Read Sony DSC-H55 Service Manual online
DSC-H55_L3
2-1
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2. REPAIR PARTS LIST
(ENGLISH)
NOTE:
• -XX, -X mean standardized parts, so they may have some
• -XX, -X mean standardized parts, so they may have some
differences from the original one.
• Items marked “*” are not stocked since they are seldom re-
quired for routine service. Some delay should be anticipated
when ordering these items.
when ordering these items.
• The mechanical parts with no reference number in the exploded
views are not supplied.
• Due to standardization, replacements in the parts list may
be different from the parts specified in the diagrams or the
components used on the set.
components used on the set.
• CAPACITORS:
uF:
uF:
μF
• COILS
uH:
uH:
μH
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F:
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F:
nonflammable
• SEMICONDUCTORS
In each case, u: μ, for example:
uA...:
In each case, u: μ, for example:
uA...:
μA... , uPA... , μPA... ,
uPB...
,
μPB... , uPC... , μPC... ,
uPD...,
μPD...
(JAPANESE)
【使用上の注意】
• ここに記載されている部品は, 補修用部品であるため, 回路
図及びセットに付いている部品と異なる場合があります。
• -XX, -Xは標準化部品のため, セットに付いている部品と異な
る場合があります。
• *印の部品は常備在庫しておりません。
• コンデンサの単位でuFはμFを示します。
• 抵抗の単位Ωは省略してあります。
金 被：金属被膜抵抗。
サンキン：酸化金属被膜抵抗。
• インダクタの単位でuHはμHを示します。
• 半導体の名称でuA..., uPA..., uPB..., uPC..., uPD...等はそれぞれ
• コンデンサの単位でuFはμFを示します。
• 抵抗の単位Ωは省略してあります。
金 被：金属被膜抵抗。
サンキン：酸化金属被膜抵抗。
• インダクタの単位でuHはμHを示します。
• 半導体の名称でuA..., uPA..., uPB..., uPC..., uPD...等はそれぞれ
μA..., μPA..., μPB..., μPC..., μPD...を示します。
The components identified by mark 0
or dotted line with mark 0 are critical
for safety.
Replace only with part number speci-
fied.
Les composants identifiés par une mar-
que 0 sont critiques pour la sécurité.
Replace only with part number speci-
fied.
Les composants identifiés par une mar-
que 0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
portant le numéro spécifié.
When indicating parts by reference num-
ber, please include the board name.
ber, please include the board name.
A-1768-825-A CD-785 FLEXIBLE BOARD, COMPLETE
********************
(IC001 is not supplied, but this is included in CD-785 flexible complete board.)
< CAPACITOR >
C003 1-127-715-11 CERAMIC
CHIP 0.22uF 10% 16V
* C005
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C006
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C010
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C011
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C012
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
< IC >
IC001 (Not
supplied) ICX681SQU-13
(IC001 is supplied included in CD-785 flexible board.)
* IC002
* IC002
8-753-327-70
IC CXA3841UR-T9
< RESISTOR >
R001 1-218-980-11 METAL
CHIP
180K
5%
1/16W
R002 1-218-979-11 METAL
CHIP
150K
5%
1/16W
R003 1-218-977-11 METAL
CHIP
100K
5%
1/16W
R004 1-218-979-11 METAL
CHIP
150K
5%
1/16W
************************************************************
A-1773-701-A SY-255 BOARD, COMPLETE (SERVICE)
************
(CN705 and IC201 are not supplied, but this is included in SY-255 complete board
(SERVICE).)
(SERVICE).)
