DSC-S30, DSC-S50 (serv.man2) - Sony Digital Camera Service Manual (repair manual). Page 89

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6-5
NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts speci-
fied in the diagrams or the components used
on the set.
• -XX and -X mean standardized parts, so they
may have some difference from the original
one.
• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
• Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when order-
ing these items.
• SEMICONDUCTORS
In each case, u: µ, for example:
uA. .
: µA. .
uPA. .
: µPA. .
uPB. . : µPB. .
uPC. .
: µPC. .
uPD. . : µPD. .
• CAPACITORS
uF: µF
• COILS
uH: µH
6-2. ELECTRICAL  PARTS  LIST
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
Les composants identifiés par une
marque 0 sont critiquens pour la
sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.
When indicating parts by reference
number, please include the board.
CD-262     DD-141
• Abbreviation
AUS : Australian model
CN
: Chinese model
CND : Canadian model
HK : Hong Kong model
J
: Japanese model
JE
: Tourist model
KR : Korea model
A-7074-435-A CD-262 (30) BOARD, COMPLETE (S30)
A-7074-429-A CD-262 (50) BOARD, COMPLETE (S50)
***************************
(Ref.No.: 2,000 Series)
(IC301 is not included in this complete board)
< CAPACITOR >
C301
1-113-985-11 TANTAL. CHIP
10uF
20%
20V
C302
1-119-751-11 TANTAL. CHIP
22uF
20%
16V
C303
1-164-943-11 CERAMIC CHIP
0.01uF
10%
16V
C304
1-104-329-11 CERAMIC CHIP
0.1uF
10%
50V
C305
1-107-826-91 CERAMIC CHIP
0.1uF
10%
16V
C306
1-107-826-91 CERAMIC CHIP
0.1uF
10%
16V
C307
1-107-826-91 CERAMIC CHIP
0.1uF
10%
16V
C308
1-107-820-11 CERAMIC CHIP
0.1uF
16V
C309
1-164-850-11 CERAMIC CHIP
10PF
0.50PF 16V
C311
1-125-827-91 CERAMIC CHIP
1uF
10%
25V
C312
1-162-966-11 CERAMIC CHIP
0.0022uF 10%
50V
< CONNECTOR >
CN301
1-766-348-21 CONNECTOR, FFC/FPC 18P
< DIODE >
D301
8-719-073-01 DIODE   MA111- (K8).S0
< FERRITE BEAD >
FB301
1-414-228-11 INDUCTOR CHIP 0uH
< IC >
IC301
A-7031-090-A CCD BLOCK ASSY (CCD IMAGER) (S30)
IC301
A-7031-092-A CCD BLOCK ASSY (CCD IMAGER) (S50)
< COIL >
L301
1-414-757-11 INDUCTOR
100uH
< TRANSISTOR >
Q301
8-729-037-74 TRANSISTOR   UN9213J- (K8).SO
Q302
8-729-117-73 TRANSISTOR   2SC4178-F13F14-T1
< RESISTOR >
R301
1-218-937-11 RES-CHIP
47
5%
1/16W
R302
1-218-935-11 RES-CHIP
33
5%
1/16W
(S30)
R302
1-218-931-11 RES-CHIP
15
5%
1/16W
(S50)
R303
1-218-935-11 RES-CHIP
33
5%
1/16W
(S30)
R303
1-218-931-11 RES-CHIP
15
5%
1/16W
(S50)
R304
1-218-963-11 RES-CHIP
6.8K
5%
1/16W
(S30)
R304
1-218-957-11 RES-CHIP
2.2K
5%
1/16W
(S50)
R305
1-218-989-11 RES-CHIP
1M
5%
1/16W
(S30)
R305
1-218-981-11 RES-CHIP
220K
5%
1/16W
(S50)
R306
1-218-959-11 RES-CHIP
3.3K
5%
1/16W
R307
1-218-990-11 SHORT
0
R308
1-218-977-11 RES-CHIP
100K
5%
1/16W
R309
1-218-937-11 RES-CHIP
47
5%
1/16W
(S30)
R309
1-208-643-11 RES-CHIP
22
5%
1/16W
(S50)
PPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPP
A-7074-434-A DD-141 (30) BOARD, COMPLETE (S30)
A-7074-426-A DD-141 (50) BOARD, COMPLETE (S50)
****************************
(Ref.No.: 1,000 Series)
< CAPACITOR >
C001
1-164-880-11 CERAMIC CHIP
180PF
5%
16V
C002
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C003
1-110-563-11 CERAMIC CHIP
0.068uF
10%
16V
C004
1-107-819-11 CERAMIC CHIP
0.022uF
10%
16V
C005
1-164-937-11 CERAMIC CHIP
0.001uF
10%
16V
C007
1-107-819-11 CERAMIC CHIP
0.022uF
10%
16V
C008
1-107-819-11 CERAMIC CHIP
0.022uF
10%
16V
C009
1-104-913-11 TANTAL. CHIP
10uF
20%
16V
C010
1-107-819-11 CERAMIC CHIP
0.022uF
10%
16V
(Note) Be sure to read “Precautions for Replcement of
CCD Imager” on page 4-8 when changing
the CCD imager
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