Read Sony BDP-CX960 Service Manual online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
BDP-CX960
SPECIFICATIONS
BLU-RAY DISC/DVD PLAYER
9-889-611-01
2009H05-1
©
2009.08
US Model
Canadian Model
Ver. 1.0 2009.08
Model Name Using Similar Mechanism
DVP-CX995V
Mechanism Type
CDM89-430AAA
Base Unit Name
KEM-430AAA
Optical Pick-up Name
KES-430A
s This product incorporates copyright protection technology that is
protected by U.S. patents and other intellectual property rights.
Use of this copyright protection technology must be authorized by
Macrovision, and is intended for home and other limited viewing uses
only unless otherwise authorized by Macrovision.
Reverse engineering or disassembly is prohibited.
Use of this copyright protection technology must be authorized by
Macrovision, and is intended for home and other limited viewing uses
only unless otherwise authorized by Macrovision.
Reverse engineering or disassembly is prohibited.
s Manufactured under license from Dolby Laboratories.
“Dolby”, “Pro Logic”, and the double-D symbol are trademarks of
Dolby Laboratories.
Dolby Laboratories.
s Manufactured under license under U.S. Patent #’s: 5,451,942;
5,956,674; 5,974,380; 5,978,762; 6,226,616; 6,487,535; 7,392,195;
7,272,567; 7,333,929; 7,212,872 & other U.S. and worldwide patents
issued & pending. DTS is a registered trademark and the DTS logos,
Symbol, DTS-HD and DTS-HD Master Audio | Essential are trademarks
of DTS, Inc. © 1996-2008 DTS, Inc. All Rights Reserved.
7,272,567; 7,333,929; 7,212,872 & other U.S. and worldwide patents
issued & pending. DTS is a registered trademark and the DTS logos,
Symbol, DTS-HD and DTS-HD Master Audio | Essential are trademarks
of DTS, Inc. © 1996-2008 DTS, Inc. All Rights Reserved.
s Java and all Java-based trademarks and logos are trademarks or
registered trademarks of Sun Microsystems, Inc.
s
, “XMB,” and “xross media bar” are trademarks of Sony Corporation
and Sony Computer Entertainment Inc.
s This product incorporates High-Definition Multimedia Interface
(HDMI™) technology. HDMI, the HDMI logo and High-Definition
Multimedia Interface are trademarks or registered trademarks of HDMI
Licensing LLC.
Multimedia Interface are trademarks or registered trademarks of HDMI
Licensing LLC.
s “Blu-ray Disc” is a trademark.
s “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” “DVD-R,”
s “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” “DVD-R,”
“DVD VIDEO,” and “CD” logos are trademarks.
sh"$
,IVEv
Corporation.
s MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
s This product meets ENERGY STAR guidelines for energy efficiency.
ENERGY STAR and the ENERGY STAR mark are registered U.S.
marks. ENERGY STAR is a registered mark owned by the U.S.
government.
marks. ENERGY STAR is a registered mark owned by the U.S.
government.
s-USIC
Gracenote
®
. Gracenote is the industry standard in music recognition
technology and related content delivery. For more information, please
visit www.gracenote.com. CD, DVD, Blu-ray Disc, and music and
video-related data from Gracenote, Inc., copyright © 2000-present
Gracenote. Gracenote Software, copyright © 2000-present Gracenote.
One or more patents owned by Gracenote apply to this product and
service. See the Gracenote website for a non-exhaustive list of applicable
Gracenote patents. Gracenote, CDDB, MusicID, MediaVOCS, the
Gracenote logo and logotype, and the “Powered by Gracenote” logo are
either registered trademarks or trademarks of Gracenote in the United
States and/or other countries.
visit www.gracenote.com. CD, DVD, Blu-ray Disc, and music and
video-related data from Gracenote, Inc., copyright © 2000-present
Gracenote. Gracenote Software, copyright © 2000-present Gracenote.
One or more patents owned by Gracenote apply to this product and
service. See the Gracenote website for a non-exhaustive list of applicable
Gracenote patents. Gracenote, CDDB, MusicID, MediaVOCS, the
Gracenote logo and logotype, and the “Powered by Gracenote” logo are
either registered trademarks or trademarks of Gracenote in the United
States and/or other countries.
s Other system and product names are generally trademarks or registered
trademarks of the manufacturers. ™ and ® marks are not indicated in
this document.
this document.
