BDP-N460 - Sony DVD Service Manual (repair manual)

bdp-n460 service manual
Model
BDP-N460
Pages
105
Size
9.06 MB
Type
PDF
Document
Service Manual
Brand
Device
DVD
File
bdp-n460.pdf
Date

Read Sony BDP-N460 Service Manual online

Sony Corporation
Home Entertainment Bisiness Group
SER VICE MANUAL
9-890-718-13                                                
2009K6900-1
© 2009.11
P ublis hed by Des ign E ngineering Dept.
BLU-RAY DISC/DVD PLA YER
BDP-N460
RMT-B104A
US Model
BDP-N460
Photo: BDP-N460
TM
S ys tem
L aser :  Semiconductor laser
Inputs  and outputs
(J ack name:
 
Jack type/Output level/L oad impedance)
L I NE  OUT  R -AUDI O-L :
 
Phono jack/2 V rms/10 kilohms
DI G I TA L  OUT  (OPT I C A L ):
 
Optical output jack/-18 dB m
 
(wave length 660 nm)
DI G I TA L  OUT  (C OA X I A L ):
 
Phono jack/0.5 V p-p/75 ohms
H DM I  OUT:
 
HDMI 19-pin standard connector
C OM PONE NT  V I DE O OUT  (Y, P
B
, P
R
):
 
Phono jack/Y: 1.0 V p-p/
 
P
B
, P
R
: 0.7 V p-p/75 ohms
L I NE  OUT  V I DE O:
 
Phono jack/1.0 V p-p/75 ohms
L A N (100):
 
100BA SE -T X  Terminal
E X T:
 
E xternal memory slot (For connecting the
 
external memory)
 
DC output: 5 V  500 mA  Max
USB :
 
USB  jack Type A  (For connecting digital
 
still camera and USB  memory)
G eneral
Power  requirements:
 
120 V  AC, 60 Hz
Power  consumption:
 
26 W
Dimensions (approx.):
 
430 mm × 238 mm × 70 mm 
 
(17 in. × 9 
3
/
8
 in. × 2 
7
/
8
 in.)
 
(width/depth/height) incl. projecting parts
M ass (approx.):
 
2.8 kg (6 lb 2 
3
/
4
 oz)
Oper ating temper ature:
 
5 °C to 35 °C (41 °F to 95 °F)
Oper ating humidity:
 
25 % to 80 %
S upplied acces s ories
• 
A udio/video cable (phono plug × 3) (1)
• 
AC power cord (1)
• 
R emote commander (remote) (1)
• 
Size A A  (R 6) B atteries (2)
 cations and design are subject to change 
without notice.
S P E C IF IC AT IONS
Ver. 1.2  2010.01
– 2 –
BDP-N460
SAFETY CHECK-OUT
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 
WT-540A. Follow the manufacturers' instructions to use these 
instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245 
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a 
VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2V AC range are suitable. (See 
Fig. A)
1.  Check the area of your repair for unsoldered or poorly-soldered 
connections. Check the entire board surface for solder splashes 
and bridges.
2.  Check the interboard wiring to ensure that no wires are “pinched” 
or contact high-wattage resistors.
3.  Look for unauthorized replacement parts, particularly transistors, 
that were installed during a previous repair. Point them out to 
the customer and recommend their replacement.
4.  Look for parts which, though functioning, show obvious signs 
of deterioration. Point them out to the customer and recommend 
their replacement.
5.  Check the line cord for cracks and abrasion. Recommend the 
replacement of any such line cord to the customer.
6.  Check the B+ voltage to see it is at the values specified.
7.  Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage. Check 
leakage as described below.
After correcting the original service problem, perform the following 
safety checks before releasing the set to the customer:
1.5 k
Ω
0.15 
μ
F
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 
the lead free mark due to their particular size.)
 : LEAD FREE MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40°C higher than 
ordinary solder.
  Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
  Soldering irons using a temperature regulator should be set to 
about 350°C.
  Caution: The printed pattern (copper foil) may peel away if the 
heated tip is applied for too long, so be careful!
• Strong viscosity
  Unleaded solder is more viscous (sticky, less prone to flow) than 
ordinary solder so use caution not to let solder bridges occur such 
as on IC pins, etc.
•  Usable with ordinary solder
  It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
CAUTION:
The use of optical instrument with this product will increase eye 
hazard.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specified herein may result in hazardous radia-
tion exposure.
This label is located on the laser
protective housing inside the 
enclosure.
WARNING!!
WHEN SERVICING, DO NOT APPROACH THE LASER 
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS 
NECESSARY TO CONFIRM LASER BEAM EMISSION, 
BE SURE TO OBSERVE FROM A DISTANCE OF MORE 
THAN 25 cm FROM THE SURFACE OF THE OBJECTIVE 
LENS ON THE OPTICAL PICK-UP BLOCK.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 
 OR DOTTED LINE WITH 
MARK 
 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS 
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE 
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS 
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS 
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT 
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 
 
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE 
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE 
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS 
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT 
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS 
PUBLIÉS PAR SONY.
– 3 –
BDP-N460
TABLE OF CONTENTS
Section Title 
Page
Section Title 
Page
1. SERVICE 
NOTE
1-1.  Disc Removal Procedure If The Tray Cannot Be 
 
