BDP-BX2, BDP-S357, BDP-S360, BDP-S363 - Sony DVD Service Manual (repair manual)

2009I0500-1

© 2009.9

Photo: BDP-S360

TM

Laser: Semiconductor laser

(Jack name: 

Phono jack/2 Vrms/10 kilohms

Optical output jack/–18 dBm
(wave length 660 nm)

Phono jack/0.5 Vp-p/75 ohms

HDMI 19-pin standard connector

Phono jack/Y: 1.0 Vp-p/
P

B

, P

R

: 0.7Vp-p/75ohms

(EXCEPT US, Canadian, PX):
Phono jack/Y: 1.0Vp-p/
P

B

/C

B

, P

R

/C

R

: 0.7Vp-p/75ohms

Phono jack/1.0 Vp-p/75 ohms

100BASE-TX Terminal

External memory slot (For connecting the 
external memory)
DC output: 5 V 500 mA Max

120 V AC, 60 Hz (US, Canadian)
110 – 240 V AC, 50/60 Hz (E, PX, 

22 W

430 mm × 216 mm × 56 mm 
(17 in. × 8 

5

/

8

 in. × 2 

1

/

4

 in.)

(width/depth/height) incl. projecting parts

2.1 kg (4 lb 10 

1

/

8

 oz)

5 ºC to 35 ºC (41 °F to 95 °F)

25 % to 80 %

Specifications and design are subject to 
change without notice.

s Audio/video cable (phono plug ×3) (1) 

s AC power cord (1)
s HDMI cable (1) 

s Remote commander (remote) (1)
s Size AA (R6) batteries (2)
s Plug Adaptor (1) (E, PX)

110 V AC, 60 Hz (Taiwan)

220 V AC, 60 Hz (Korean)
220 – 240 V AC, 50/60 Hz (EC1, EC2, 
CEK, Australian, Chinese, Russian)

Jack type/Output level/Load impedance)

Saudi Arabia, Brazilian, Hong Kong, Thai)

(US, Canadian, Australian, Chinese, PX, 
Russian, Saudi Arabia, Hong Kong, Taiwan, 
Korea, Thai)

(BX2: US, Canadian/S360: E

, Brazilian

)

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers' instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a 
passive VOM that is suitable. Nearly all battery operated digital 
multimeters that have a 2V AC range are suitable. (See Fig. A)

1.  Check the area of your repair for unsoldered or poorly-soldered 

connections. Check the entire board surface for solder splashes 
and bridges.

2.  Check the interboard wiring to ensure that no wires are “pinched” 

or contact high-wattage resistors.

3.  Look for unauthorized replacement parts, particularly transistors, 

that were installed during a previous repair. Point them out to 
the customer and recommend their replacement.

4.  Look for parts which, though functioning, show obvious signs 

of deterioration. Point them out to the customer and recommend 
their replacement.

5.  Check the line cord for cracks and abrasion. Recommend the 

replacement of any such line cord to the customer.

6.  Check the B+ voltage to see it is at the values specified.
7.  Check the antenna terminals, metal trim, “metallized” knobs, 

screws, and all other exposed metal parts for AC leakage. Check 
leakage as described below.

After correcting the original service problem, perform the following 
safety checks before releasing the set to the customer:

Ω

µ

Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40°C higher than 

ordinary solder.

  Ordinary soldering irons can be used but the iron tip has to be 

applied to the solder joint for a slightly longer time.

  Soldering irons using a temperature regulator should be set to 

about 350°C.

  Caution: The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

• Strong viscosity
  Unleaded solder is more viscous (sticky, less prone to flow) than 

ordinary solder so use caution not to let solder bridges occur such 
as on IC pins, etc.

•  Usable with ordinary solder
  It is best to use only unleaded solder but unleaded solder may 

also be added to ordinary solder.

CAUTION:
The use of optical instrument with this product will increase eye 
hazard.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specified herein may result in hazardous radia-
tion exposure.

This label is located on the laser 
protective housing inside the 
enclosure.

