Read Sony NEX-VG10 / NEX-VG10E Service Manual online
NEX-VG10/VG10E_L3
2-1
(ENGLISH)
NOTE:
• -XX, -X mean standardized parts, so they may have some dif-
ferences from the original one.
• Items marked “*” are not stocked since they are seldom required
for routine service. Some delay should be anticipated when
ordering these items.
• The mechanical parts with no reference number in the exploded
views are not supplied.
• Due to standardization, replacements in the parts list may be
different from the parts specified in the diagrams or the com-
ponents used on the set.
• CAPACITORS:
uF: μF
• COILS
uH: μH
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
• SEMICONDUCTORS
In each case, u: μ, for example:
uA...: μA... , uPA... , μPA... ,
uPB... , μPB... , μPC... , μPC... ,
uPD..., μPD...
(JAPANESE)
【使用上の注意】
• ここに記載されている部品は, 補修用部品であるため, 回路図
及びセットに付いている部品と異なる場合があります。
• -XX, -Xは標準化部品のため, セットに付いている部品と異な
る場合があります。
• *印の部品は常備在庫しておりません。
• コンデンサの単位でuFはμFを示します。
• 抵抗の単位Ωは省略してあります。
金 被：金属被膜抵抗。
サンキン：酸化金属被膜抵抗。
• インダクタの単位でuHはμHを示します。
• 半導体の名称でuA..., uPA..., uPB..., uPC..., uPD...等はそれぞれ
μA..., μPA..., μPB..., μPC..., μPD...を示します。
2. REPAIR PARTS LIST
The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque
Les composants identifiés par une marque
0
sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant
le numéro spécifié.
図面番号で部品を指定するときは基板名
又はブロックを併せて指定してください。
お願い
0
印の部品，または0印付の点線で囲ま
れた部品は，安全性を維持するために，
重要な部品です。
従って交換時は，必ず指定の部品を使用
してください。
When indicating parts by reference
number,please include the board name.
A-1797-882-A SERVICE, MOUNT BLOCK ASSY (Note)
(Not supplied) IS-077 BOARD, COMPLETE
*********************
(IS-077 complete board and all mounted parts (including CP001 (CMOS imager)) are
not supplied, but they are included in Mount block assy service.)
A-1792-801-A MT-071 BOARD, COMPLETE
**********************
< CAPACITOR >
C2001 1-164-937-11 CERAMIC CHIP 0.001uF
10%
50V
*
C2002 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C3001 1-165-908-11 CERAMIC CHIP 1uF
10%
10V
C3002 1-100-567-81 CERAMIC CHIP 0.01uF
10%
25V
C3003 1-100-597-91 CERAMIC CHIP 0.1uF
10%
25V
*
C3004 1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C3005 1-100-567-81 CERAMIC CHIP 0.01uF
10%
25V
< CONNECTOR >
CN1001 1-817-920-11 CONNECTOR, FPC (ZIF) 80P
*
CN2001 1-822-914-11 CONNECTOR, FPC (LIF (NON-ZIF)) 16P
*
CN3001 1-821-857-51 CONNECTOR, FPC (LIF (NON-ZIF))
*
CN3002 1-822-914-11 CONNECTOR, FPC (LIF (NON-ZIF)) 16P
*
CN4001 1-816-643-51 FFC/FPC CONNECTOR (LIF) 10P
< DIODE >
D2001 8-719-069-29 DIODE RB520S-30FJTE61
D2002 8-719-084-17 DIODE EMZ6.8ET2R
D2003 8-719-084-17 DIODE EMZ6.8ET2R
*
D2004 6-501-017-01 DIODE VDZT2R12B
D2005 6-500-854-01 DIODE 1SS413 (TPL3)
D3001 8-719-056-23 DIODE MA2S111-(K8).SO
D4001 8-719-083-66 DIODE UDZSUSTE-1718B
D4002 8-719-083-66 DIODE UDZSUSTE-1718B
< IC >
*
IC2001 6-711-430-01 IC TC74VHC367FK (EL)
*
IC3001 6-715-286-01 IC AN41400A-PB
< TRANSISTOR >
Q2001 6-551-202-01 TRANSISTOR LM6K1FS8T2R
Q2002 6-550-576-01 TRANSISTOR SSM6E01TU
*
Q3001 6-552-077-01 TRANSISTOR
RUE003N02TL
Q4001 6-551-374-01 TRANSISTOR SSM6N25TU
Q4002 6-551-630-01 TRANSISTOR
RN1102MFV (TL3S
< RESISTOR >
R2001 1-218-965-11 METAL CHIP
10K
5%
1/16W
R2002 1-218-941-81 METAL CHIP
100
5%
1/16W
R2004 1-218-977-11 METAL CHIP
100K
5%
1/16W
R2006 1-218-977-11 METAL CHIP
100K
5%
1/16W
R2008 1-218-977-11 METAL CHIP
100K
5%
1/16W
R2009 1-218-981-91 METAL CHIP
220K
5%
1/16W
R2010 1-218-953-11 METAL CHIP
1K
5%
1/16W
R2011 1-218-989-11 METAL CHIP
1M
5%
1/16W
R2012 1-218-965-11 METAL CHIP
10K
5%
1/16W
R2013 1-218-965-11 METAL CHIP
10K
5%
1/16W
R2014 1-218-977-11 METAL CHIP
100K
5%
1/16W
R2015 1-218-977-11 METAL CHIP
100K
5%
1/16W
R2017 1-218-949-11 METAL CHIP
470
5%
1/16W
R2018 1-218-949-11 METAL CHIP
470
5%
1/16W
Ref. No.