Ejected (Forced Ejection) .............................................  1-1
1-2. Caution 
.........................................................................  
1-4
 1-2-1. 
Operation and Display .............................................  1-2
1-3. Test 
Disc 
.......................................................................  
1-4
2. DISASSEMBLY
2-1. Disassembly 
Flow 
........................................................  
2-1
2-2. Upper 
Case 
..................................................................  
2-1
2-3. Tray 
Cover 
Assy 
...........................................................  
2-2
2-4. Front 
Panel 
Assy 
..........................................................  
2-2
2-5.  Front Chassis and USF-002 Board ..............................  2-3
2-6. Rear 
Panel 
...................................................................  
2-3
2-7. Switching 
Regulator 
.....................................................  
2-4
2-8. BD 
Drive 
.......................................................................  
2-4
2-9. MB-130 
Board 
..............................................................  
2-5
2-10.  Circuit Boards Location ................................................  2-5
3. BLOCK 
DIAGRAMS
3-1.  Overall Block Diagram..................................................  3-1
3-2.  DSP Block Diagram ......................................................  3-2
3-3.  AV OUT Block Diagram ................................................  3-3
3-4.  USB/ETHER, FL Block Diagram ..................................  3-4
3-5.  Power Block Diagram (1/2) ..........................................  3-5
3-6.  Power Block Diagram (2/2) ..........................................  3-6
4. SCHEMATIC 
DIAGRAMS
4-1.  This Note Is Common For Schematic Diagrams ..........  4-1
4-2.  Frame Schematic Diagram...........................................  4-2
4-3.  FL-199 Board (SWITCH) Schematic Diagram .............  4-3
4-4.  FR-307 Board (FRONT RIGHT) Schematic Diagram ..  4-4
4-5.  MB-130 Board (MT8520 DDR2-A) 
 
Schematic Diagram (1/11) ............................................  4-5
4-6.  MB-130 Board (MT8520 DDR2-B) 
 
Schematic Diagram (2/11) ............................................  4-6
4-7.  MB-130 Board (POWER1) 
 
Schematic Diagram (3/11) ............................................  4-7
4-8.  MB-130 Board (CLK/POWER2) 
 
Schematic Diagram (4/11) ............................................  4-8
4-9.  MB-130 Board (FLASH/HOST) 
 
Schematic Diagram (5/11) ............................................  4-9
4-10.  MB-130 Board (USB) Schematic Diagram (6/11) .........  4-10
4-11.  MB-130 Board (HDMI/SATA) 
 
Schematic Diagram (7/11) ............................................  4-11
4-12.  MB-130 Board (AUDIO/VIDEO) 
 
Schematic Diagram (8/11) ............................................  4-12
4-13.  MB-130 Board (GPIO/JTAG) 
 
Schematic Diagram (9/11) ............................................  4-13
4-14.  MB-130 Board (ETHERNET) 
 
Schematic Diagram (10/11) ..........................................  4-14
4-15.  MB-130 Board (IFD) Schematic Diagram (11/11) .........  4-15
4-16.  USB-021 Board (USB (REAR)) 
 Schematic 
Diagram 
......................................................  
4-16
4-17.  USF-002 Board (USB (FRONT)) 
 Schematic 
Diagram 
......................................................  
4-16
4-18. Waveforms ...................................................................  4-17
5. 
PRINTED WIRING BOARDS
5-1.  This Note Is Common For Printed Wiring Boards ........  5-1
5-2.  FL-199 Board (SWITCH) Printed Wiring Board............  5-2
5-3.  FR-307 Board (FRONT RIGHT) 
 
Printed Wiring Board (Side A) ......................................  5-3
5-4.  FR-307 Board (FRONT RIGHT) 
 
Printed Wiring Board (Side B) ......................................  5-4
5-5.  MB-130 Board (MAIN) 
 
Printed Wiring Board (Side A) ......................................  5-5
5-6.  MB-130 Board (MAIN) 
 
Printed Wiring Board (Side B) ......................................  5-6
5-7.  USB-021 Board (USB (REAR)) 
 
Printed Wiring Board ....................................................  5-7
5-8.  USF-002 Board (USB (FRONT)) 
 
Printed Wiring Board ....................................................  5-7
6. 
IC PIN FUNCTION DESCRIPTION
 .......................  6-1
7. SERVICE 
MODE
 ......................................................   7-1
8. 
ERROR LOG LIST
 ...................................................   8-1
9. TROUBLESHOOTING
 .............................................  9-1
10.  REPAIR PARTS LIST
10-1. Exploded Views 
............................................................  10-1
 10-1-1.  Case Section ...........................................................  10-1
 10-1-2.  Front/Rear Chassis Section ....................................  10-2
 10-1-3.  Main Chassis Section ..............................................  10-3
 10-1-4.  Accessories .............................................................  10-4
10-2.  Electrical Parts List .......................................................  10-5
1-1
BDP-N460
SECTION 1
SERVICE NOTE
1-1.  DISC REMOVAL PROCEDURE IF THE TRAY CANNOT BE EJECTED (FORCED EJECTION)
3 Tray cover assy
1 Insert a clip in the hole of a drive
 and open a tray.
2
1-2 Caution : SATA cable and harness dressing
1-2a SATA cable CANNOT touch the Capacitor (C618).
- The SATA cable must twisted back and push down to avoid touching the uppercase and capacitor. Refer to the following picture.
Page of 105
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