ILCE-3000K, ILCE-3500J - Sony Digital Camera Service Manual (repair manual). Page 13

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ILCE-3000K/3500J_L3
6-1
6. SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS
THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS.
(In addition to this, the necessary note is printed in each block.)
For Schematic Diagrams
•  All capacitors are in 
μF unless otherwise noted. pF : μ μF.  50 V 
or less are not indicated except for electrolytics and tantalums.
•  Chip resistors are 1/10 W unless otherwise noted.
  k
Ω=1000 Ω, MΩ=1000 kΩ.
•  Caution when replacing chip parts.
  New parts must be attached after removal of chip.
  Be careful not to heat the minus side of tantalum capacitor, 
Because it is damaged by the heat.
•  Some chip part will be indicated as follows.
 Example 
C541 
L452
  
22U 
10UH
  
TA 
 
2520
     Kinds of capacitor    External dimensions (mm)
                  Case size
•  Constants of resistors, capacitors, ICs and etc with XX indicate 
that they are not used.
  In such cases, the unused circuits may be indicated.
• Parts with ★ differ according to the model/destination.
  Refer to the mount table for each function.
•  All variable and adjustable resistors have characteristic curve 
B, unless otherwise noted.
• Signal name
 XEDIT 
→ EDIT PB/XREC 
→ PB/REC
• 
 : non flammable resistor
• 
 : fusible resistor
• 
 : panel designation
• 
 : B+ Line
• 
 : B– Line
• 
 
: IN/OUT direction of (+, –) B LINE.
• 
 : adjustment for repair.
For Printed Wiring Boards
• 
  
: Uses unleaded solder.
• 
 : Circuit board
 
 : Flexible board
  Pattern from the side which enables seeing.
 
 
: pattern of the rear side
  (The other layers’ patterns are not indicated)
•  Through hole is omitted.
•  There are a few cases that the part printed on diagram isn’t 
mounted in this model.
• 
 : panel designation
• Chip parts.
 Transistor          Diode
 
2
1
3
2
1
3
2
1
3
3
4
5
2
1
1
2
3
6
5
4
E
B
C
3
1
5
2
4
6
1
2
3
6
5
4
3
1
5
2
4
6
1
2
3
5
4
4 3
1
2
3
1 2
4
5
5
3 4
1
2
1
4
2
3
4
6
2
5
3
1
1
2
4
3
1
4
2
3
Precautions for Replacement of Imager
•  If the imager has been replaced, carry out all the adjustments 
for the camera section.
• As the imager may be damaged by static electricity from its 
structure, handle it carefully like for the MOS IC.
  In addition, ensure that the receiver is not covered with dusts 
nor exposed to strong light.
When indicating parts by reference 
number, please include the board name.
The components identified by mark  
or dotted line with mark  are critical 
for safety.
Replace only with part number specified.
Les composants identifiés par une 
marque  sont critiques pour la sécurité.
Ne les remplacer que par une pièce 
portant le numéro spécifié.
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