. FR-306 Board (FL DRIVER) Schematic Diagram ........ 4-8
4-9. HP-154 Board (HP) Schematic Diagram ...................... 4-9
4-10. HU-014 Board (USB HUB) Schematic Diagram........... 4-10
4-11. MB-128 Board (MC10121F1 DDR2-A)
4-8. FR-306 Board (FL DRIVER) Schematic Diagram ........ 4-8
4-9. HP-154 Board (HP) Schematic Diagram ...................... 4-9
4-10. HU-014 Board (USB HUB) Schematic Diagram........... 4-10
4-11. MB-128 Board (MC10121F1 DDR2-A)
Schematic Diagram (1/17)............................................ 4-11
4-12. MB-128 Board (MC10121F1 DDR2-B)
Schematic Diagram (2/17)............................................ 4-12
4-13. MB-128 Board (POWER1)
Schematic Diagram (3/17)............................................ 4-13
4-14. MB-128 Board (CLK/POWER2)
Schematic Diagram (4/17)............................................ 4-14
4-15. MB-128 Board (FLASH/HOST)
Schematic Diagram (5/17)............................................ 4-15
4-16. MB-128 Board (USB)
Schematic Diagram (6/17)............................................ 4-16
4-17. MB-128 Board (HDMI/SATA)
Schematic Diagram (7/17)............................................ 4-17
4-18. MB-128 Board (AUDIO/VIDEO)
Schematic Diagram (8/17)............................................ 4-18
4-19. MB-128 Board (GPIO/JTAG)
Schematic Diagram (9/17)............................................ 4-19
4-20. MB-128 Board (PATA) Schematic Diagram (10/17) ..... 4-20
4-21. MB-128 Board (ETHERNET)
4-21. MB-128 Board (ETHERNET)
Schematic Diagram (11/17) .......................................... 4-21
4-22. MB-128 Board (RF SDRAM)
Schematic Diagram (12/17).......................................... 4-22
4-23. MB-128 Board (DRIVE/RF)
Schematic Diagram (13/17).......................................... 4-23
4-24. MB-128 Board (IFD)
Schematic Diagram (14/17).......................................... 4-24
4-25. MB-128 Board (EDEN (HDMI))
Schematic Diagram (15/17).......................................... 4-25
4-26. MB-128 Board (HDMI-TX)
Schematic Diagram (16/17).......................................... 4-26
4-27. MB-128 Board (AUDIO DSP)
Schematic Diagram (17/17).......................................... 4-27
4-28. Usb-019 Board (USB REAR CONNECTOR)
Schematic
Schematic
Diagram
......................................................
4-28
4-29. Usb-020 Board (USB FRONT CONNECTOR)
Schematic
Schematic
Diagram
......................................................
4-29
4-30. Waveforms ................................................................... 4-30
5.
PRINTED WIRING BOARDS
5-1. This Note Is Common For Printed Wiring Boards ........ 5-1
5-2. ANT-005 Board (ANTENNA) Printed Wiring Board
(S760/S1000ES)
5-2. ANT-005 Board (ANTENNA) Printed Wiring Board
(S760/S1000ES)
..........................................................
5-2
5-3. ANT-006 Board (ANTENNA) Printed Wiring Board
(S760/S1000ES)
(S760/S1000ES)
..........................................................
5-3
5-4. AV-139 Board (AUDIO/VIDEO)
Printed Wiring Board (SIDE A) ..................................... 5-4
5-5. AV-139 Board (AUDIO/VIDEO)
Printed Wiring Board (SIDE B) ..................................... 5-5
5-6. FL-198 Board (SWITCH) Printed Wiring Board............ 5-6
5-7. FR-306 Board (FL DRIVER) Printed Wiring Board ...... 5-7
5-8. HP-154 Board (HP) Printed Wiring Board .................... 5-8
5-9. HU-014 Board (USB HUB) Printed Wiring Board ......... 5-9
5-10. MB-128 Board (MAIN)
5-7. FR-306 Board (FL DRIVER) Printed Wiring Board ...... 5-7
5-8. HP-154 Board (HP) Printed Wiring Board .................... 5-8
5-9. HU-014 Board (USB HUB) Printed Wiring Board ......... 5-9
5-10. MB-128 Board (MAIN)
Printed Wiring Board (SIDE A) ..................................... 5-10
5-11. MB-128 Board (MAIN)
Printed Wiring Board (SIDE B) ..................................... 5-11
5-12. USB-019 Board (USB REAR CONNECTOR)
Printed Wiring Board .................................................... 5-12
5-13. USB-020 Board (USB FRONT CONNECTOR)
Printed Wiring Board .................................................... 5-13
6.
IC PIN FUNCTION DESCRIPTION
................... 6-1
7.
SERVICE MODE
..................................................... 7-1
8.
ERROR LOG LIST
................................................. 8-1
9. TROUBLESHOOTING
............................................. 9-1
10. REPAIR PARTS LIST
10-1. Exploded Views
............................................................ 10-1
10-1-1. Case Section ........................................................... 10-1
10-1-2. Front/Rear Chassis Section .................................... 10-2
10-1-3. Main Chassis Section .............................................. 10-3
10-1-4. BD Section .............................................................. 10-4
10-1-5. Accessories ............................................................. 10-5
10-2. Electrical Parts List ....................................................... 10-6
10-1-2. Front/Rear Chassis Section .................................... 10-2
10-1-3. Main Chassis Section .............................................. 10-3
10-1-4. BD Section .............................................................. 10-4
10-1-5. Accessories ............................................................. 10-5
10-2. Electrical Parts List ....................................................... 10-6
1-1
BDP-S760/S765/S1000ES
SECTION 1
SERVICE NOTE
1-1. DISC REMOVAL PROCEDURE IF THE TRAY CANNOT BE EJECTED (FORCED EJECTION)
1. Remove the top shield. (Refer to page 2-2)
2. Insert a clip in the hole of a drive and open a tray.
2. Insert a clip in the hole of a drive and open a tray.
Note: Use a clip of about 1.2 mm in the diameter
1-2. Work when optical device are replaced
Note: Please do the following work when you replace the optical device.
1. Install it in PC after downloading two set of software from following URL.
(Refer to “1-4-9. BU Data Decode Jig” on page 1-19)
STEP
1
Microsoft .NET Framework Version 2.0 Redistributable Package (x86)
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5
STEP
2
Microsoft .NET Framework 2.0 Service Pack 1 (x86)
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5
2. Take the photograph the part of the bar code of the optical device. (Refer to the following picture)
3. Drag-and-drop the bar code photograph to the icon of decode software (BDBUDec).
* The decode software is a complete set of “BDBUDec”, “Tasman.Bars.dll”, and “SavePath”.
* Because docode software cannot be attached, it separately distributes it.
* The decode software is a complete set of “BDBUDec”, “Tasman.Bars.dll”, and “SavePath”.
* Because docode software cannot be attached, it separately distributes it.
4. Input the password when you start decode software.
* Inquire of each service headquarters because the password cannot be disclosed.
* Inquire of each service headquarters because the password cannot be disclosed.
5. Write the decode data to the set.
(Refer to “1-4-4. BU (Optical Block) Repair Guide” on page 1-16 and “1-4-5. BU Adjustment Flow [yy]” on page 1-17)
Tray
Clip
(Use that of about 1.2 mm in the diameter)
(Use that of about 1.2 mm in the diameter)
hole