< CAPACITOR >
C003 1-100-670-11 CERAMIC
CHIP 4.7uF
20% 16V
C004 1-112-021-91 CERAMIC
CHIP 2.2uF
20% 16V
C006 1-164-935-11 CERAMIC
CHIP 470pF
10% 50V
C007 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C008 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C009 1-100-670-11 CERAMIC
CHIP 4.7uF
20% 16V
C011 1-100-611-91 CERAMIC
CHIP 2.2uF
20% 6.3V
C012 1-100-611-91 CERAMIC
CHIP 2.2uF
20% 6.3V
C016 1-100-611-91 CERAMIC
CHIP 2.2uF
20% 6.3V
C018 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C021 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C023 1-165-884-11 CERAMIC
CHIP 2.2uF
10% 6.3V
C024 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C026 1-165-884-11 CERAMIC
CHIP 2.2uF
10% 6.3V
C027 1-100-415-91 CERAMIC
CHIP 0.47uF 10% 6.3V
C029 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C030 1-100-611-91 CERAMIC
CHIP 2.2uF
20% 6.3V
C031 1-100-611-91 CERAMIC
CHIP 2.2uF
20% 6.3V
C036 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
* C037
1-112-864-81 CERAMIC CHIP 14pF
5%
50V
C038 1-164-852-11 CERAMIC
CHIP 12pF
5%
50V
* C041
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C042
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C046 1-164-850-11 CERAMIC
CHIP 10pF
0.5pF 50V
C047 1-164-850-11 CERAMIC
CHIP 10pF
0.5pF 50V
C052 1-100-611-91 CERAMIC
CHIP 2.2uF
20% 6.3V
C096 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
* C097
1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
C098 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C099 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
* C202
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C203 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
* C205
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C207
1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
* C208
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C209
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C210
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C213 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
* C218
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C221 1-100-611-91 CERAMIC
CHIP 2.2uF
20% 6.3V
* C222
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C227 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
* C228
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C230
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C231 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C232 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
* C234
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C235
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C237
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C238
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C239
1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
C241 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C242 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C243 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C247 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C248 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
* C253
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C254
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C255
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C256
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C257
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C258
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C260
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C262
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C264
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C265
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C266
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C267
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
* C268
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C269 1-100-611-91 CERAMIC
CHIP 2.2uF
20% 6.3V
* C283
1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
* C289
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C291 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C292 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C297 1-127-772-81 CERAMIC
CHIP 0.033uF 10% 10V
C299 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C301 1-112-300-91 CERAMIC
CHIP 4.7uF
10% 10V
C303 1-100-672-11 CERAMIC
CHIP 10uF
C304 1-164-939-11 CERAMIC
CHIP 0.0022uF 10% 50V
C305 1-104-760-11 CERAMIC
CHIP 0.047uF 10% 50V
C307 1-100-591-91 CERAMIC
CHIP 1uF
10% 25V
C308 1-100-611-91 CERAMIC
CHIP 2.2uF
20% 6.3V
C309 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
* C311
1-114-582-11 CERAMIC CHIP 0.1uF
10%
16V
C312 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
SY-255
2-2. ELECTRICAL PARTS LIST
Note 1 : Be sure to read “Precautions for Replace-
ment of Imager” on page 6-1 when changing
the imager.
the imager.
CD-785
Note 2 : Ferrite bead is mounted to the location where
R717 is printed.
Ver. 1.1 2010.05
0印の部品，または0印付の点線で囲まれた部品は，
安全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。
安全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。
図面番号で部品を指定するときは基板名又はブロック
を併せて指定してください。
を併せて指定してください。
お願い
注意
電池の交換は，正しく行わないと破裂する恐れがあります。
電池を交換する場合には必ず同じ型名の電池又は同等品と
交換してください。
使用済み電池は，取扱指示に従って処分してください。
電池を交換する場合には必ず同じ型名の電池又は同等品と
交換してください。
使用済み電池は，取扱指示に従って処分してください。
Note 1: イメージャの交換時は6-1ページの イメージャ交
換時の注意 を必ずお読みください。
Note 2: R717にはフェライトビーズがマウントされていま
す。
Click on the first or last page to see other DSC-H55 service manuals if exist.