System
Laser: Semiconductor laser
Outputs
(Jack name:
Jack type/Output level/Load impedance)
Analog Audio Output:
Stereo Output: Phono jack/2 Vrms/
10 kilohms
10 kilohms
Digital Audio Output:
Optical Output: Optical output jack/
–18 dBm (wave length 660 nm)
Coaxial Output: Phono jack/0.5 Vp-p/
75 ohms
–18 dBm (wave length 660 nm)
Coaxial Output: Phono jack/0.5 Vp-p/
75 ohms
Analog Video Output
Component Output (Y, P
B
, P
R
): Phono jack/
Y: 1.0 Vp-p/P
B
, P
R
: 0.7 Vp-p/75 ohms
Composite Output: Phono jack/1.0 Vp-p/
75 ohms
75 ohms
HDMI Output
HDMI 19-pin standard connector
LAN (100):
100BASE-TX Terminal
EXT:
External memory slot (For connecting the
external memory)
DC output: 5 V 500 mA Max
external memory)
DC output: 5 V 500 mA Max
General
Power requirements:
120 V AC, 60 Hz
Power consumption:
28 W
Dimensions (approx.):
430 mm × 240 mm × 535 mm
(17 in. × 9
(17 in. × 9
1
/
2
in. × 21
1
/
8
in.)
(width/height/depth) incl. projecting parts
Mass (approx.):
13.4 kg (29 lb 9 oz)
Operating temperature:
5 ºC to 35 ºC (41 °F to 95 °F)
Operating humidity:
25 % to 80 %
Supplied accessories
Specifications and design are subject to
change without notice.
change without notice.
s Audio/video cord (phono plug ×3) (1)
s Remote commander (remote) (1)
s Size AA (R6) batteries (2)
s Remote commander (remote) (1)
s Size AA (R6) batteries (2)
BDP-CX960
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
CAUTION
The use of optical instruments with this product will increase eye hazard. As the laser
beam used in this Blu-ray Disc/DVD player is harmful to eyes, do not attempt to
disassemble the cabinet.
Refer servicing to qualified personnel only.
beam used in this Blu-ray Disc/DVD player is harmful to eyes, do not attempt to
disassemble the cabinet.
Refer servicing to qualified personnel only.
This label is located on the laser protective housing inside the enclosure.
Self-Diagnosis Function
When the self-diagnosis function is activated to prevent the player
from malfunctioning, an error code appears in the front panel display,
or just
from malfunctioning, an error code appears in the front panel display,
or just
appears without any messages on the entire screen.
In these cases, check the following.
When an error code appears in the front panel display
When just appears without any messages on the entire screen
Depending on the situation, the remedy in “Power” of
“Troubleshooting” (refer to instruction manual) may solve the problem.
“Troubleshooting” (refer to instruction manual) may solve the problem.
Error code
Corrective action
Exxxx
SYS ERR
SYS ERR
Contact your nearest Sony dealer or local authorized Sony
service facility and give the error code. “xxxx” represents
an error code (number).
service facility and give the error code. “xxxx” represents
an error code (number).
FAN ERR
s Check that the ventilation holes on the rear of the player
are not blocked.
s Place the player in a location with adequate ventilation
to prevent heat build-up in the player.
BDP-CX960
3
1.
SERVICING NOTES
............................................. 4
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 6
2-2. Case ................................................................................. 7
2-3. MB-124-MEGA-SM Board ............................................ 7
2-4. Chassis-M (HF) Block .................................................... 8
2-5. Front Panel Block ........................................................... 8
2-6. 400D Table Assy ............................................................. 9
2-7. DRV Board ...................................................................... 9
2-8. Table (Door) Assy ........................................................... 10
2-9. DC Motor (Door) (M201) ............................................... 10
2-10. Holder (Table Sensor 400) .............................................. 11
2-11. SDT Board, SDR Board .................................................. 11
2-12. SDO Borad ...................................................................... 12
2-13. Pop-up (400) Assy .......................................................... 13
2-14. Back Panel Block ............................................................ 13
2-15. BU (KEM-430AAA) Assy .............................................. 14
2-16. Optical Pick-up Block (KEM-430AAA) ........................ 15
2-17. Switching Regulator ....................................................... 16
2-18. Base (CDM BD) Block ................................................... 17
2-19. Motor (400BD) Assy (Loading) (M301)/
2-3. MB-124-MEGA-SM Board ............................................ 7
2-4. Chassis-M (HF) Block .................................................... 8
2-5. Front Panel Block ........................................................... 8
2-6. 400D Table Assy ............................................................. 9
2-7. DRV Board ...................................................................... 9
2-8. Table (Door) Assy ........................................................... 10
2-9. DC Motor (Door) (M201) ............................................... 10
2-10. Holder (Table Sensor 400) .............................................. 11
2-11. SDT Board, SDR Board .................................................. 11
2-12. SDO Borad ...................................................................... 12
2-13. Pop-up (400) Assy .......................................................... 13
2-14. Back Panel Block ............................................................ 13
2-15. BU (KEM-430AAA) Assy .............................................. 14
2-16. Optical Pick-up Block (KEM-430AAA) ........................ 15
2-17. Switching Regulator ....................................................... 16
2-18. Base (CDM BD) Block ................................................... 17
2-19. Motor (400BD) Assy (Loading) (M301)/
(Table) (M302), MLD Board .......................................... 17
2-20. SLK Board, SLD Board .................................................. 18
3.
