Read Sony BDP-BX37 / BDP-S270 / BDP-S370 / BDP-S373 / BDP-S470 Service Manual online
Sony Corporation
Home Entertainment Business Group
SERVICE MANUAL
2011H6900-1
© 2011.08
Published by Design Engineering Dept.
BLU-RAY DISC/DVD PLAYER
BDP-BX37/S270/S370/S373/S470
RMT-B107A/RMT-107P/RMT-107C/RMT-108A/RMT-108P
US Model
Canada Model
BDP-BX37/S270/S370/S470
Photo: BDP-S370
System
Laser: Semiconductor laser
Inputs and outputs
(Jack name:
Jack type/Output level/Load impedance)
LINE OUT R-AUDIO-L:
Phono jack/2 Vrms/10 kilohms
DIGITAL OUT (OPTICAL):
Optical output jack/-18 dBm
(wave length 660 nm)
DIGITAL OUT (COAXIAL):
Phono jack/0.5 Vp-p/75 ohms
HDMI OUT:
HDMI 19-pin standard connector
COMPONENT VIDEO OUT (Y, P
B
, P
R
):
Phono jack/Y: 1.0 Vp-p/
P
B
, P
R
: 0.7 Vp-p/75 ohms
LINE OUT VIDEO:
Phono jack/1.0 Vp-p/75 ohms
LAN (100):
100BASE-TX Terminal
USB:
USB jack Type A ( For connecting a USB
memory, memory card reader, digital stil
camera, and digital video camera)
General
Power requirements:
120 V AC, 60 Hz
120 V AC, 60 Hz
220-240 V AC, 50/60 Hz
Power consumption:
18 W (BDP-S270)
22 W (BDP-BX37/S370/S373/S470)
22 W (BDP-BX37/S370/S373/S470)
Dimensions (approx.):
430 mm × 219 mm × 36 mm
(width/depth/height) incl. projecting parts
Mass (approx.):
2.0 kg (4 lb 6
1
/
2
oz)
Operating temperature:
5 °C to 35 °C (41 °F to 95 °F)
Operating humidity:
25 % to 80 %
Supplied accessories
• Audio/video cable (phono plug × 3) (1)
•
Except : BDP-S270:MX,BR/ S370:E,BR,UK,AE1,AE2,AR/
S373:UK,AE1,AE2/S470:E,AR,BR,AE1,AE2,UK
•
Remote commander (remote) (1)
•
Size AA (R6) Batteries (2)
Specifi cations and design are subject to change
without notice.
without notice.
SPECIFICATIONS
/
/
BD
RMT-B107P
Y
T
PAUSE
STOP
PLAY
BDP-S270
Mexican Model
Saudi Arabia Model
E Model
PX Model
Australian / New Zealand Model
Chinese Model
Korea Model
Russian Model
Taiwan Model
Thailand Model
BDP-S370/S373/S470
AEP Model
UK Model
BDP-S270/S370/S470
Brazilian Model
(17 in. × 8
5
/
8
in. × 1
7
16
/ in.)
9-890-726-20
BDP-S370/S470
BDP-S270: USB-023(REAR USB)
BDP-BX37/S370/S373/S470:
BDP-BX37/S370/S373/S470:
USB-023(REAR USB)
110-240 V AC, 50/60 Hz
HDMI Cable :BDP-BX37:US/S270:MX/S370:AR/S470:E,AR,BR
Plug Adaptor :BDP-S370:PX,E/S470:E
•
OPEN/
CLOSE
CLOSE
INPUT
FAVORITES
LIGHT
220 V AC, 60 Hz (BDP-S370:KR/S470:KR only)
110 V AC, 60 Hz (BDP-S370:TW/S470:TW only)
FR-309(FRONT USB)/
Singapore Model
BDP-S370
(BDP-BX37/S270/S370/S470:US,CND only)
(BDP-S370:UK,AE1,AE2,AUS,RUS,CN/S373/S470:UK,AE1,AE2AUS,RUS,CN)
(BDP-S270:BR/S370:PX,E,AR,BR,SP,TH,EA,KS/S470:E,AR,BR,SP,TH,EA,KS)
120 V AC, 50/60 Hz (BDP-S270:MX only)
Argentina Model
TM
ENERGY STAR and the ENERGY STAR mark
are registered U.S. marks. ENERGY STAR is a
registered mark owned by the U.S. government.
are registered U.S. marks. ENERGY STAR is a
registered mark owned by the U.S. government.
(BDP-BX37/S270/S370/S470: US Only)
Middle East Model
EA Model
Ver. 1.9 2011.08
SAFETY CHECK-OUT
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to
the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs
of deterioration. Point them out to the customer and recommend
their replacement.
5. Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6. Check the B+ voltage to see it is at the values specified.
7. Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
1.5 k
Ω
0.15
μ
F
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
This label is located on the laser
protective housing inside the
enclosure.
WARNING!!
WHEN SERVICING, DO NOT APPROACH THE LASER
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJECTIVE
LENS ON THE OPTICAL PICK-UP BLOCK.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK OR DOTTED LINE WITH
MARK ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
BDP-BX37/S270/S370/S373/S470
-2-
This appliance is classified as a
CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT
MARKING is located on the laser
protective housing inside the
enclosure. (AEP, UK, Australian
New Zealand)
– 3 –
TABLE OF CONTENTS
1.
SERVICE NOTE
1-1. Disc Removal Procedure If The Tray Cannot Be
Ejected (Forced Ejection) ............................................. 1-1
1-2. Work when optical device are replaced ........................ 1-1
1-3. Test Disc ....................................................................... 1-2
1-3-1. Operation and Display ............................................. 1-2
1-4. Drive Repairing............................................................. 1-15
1-4-1. Preparation .............................................................. 1-15
1-4-2. Checking Flow ~ Drive (BU) section ~ .................... 1-15
1-4-3. BU Check Flow [zz] ~ .............................................. 1-16
1-4-4. BU (Optical Block) Repair Guide ............................. 1-16
1-4-5. BU Adjustment Flow [yy] ~ ...................................... 1-17
1-4-6. KEM-460AAA/C2RP Packing Spec. ....................... 1-17
1-4-7. KEM-460AAA/C2RP Packing .................................. 1-18
1-4-8. BU Data Decode Jig ................................................ 1-19
1-4-9. Loading For Service ......................................... 1-19
1-4-10. Laser Caution Label ................................................ 1-20
2.
DISASSEMBLY
2-1. Disassembly Flow ........................................................ 2-1
2-2. Upper Case .................................................................. 2-1
2-3. Tray Cover Assy .......................................................... 2-2
2-4. BD Drive ....................................................................... 2-2
2-5. Front Panel Assy, SWB-001 and SWP-001.................. 2-3
2-6. Rear Panel Block.......................................................... 2-4
2-7. MB-134 Board .............................................................. 2-4
2-8. Switching Regulator ..................................................... 2-5E
3.
BLOCK DIAGRAMS
3-1. Overall Block Diagram.................................................. 3-1
3-2. DSP Block Diagram ...................................................... 3-2
3-3. AV OUT Block Diagram ................................................ 3-3
3-4. USB/ETHER, Block Diagram .................................. 3-4
3-5. Power Block Diagram .......................................... 3-5
4.
SCHEMATIC DIAGRAMS
4-1. This Note Is Common For Schematic Diagrams .......... 4-1
4-2. Frame Schematic Diagram........................................... 4-2
4-3. FR-309 Board (FRONT RIGHT) Schematic Diagram ... 4-3
4-4. FR-309 Board (USB FRONT) Schematic Diagram ...... 4-4
4-5. MB-134 Board (CXD9983GG/9984GG)
Schematic Diagram (1/15)............................................ 4-5
4-6. MB-134 Board (CXD9983GG/9984GG)
Schematic Diagram (2/15)............................................ 4-6
4-13. MB-134 Board (AUDIO)
Schematic Diagram (9/15)............................................ 4-13
4-14. MB-134 Board (VIDEO)
Schematic Diagram (10/15).......................................... 4-14
4-15. MB-134 Board (GPIO/JTAG)
Schematic Diagram (11/15) .......................................... 4-15
4-16. MB-134 Board (ETHERNET)
Schematic Diagram (12/15).......................................... 4-16
4-17. MB-134 Board (FE_POWER/SF/SATA)
Schematic Diagram (13/15).......................................... 4-17
4-18. MB-134 Board (FE_OP/MOTOR DRIVE)
4-22. USB-023 Board (REAR)
Schematic Diagram ...................................................... 4-21
4-23. Waveforms ................................................................... 4-22E
5.
PRINTED WIRING BOARDS
5-1. This Note Is Common For Printed Wiring Boards ........ 5-1
5-2. SWB-001 Board (SWITCH) Printed Wiring Board........ 5-2
5-3. SWP-001 Board
Printed Wiring Board ...................................................... 5-2
5-4. FR-309 Board (FRONT RIGHT)
Printed Wiring Board ................................................... 5-3
5-5. MB-134 Board (MAIN)
Printed Wiring Board (Side A) ...................................... 5-4
5-6. MB-134 Board (MAIN)
Printed Wiring Board (Side B) ...................................... 5-5
5-7. USB-023 Board (REAR)
Printed Wiring Board .................................................... 5-6E
6.