COMPONENTS  IDENTIFIED  BY  MARK    OR  DOTTED  LINE  
WITH  MARK    ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.  RE-
PLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE  
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR  
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.

LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE    
SUR  LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  
DES  PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE  
FONCTIONNEMENT.  NE  REMPLACER  CES  COMPOSANTS  
QUE  PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  
DONNÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉ-
MENTS  PUBLIÉS  PAR  SONY.

This appliance is classified as a 
CLASS 1 LASER product. The 
CLASS 1 LASER PRODUCT 
MARKING is located on the laser 
protective housing inside the 
enclosure. (EC1, EC2, CEK, 
Australian, Chinese, Russian, 
Saudi Arabia, Hong Kong, 
Taiwan, Korea, Thai)

1. 

SERVICE  NOTE

1-1.  Disc Removal Procedure If The Tray Cannot Be 
 

Ejected (Forced Ejection) .............................................  1-1

1-2.  Work when optical device are replaced ........................  1-1
1-3. Test 

Disc 

.......................................................................  

1-2

  1-3-1.  Operation and Display .............................................  1-2
1-4. Drive 

Repairing.............................................................  

1-15

  1-4-1.  Preparation ..............................................................  1-15
  1-4-2.  Checking Flow ~ Drive (BU) section ~ ....................  1-15
  1-4-3.  BU Check Flow [zz] ~ ..............................................  1-16
  1-4-4.  BU (Optical Block) Repair Guide .............................  1-16
  1-4-5.  BU Adjustment Flow [yy] ~ ......................................  1-17
  1-4-6.  KEM-430AAA/C2RP Packing Spec. .......................  1-17
  1-4-7.  KEM-430AAA/C2RP Folding Motor FFC ................  1-18
  1-4-8.  KEM-430AAA/C2RP Packing ..................................  1-18
  1-4-9.  BU Data Decode Jig ................................................  1-19
  1-4-10.  Loading For Service ................................................  1-19
  1-4-11.  Laser Caution Label ................................................  1-20
  1-4-12.  Useful service mode function ..................................  1-20
1-5.  BU Service Policy .........................................................  1-21

2. DISASSEMBLY

2-1. Disassembly 

Flow 

........................................................  

2-1

2-2. Upper 

Case 

..................................................................  

2-1

2-3. Front 

Panel 

Assy 

..........................................................  

2-2

2-4. BD 

Drive 

.......................................................................  

2-2

2-5.  Rear Panel Block..........................................................  2-3
2-6. MB-127 

Board 

..............................................................  

2-3

2-7. Switching 

Regulator 

.....................................................  

2-4

2-11.  Circuit Boards Location ................................................  2-4

3. 

BLOCK  DIAGRAMS

3-1.  Overall Block Diagram..................................................  3-1
3-2.  DSP Block Diagram ......................................................  3-2
3-3.  AV OUT Block Diagram ................................................  3-3
3-4.  USB/ETHER, FL Block Diagram ..................................  3-4
3-5.  Power Block Diagram (1/2) ..........................................  3-5
3-6.  Power Block Diagram (2/2) ..........................................  3-6

4. 

SCHEMATIC  DIAGRAMS

4-1.  This Note Is Common For Schematic Diagrams ..........  4-1
4-2.  Frame Schematic Diagram...........................................  4-2
4-3.  FL-193 Board (SWITCH) Schematic Diagram .............  4-3
4-4.  FR-301 Board (FL DRIVER) Schematic Diagram ........  4-4
4-5.  MB-127 Board (MC10121F1 DDR2-A) 
 

Schematic Diagram (1/14)............................................  4-5

4-6.  MB-127 Board (MC10121F1 DDR2-B) 
 

Schematic Diagram (2/14)............................................  4-6

4-7.  MB-127 Board (POWER1) 
 

Schematic Diagram (3/14)............................................  4-7

4-8.  MB-127 Board (CLK/POWER2) 
 

Schematic Diagram (4/14)............................................  4-8

4-9.  MB-127 Board (FLASH/HOST) 
 