TEST MODE
............................................................ 19
4. MECHANICAL
ADJUSTMENTS
...................... 25
5. DIAGRAMS
5-1. Block Diagram - BD/DVD Section - .............................. 28
5-2. Block Diagram - AUDIO/VIDEO Section - ................... 29
5-3. Block Diagram - ETHERNET, USB Section - ............... 30
5-4. Block
5-2. Block Diagram - AUDIO/VIDEO Section - ................... 29
5-3. Block Diagram - ETHERNET, USB Section - ............... 30
5-4. Block
Diagram
- SENSOR, MOTOR DRIVE Section - .......................... 31
5-5. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 32
5-6. Printed
Wiring
Board
- MB-124-MEGA-SM Board (Component Side) - ......... 34
5-7. Printed
Wiring
Board
- MB-124-MEGA-SM Board (Conductor Side) - ........... 35
5-8. Schematic
Diagram
- MB-124-MEGA-SM Board (1/10) - ............................ 36
5-9. Schematic
Diagram
- MB-124-MEGA-SM Board (2/10) - ............................ 37
5-10. Schematic Diagram
- MB-124-MEGA-SM Board (3/10) - ............................ 38
5-11. Schematic Diagram
- MB-124-MEGA-SM Board (4/10) - ............................ 39
TABLE OF CONTENTS
5-12. Schematic Diagram
- MB-124-MEGA-SM Board (5/10) - ............................ 40
5-13. Schematic Diagram
- MB-124-MEGA-SM Board (6/10) - ............................ 41
5-14. Schematic Diagram
- MB-124-MEGA-SM Board (7/10) - ............................ 42
5-15. Schematic Diagram
- MB-124-MEGA-SM Board (8/10) - ............................ 43
5-16. Schematic Diagram
- MB-124-MEGA-SM Board (9/10) - ............................ 44
5-17. Schematic Diagram
- MB-124-MEGA-SM Board (10/10) - .......................... 45
5-18. Printed Wiring Board - AVHF Board - ........................... 46
5-19. Schematic Diagram - AVHF Board - .............................. 47
5-20. Printed Wiring Boards - CONTROL Section - ............... 48
5-21. Schematic Diagram - CONTROL Section (1/5) - ........... 49
5-22. Schematic Diagram - CONTROL Section (2/5) - ........... 50
5-23. Schematic Diagram - CONTROL Section (3/5) - ........... 51
5-24. Schematic Diagram - CONTROL Section (4/5) - ........... 52
5-25. Schematic Diagram - CONTROL Section (5/5) - ........... 53
5-26. Printed Wiring Boards - MOTOR DRIVE Section - ...... 54
5-27. Schematic Diagram - MOTOR DRIVE Section - ........... 55
5-28. Printed Wiring Boards - SENSOR Section - .................. 56
5-29. Schematic Diagram - SENSOR Section - ....................... 56
5-30. Printed Wiring Boards - PANEL Section - ..................... 58
5-31. Schematic Diagram - PANEL Section - .......................... 59
5-32. Printed Wiring Boards - CONNECTOR Section - ......... 60
5-33. Schematic Diagram - CONNECTOR Section - .............. 60
5-19. Schematic Diagram - AVHF Board - .............................. 47
5-20. Printed Wiring Boards - CONTROL Section - ............... 48
5-21. Schematic Diagram - CONTROL Section (1/5) - ........... 49
5-22. Schematic Diagram - CONTROL Section (2/5) - ........... 50
5-23. Schematic Diagram - CONTROL Section (3/5) - ........... 51
5-24. Schematic Diagram - CONTROL Section (4/5) - ........... 52
5-25. Schematic Diagram - CONTROL Section (5/5) - ........... 53
5-26. Printed Wiring Boards - MOTOR DRIVE Section - ...... 54
5-27. Schematic Diagram - MOTOR DRIVE Section - ........... 55
5-28. Printed Wiring Boards - SENSOR Section - .................. 56
5-29. Schematic Diagram - SENSOR Section - ....................... 56
5-30. Printed Wiring Boards - PANEL Section - ..................... 58
5-31. Schematic Diagram - PANEL Section - .......................... 59
5-32. Printed Wiring Boards - CONNECTOR Section - ......... 60
5-33. Schematic Diagram - CONNECTOR Section - .............. 60
6.
