Read Sony DSC-G3 Service Manual online
5-8
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
5-2. ELECTRICAL PARTS LIST
DSC-G3_L3
A-1609-357-A CCD BLOCK ASSY (SERVICE)
(Not supplied) CD-747 FLEXIBLE BOARD, COMPLETE
(Not supplied) CD-747 FLEXIBLE BOARD, COMPLETE
*******************************
(IC001 (CCD imager) and CD-747 flexible complete board are not supplied,
but they are included in CCD block assy.)
< CAPACITOR >
C001
1-100-567-81 CERAMIC CHIP
0.01uF
10%
25V
C003
1-127-715-11 CERAMIC CHIP
0.22uF
10%
16V
C005
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
* C006
1-114-582-11 CERAMIC CHIP
0.1uF
10%
16V
C007
1-100-567-81 CERAMIC CHIP
0.01uF
10%
25V
C008
1-100-567-81 CERAMIC CHIP
0.01uF
10%
25V
C009
1-100-567-81 CERAMIC CHIP
0.01uF
10%
25V
* C010
1-114-582-11 CERAMIC CHIP
0.1uF
10%
16V
< IC >
IC001
(Not supplied) ICX665SQW-13 (Note 1)
(IC001 is supplied including in the CCD block assy.)
* IC002
8-753-294-89 IC CXA3741AUR-T9
< RESISTOR >
R003
1-218-985-11 METAL CHIP
470K
5%
1/16W
R007
1-218-983-11 METAL CHIP
330K
5%
1/16W
R008
1-218-979-11 METAL CHIP
150K
5%
1/16W
R009
1-218-980-11 METAL CHIP
180K
5%
1/16W
A-1565-676-A CN-396 BOARD, COMPLETE (Note 2)
***********************
< CAPACITOR >
* C001
1-112-746-11 CERAMIC CHIP
4.7uF
10%
6.3V
C002
1-112-717-91 CERAMIC CHIP
1uF
10%
6.3V
* C003
1-112-298-91 CERAMIC CHIP
1uF
10%
16V
* C004
1-112-298-91 CERAMIC CHIP
1uF
10%
16V
C006
1-112-300-91 CERAMIC CHIP
4.7uF
10%
10V
C007
1-112-300-91 CERAMIC CHIP
4.7uF
10%
10V
C008
1-164-937-11 CERAMIC CHIP
0.001uF
10%
50V
C009
1-100-415-91 CERAMIC CHIP
0.47uF
10%
6.3V
C010
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C011
1-112-300-91 CERAMIC CHIP
4.7uF
10%
10V
C012
1-112-300-91 CERAMIC CHIP
4.7uF
10%
10V
C013
1-112-717-91 CERAMIC CHIP
1uF
10%
6.3V
C014
1-112-717-91 CERAMIC CHIP
1uF
10%
6.3V
C015
1-112-717-91 CERAMIC CHIP
1uF
10%
6.3V
C016
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C017
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C101
1-112-534-11 CERAMIC CHIP
10uF
20%
6.3V
C102
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C103
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C104
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C105
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C106
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
< CONNECTOR >
* CN001
1-821-857-51 CONNECTOR, FPC (LIF (NON-ZIF))
* CN002
1-822-038-81 CONNECTOR, FPC (ZIF) 61P
* CN003
1-821-857-51 CONNECTOR, FPC (LIF (NON-ZIF))
* CN004
1-821-501-11 CONNECTOR, FPC (ZIF) 51P
< DIODE >
* D002
6-502-150-01 DIODE MA2SD320G8S0
< IC >
* IC101
6-713-191-01 IC KMCEG0000A-S998T00 (Note 2)
< COIL >
* L001
1-481-102-21 INDUCTOR
10uH
* L002
1-481-102-21 INDUCTOR
10uH
< TRANSISTOR >
Q101
6-550-576-01 TRANSISTOR
SSM6E01TU
< RESISTOR >
R001
1-218-953-11 METAL CHIP
1K
5%
1/16W
R101
1-218-985-11 METAL CHIP
470K
5%
1/16W
R105
1-218-990-81 SHORT CHIP
0
R106
1-218-990-81 SHORT CHIP
0
R107
1-218-990-81 SHORT CHIP
0
R108
1-218-990-81 SHORT CHIP
0
R109
1-218-990-81 SHORT CHIP
0
R110
1-218-990-81 SHORT CHIP
0
< TERMINAL >
TB001
1-780-112-11 TERMINAL, CONTACT
TB002
1-780-112-11 TERMINAL, CONTACT
Note 1: イメージャの交換時は4-3ページの“イメージャ
交換時の注意”を必ずお読みください。
Note 1: Be sure to read “Precautions for Replacement of
Imager” on page 4-2 when changing the imager.
CD-747 CN-396
Note 2: CN-396基板またはIC101の交換時にはService
Manual Level 2 1-6ページの“CN-396基板また
はIC101（内蔵メモリー）交換時の注意”を必
ずお読みください。
はIC101（内蔵メモリー）交換時の注意”を必
ずお読みください。
Note 2: Be sure to read “PRECAUTIONS ON REPLAC-
ING THE CN-396 BOARD OR IC101 (INTER-
NAL MEMORY)” on Service Manual Level 2 page
1-1 when changing the CN-396 board or IC101.
NAL MEMORY)” on Service Manual Level 2 page
1-1 when changing the CN-396 board or IC101.
Click on the first or last page to see other DSC-G3 service manuals if exist.