Schematic Diagram (5/14)............................................  4-9

4-10.  MB-127 Board (USB) Schematic Diagram (6/14).........  4-10
4-11.  MB-127 Board (HDMI/SATA) 
 

Schematic Diagram (7/14)............................................  4-11

4-12.  MB-127 Board (AUDIO/VIDEO) 
 

Schematic Diagram (8/14)............................................  4-12

4-13.  MB-127 Board (GPIO/JTAG) 
 

Schematic Diagram (9/14)............................................  4-13

4-14.  MB-127 Board (IPIO) 
 

Schematic Diagram (10/14)..........................................  4-14

4-15.  MB-127 Board (ETHERNET) 
 

Schematic Diagram (11/14) ..........................................  4-15

4-16.  MB-127 Board (RF SDRAM) 
 

Schematic Diagram (12/14)..........................................  4-16

4-17.  MB-127 Board (DRIVE/RF) 
 

Schematic Diagram (13/14)..........................................  4-17

4-18.  MB-127 Board (IFD) Schematic Diagram (14/14) ........  4-18
4-19.  USB-014 Board (USB CONNECTOR) 
 Schematic 

Diagram 

......................................................  

4-19

4-20. Waveforms ...................................................................  4-20

5. 

PRINTED  WIRING  BOARDS

5-1.  This Note Is Common For Printed Wiring Boards ........  5-1
5-2.  FL-193 Board (SWITCH) Printed Wiring Board............  5-2
5-3.  FR-301 Board (FL DRIVER) 
 

Printed Wiring Board (Side A) ......................................  5-3

5-4.  FR-301 Board (FL DRIVER) 
 

Printed Wiring Board (Side B) ......................................  5-4

5-5.  MB-127 Board (MAIN) 
 

Printed Wiring Board (Side A) ......................................  5-5

5-6.  MB-127 Board (MAIN) 
 

Printed Wiring Board (Side B) ......................................  5-6

5-7.  USB-014 Board (USB CONNECTOR) 
 

Printed Wiring Board ....................................................  5-7

6. 

IC  PIN  FUNCTION  DESCRIPTION

 ...................   6-1

7. 

SERVICE  MODE

 .....................................................   7-1

8. 

ERROR  LOG  LIST

 .................................................   8-1

9. TROUBLESHOOTING

 .............................................  9-1

10.  REPAIR  PARTS  LIST

10-1. Exploded Views ............................................................  10-1
  10-1-1.  Case Section ...........................................................  10-1
  10-1-2.  Front/Rear Chassis Section ....................................  10-2
  10-1-3.  Main Chassis Section ..............................................  10-3
  10-1-4.  BD Section ..............................................................  10-4
  10-1-5.  Accessories .............................................................  10-5
10-2.  Electrical Parts List .......................................................  10-6

1.  Remove the upper case. (Refer to page 2-1)
2.  Insert a clip in the hole of a drive and open a tray. 
 

Note: Use a clip of about 1.2 mm in the diameter

Note: Please do the following work when you replace the optical device. 

1.  Install it in PC after downloading two set of software from following URL. 
 

(Refer to “1-4-9. BU Data Decode Jig” on page 1-19)

 STEP 

1

 

Microsoft .NET Framework Version 2.0 Redistributable Package (x86)

 

http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5

 STEP 

2

 

Microsoft .NET Framework 2.0 Service Pack 1 (x86)

 

http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5

2.  Take the photograph the part of the bar code of the optical device. (Refer to the following picture)

 

3.  Drag-and-drop the bar code photograph to the icon of decode software (BDBUDec). 
*  The decode software is a complete set of “BDBUDec”, “Tasman.Bars.dll”, and “SavePath”. 
*  Because docode software cannot be attached, it separately distributes it.

4.  Input the password when you start decode software.
*  Inquire of each service headquarters because the password cannot be disclosed. 

5.  Write the decode data to the set. 
 

(Refer to “1-4-4. BU (Optical Block) Repair Guide” on page 1-16 and “1-4-5. BU Adjustment Flow [yy]” on page 1-17)

tray

clip
(Use that of about 1.2 mm in the diameter)

hole