IC PIN FUNCTION DESCRIPTION
................... 6-1
7.
SERVICE MODE
..................................................... 7-1
8.
ERROR LOG LIST
................................................. 8-1
9.
TROUBLESHOOTING
............................................. 9-1
10. REPAIR PARTS LIST
10-1. Exploded Views ............................................................ 10-1
10-1-1. Case Section ........................................................... 10-1
10-1-2. Front/Rear Chassis Section .................................... 10-2
10-1-3. Main Chassis Section .............................................. 10-3
10-1-4. BD Section .............................................................. 10-4
10-1-5. Accessories ............................................................. 10-5
10-2. Electrical Parts List ....................................................... 10-6
BDP-BX37/S270/S370/S373/S470
4-19. MB-134 BOARD(IFD)
Schematic Diagram (15/15)
............................................ 4-19
4-20. SWB-001 BOARD
4-21. SWP-001 BOARD
Schematic Diagram (14/15) ........................................ 4-18
Schematic Diagram ...................................................... 4-20
Schematic Diagram ...................................................... 4-20
4-10. MB-134 Board (USB) Schematic Diagram (6/15)......... 4-10
4-11. MB-134 Board (HDMI)
Schematic Diagram (7/15)............................................ 4-11
4-12. MB-134 Board (SATA)
Schematic Diagram (8/15)............................................ 4-12
2-9. Circuit Boards Location ................................................ 2-5E
1-5. Harness Dressing ......................................................... 1-24
1-5-1. Front harness dressing for S270 only
..................... 1-24
1-5-2. Front harness dressing for BX37/S370/S373:
1-24
AE1;UK;RUSSIAN;KOREAN;AUSTRALIA;
THAILAND;CHINA,SAUDI ARABIA and EA7 ONLY
1-5-3. Front USB(USB-008) and Harness(SIM-001)
1-25
dressing for BX37/S370/S373: US,CND,PX,
TAIWAN,E,BRAZILIAN and ARGENTINA ONLY ....
e
g
a
P
e
lt
i
T
n
o
it
c
e
S
e
g
a
P
e
lt
i
T
n
o
it
c
e
S
1-3-2. Main functions
......................................................... 1-9
1-6. Power Cord Soldering Location ................................... 1-27
1-6-1. Soldering point for Switching Regulator (APS-257).... 1-27
1-6-2. Soldering point for Switching Regulator (SRV2206UC)1-27
1-5-4. Rear USB and Harness dressing for BDP-BX37/
1-26
S270/S370/S373/S470
Rear USB (USB-007) .............................................
4-8. MB-134 Board (CLK/POWER2)
Schematic Diagram (4/15)............................................ 4-8
4-9. MB-134 Board (FLASH/HOST)
Schematic Diagram (5/15)............................................ 4-9
4-7. MB-134 Board (POWER1)
Schematic Diagram (3/15)............................................ 4-7
1-7. Remove PT Protection on MB-134
1-28E
(Service Assy Main Board)...............
1-1
BDP-BX37/S270/S370/S373/S470
SECTION 1
SERVICE NOTE
1-1. DISC REMOVAL PROCEDURE IF THE TRAY CANNOT BE EJECTED (FORCED EJECTION)
1. Remove the upper case. (Refer to page 2-1)
2. Insert a clip in the hole of a drive and open a tray.
Note:
1-2. Work when optical device are replaced
Note: Please do the following work when you replace the optical device.
1. Install it in PC after downloading two set of software from following URL.
(Refer to “1-4-9. BU Data Decode Jig” on page 1-19)
STEP 1
Microsoft .NET Framework Version 2.0 Redistributable Package (x86)
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5
STEP 2
Microsoft .NET Framework 2.0 Service Pack 1 (x86)
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5
2. Take a photograph of the bar code on the optical device. The valid bar code photo as shown in Fig.2
3. Drag-and-drop the bar code photograph to the icon of decode software (BDBUDec).
* The decode software is a complete set of “BDBUDec”, “Tasman.Bars.dll”, and “SavePath”.
* Because decode software cannot be attached, it separately distributes it.
4. Input the password when you start decode software.
* Inquire of each service headquarters because the password cannot be disclosed.
5. Write the decode data to the set.
(Refer to “1-4-4. BU (Optical Block) Repair Guide” on page 1-16 and “1-4-5. BU Adjustment Flow [yy]” on page 1-17)
tray
Fig.2
Fig.1
(Use clip diameter about 1.2 mm)
hole
(12~32)mm
clip