EXPLODED VIEWS
6-1. Overall
Section
............................................................... 83
6-2. Chassis-M
Section
.......................................................... 84
6-3. Table
Section
................................................................... 85
6-4. Front Panel Section ......................................................... 86
6-5. Power Block Section ....................................................... 87
6-6. Chucking
6-5. Power Block Section ....................................................... 87
6-6. Chucking
Section
............................................................ 88
6-7. Table Sensor Section ....................................................... 89
6-8. Chassis
6-8. Chassis
Section
............................................................... 90
6-9. Base (Door) Section ........................................................ 91
6-10. Pop-up Section ................................................................ 92
6-11. Holder Section ................................................................ 93
6-12. Mechanism Base Section ................................................ 94
6-13. Base Unit Section (BU (KEM-430AAA) Assy) ............. 95
6-10. Pop-up Section ................................................................ 92
6-11. Holder Section ................................................................ 93
6-12. Mechanism Base Section ................................................ 94
6-13. Base Unit Section (BU (KEM-430AAA) Assy) ............. 95
7.
ELECTRICAL PARTS LIST
.............................. 96
Accessories are given in the last of the electrical parts list.
BDP-CX960
4
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTE WHEN PARTS THAT CANNOT BE SUPPLIED
ARE REPLACED
There are parts that cannot be exchanged with single parts in this
set. The following parts are damaged, exchange the entire mounted
board.
MB-124-MEGA-SM board : IC101, IC102, IC103, IC202, IC203,
ARE REPLACED
There are parts that cannot be exchanged with single parts in this
set. The following parts are damaged, exchange the entire mounted
board.
MB-124-MEGA-SM board : IC101, IC102, IC103, IC202, IC203,
IC307, IC308, IC501, IC502, IC601,
IC602, IC700, IC701, J801
IC602, IC700, IC701, J801
ABOUT THE LENS CLEANING
Do not do the lens cleaning with the cotton bud etc. It causes the
trouble.
Do not do the lens cleaning with the cotton bud etc. It causes the
trouble.
NOTE THE OPTICAL PICK-UP BLOCK AND DR-510
BOARD REPLACING
Exchange both at the same time when exchange Optical Pick-up
Block (KES-430A) or DR-510 board.
As for the service parts, these two parts are supplied by the set.
BOARD REPLACING
Exchange both at the same time when exchange Optical Pick-up
Block (KES-430A) or DR-510 board.
As for the service parts, these two parts are supplied by the set.
Part No.
Description
Layer
J-6090-199-A
BLX-104
Single Layer
J-6090-200-A
BLX-204
Dual Layer
3-702-101-01
CD (YEDS-18)
J-6090-088-A
HLX-504
Single Layer (NTSC)
J-6090-089-A
HLX-505
Dual Layer (NTSC)
J-6090-077-A
HLX-506
Single Layer (PAL)
J-6090-078-A
HLX-507
Dual Layer (PAL)
TEST DISC
Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-
989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.
Operation and Display:
1. BLX-104
Procedure:
1. Select
Procedure:
1. Select
23.976Hz/1080p.
2. Play “4.Motion picture”.
3. Check whether player can play back or not.
4. Check each outputs.
Video:
Composite/S
3. Check whether player can play back or not.
4. Check each outputs.
Video:
Composite/S
Video/component/HDMI.
Audio:
Speaker
Speaker
out.
* When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz)
can use instead of 1080/24p.
However this is temporary correspondence.
* When the output of HDMI is 1080p, the signal of Composite/S
Video/Component are not output.
It is necessary to lower the output of HDMI to 1080i or less.
2. BLX-204
Procedure:
1. Select 1080i (59.94Hz or 50Hz).
2. Play “4.Motion picture”.
3. Check whether player can play back or not.
Procedure:
1. Select 1080i (59.94Hz or 50Hz).
2. Play “4.Motion picture”.
3. Check whether player can play back or not.
(Check the picture and sound output)
3. CD (YEDS-18)
Procedure:
Check whether player can play back or not.
(Check the sound output)
Procedure:
Check whether player can play back or not.
(Check the sound output)
4. HLX-504/505 (NTSC), HLX-506/507 (PAL)
Procedure:
1. After displayed Main Menu, select “1.Video signal”.
2. Play “1.Color bar 100%”.
Procedure:
1. After displayed Main Menu, select “1.Video signal”.
2. Play “1.Color bar 100%”.
(Check the picture and sound output)
3. Return to Menu.
4. Play “Demonstration 4:3” or “Demonstration 16:9”.
4. Play “Demonstration 4:3” or “Demonstration 16:9”.
(Check the picture and sound output)