Part No.
Description
R2019 1-218-949-11 METAL CHIP
470
5%
1/16W
R2020 1-218-949-11 METAL CHIP
470
5%
1/16W
R2021 1-218-949-11 METAL CHIP
470
5%
1/16W
R2022 1-218-949-11 METAL CHIP
470
5%
1/16W
R3001 1-218-977-11 METAL CHIP
100K
5%
1/16W
R3002 1-216-791-11 METAL CHIP
3.3
5%
1/10W
R4001 1-218-941-81 METAL CHIP
100
5%
1/16W
R4002 1-218-961-11 METAL CHIP
4.7K
5%
1/16W
< COMPOSITION CIRCUIT BLOCK >
RB4001 1-234-381-11 RES, NETWORK 100K (1005X4)
A-1792-867-A VC-608 BOARD, COMPLETE (SERVICE)
**********************
(IC1001 is not supplied, but this is included in VC-608 complete board.)
< CAPACITOR >
*
C001
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
*
C004
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C0101 1-165-875-11 CERAMIC CHIP 10uF
10%
10V
*
C0103 1-112-298-91 CERAMIC CHIP 1uF
10%
16V
C0104 1-127-715-11 CERAMIC CHIP 0.22uF
10%
16V
C0105 1-125-777-11 CERAMIC CHIP 0.1uF
10%
10V
C0106 1-125-777-11 CERAMIC CHIP 0.1uF
10%
10V
C0107 1-125-777-11 CERAMIC CHIP 0.1uF
10%
10V
*
C0108 1-112-716-11 CERAMIC CHIP 0.1uF
10%
6.3V
C0109 1-165-989-11 CERAMIC CHIP 10uF
10%
6.3V
C0113 1-165-908-11 CERAMIC CHIP 1uF
10%
10V
C0114 1-125-777-11 CERAMIC CHIP 0.1uF
10%
10V
C0115 1-125-777-11 CERAMIC CHIP 0.1uF
10%
10V
*
C0116 1-112-298-91 CERAMIC CHIP 1uF
10%
16V
C0117 1-127-760-11 CERAMIC CHIP 4.7uF
10%
6.3V
C0118 1-165-908-11 CERAMIC CHIP 1uF
10%
10V
C0119 1-107-823-11 CERAMIC CHIP 0.47uF
10%
16V
C0120 1-100-567-81 CERAMIC CHIP 0.01uF
10%
25V
C0121 1-164-935-11 CERAMIC CHIP 470PF
10%
50V
C0122 1-100-567-81 CERAMIC CHIP 0.01uF
10%
25V
C0123 1-165-908-11 CERAMIC CHIP 1uF
10%
10V
C0124 1-165-908-11 CERAMIC CHIP 1uF
10%
10V
C0125 1-165-908-11 CERAMIC CHIP 1uF
10%
10V
C0126 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C0127 1-165-908-11 CERAMIC CHIP 1uF
10%
10V
C0128 1-165-989-11 CERAMIC CHIP 10uF
10%
6.3V
C0129 1-165-989-11 CERAMIC CHIP 10uF
10%
6.3V
C0130 1-165-989-11 CERAMIC CHIP 10uF
10%
6.3V
C0131 1-165-989-11 CERAMIC CHIP 10uF
10%
6.3V
C0132 1-165-989-11 CERAMIC CHIP 10uF
10%
6.3V
C0133 1-165-908-11 CERAMIC CHIP 1uF
10%
10V
C0134 1-100-591-91 CERAMIC CHIP 1uF
10%
25V
C0136 1-112-717-91 CERAMIC CHIP 1uF
10%
6.3V
C0137 1-100-415-91 CERAMIC CHIP 0.47uF
10%
6.3V
C0138 1-164-937-11 CERAMIC CHIP 0.001uF
10%
50V
*
C0201 1-114-728-91 CERAMIC CHIP 22uF
10%
10V
C0203 1-165-908-11 CERAMIC CHIP 1uF
10%
10V
C0204 1-165-908-11 CERAMIC CHIP 1uF
10%
10V
C0205 1-125-777-11 CERAMIC CHIP 0.1uF
10%
10V
C0206 1-164-936-11 CERAMIC CHIP 680PF
10%
50V
C0208 1-100-581-81 CERAMIC CHIP 0.0047uF 10%
50V
C0209 1-164-933-11 CERAMIC CHIP 220PF
10%
50V
Ref. No.
Part No.
Description
Note:
Be sure to read “Precautions for Replacement of Imager”
on page 6-1 when changing the Imager.
Note:
イメージャの交換時は，6-1ページの"イメージャ交換時の
注意"を必ずお読みください。
2-2. ELECTRICAL PARTS LIST
IS-077
MT-071
VC-608
Click on the first or last page to see other NEX-VG10 / NEX-VG10E service manuals if exist.