Read Sony DSC-G1 (serv.man2) Service Manual online
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DISASSEMBLY
SERVICE NOTE
SPECIFICATIONS
SCHEMATIC DIAGRAMS
FRAME SCHEMATIC DIAGRAM
BLOCK DIAGRAMS
REPAIR PARTS LIST
PRINTED WIRING BOARDS
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Revision History
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Sony Corporation
DSC-G1_L2
Internal memory
ON BOARD
Internal memory
ON BOARD
SERVICE MANUAL
Ver. 1.2 2011.03
2011C29-1
© 2011.03
Published by Sony Techno Create Corporation
9-852-175-32
US Model
Canadian Model
AEP Model
UK Model
E Model
Hong Kong Model
Chinese Model
Korea Model
Japanese Model
The components identified by
mark 0 or dotted line with
mark 0 are critical for safety.
Replace only with part num-
ber specified.
mark 0 or dotted line with
mark 0 are critical for safety.
Replace only with part num-
ber specified.
Les composants identifiés par une
marque 0 sont critiques pour la
sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
marque 0 sont critiques pour la
sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
DSC-G1
DIGITAL STILL CAMERA
• PRECAUTIONS AFTER SY-153 BOARD AND WIRELESS LAN MODULE (CP801) WERE REPLACED
Revised-1
Replacement of the
previously issued
SERVICE MANUAL 9-852-175-31
with this manual.
previously issued
SERVICE MANUAL 9-852-175-31
with this manual.
— 2 —
DSC-G1_L2
SPECIFICATIONS
Camera
[System]
Image device: 7.18 mm (1/2.5 type) color CCD,
Primary color filter
Total pixel number of camera:
Approx. 6 183 000 pixels
Effective pixel number of camera:
Approx. 6 003 000 pixels
Lens: Carl Zeiss Vario-Tessar 3
◊ zoom lens f =
6.33 – 19.0 mm (38 – 114 mm when
converted to a 35 mm still camera) F3.5 – 4.3
converted to a 35 mm still camera) F3.5 – 4.3
Exposure control: Automatic exposure, Scene
Selection (10 modes)
White balance: Automatic, Daylight, Cloudy,
Fluorescent, Incandescent, Flash
File format (DCF compliant):
Still images: Exif Ver. 2.21 JPEG compliant,
DPOF compatible
Movies: MPEG-4 compliant (Stereo)
DPOF compatible
Movies: MPEG-4 compliant (Stereo)
Recording media: Internal Memory (approx.
2 GB), “Memory Stick Duo”
Flash range (ISO (Recommended exposure index)
set to Auto): approx. 0.1 to 2.8 m (4 inches to
9 feet 2 1/2 inches) (W)/approx. 0.25 to 2.2 m
(9 7/8 inches to 7 feet 2 7/8 inches) (T)
9 feet 2 1/2 inches) (W)/approx. 0.25 to 2.2 m
(9 7/8 inches to 7 feet 2 7/8 inches) (T)
[Input and Output connectors]
Multi connector
USB communication: Hi-Speed USB (USB 2.0
USB communication: Hi-Speed USB (USB 2.0
compliant)
i (Headphones) jack: Stereo minijack
[LCD screen]
LCD panel: 8.8 cm (3.5 type) TFT drive
Total number of dots: 921 000 (1 920
Total number of dots: 921 000 (1 920
×480) dots
[Power, general]
Power: Rechargeable battery pack NP-FR1, 3.6 V
AC-LS5 AC Adaptor, 4.2 V
Power consumption (during shooting): 1.7 W
Operating temperature: 0 to 40
Operating temperature: 0 to 40
°C (32 to 104°F)
Storage temperature: –20 to +60
°C (–4 to +140°F)
Dimensions:
During shooting
113.8
113.8
×71.7×25.3 mm (4 1/2×2 7/8×1 inches)
(W/H/D, excluding protrusions)
During viewing
93.3
During viewing
93.3
×71.7×25.3 mm (3 3/4×2 7/8×1 inches)
(W/H/D, excluding protrusions)
Mass: Approx. 238 g (8.4 oz) (including NP-FR1
battery pack and wrist strap, etc.)
Microphone: Stereo
Speaker: Monaural (Headphones (not supplied):
Speaker: Monaural (Headphones (not supplied):
Stereo)
Exif Print: Compatible
PRINT Image Matching III: Compatible
PictBridge: Compatible
PRINT Image Matching III: Compatible
PictBridge: Compatible
Cyber-shot Station UC-GA
[Input and Output connectors]
A/V OUT (STEREO) jack (Stereo): Minijack
Video out, audio out (stereo)
USB jack: mini-B
USB connection: Hi-Speed USB (USB 2.0 Hi-
USB connection: Hi-Speed USB (USB 2.0 Hi-
Speed compatible)
DC IN jack
Camera connector
Camera connector
Rechargeable battery pack NP-FR1
Used battery: Lithium-ion battery
Maximum voltage: DC 4.2 V
Nominal voltage: DC 3.6 V
Capacity: 4.4 Wh (1 220 mAh)
Maximum voltage: DC 4.2 V
Nominal voltage: DC 3.6 V
Capacity: 4.4 Wh (1 220 mAh)
Design and specifications are subject to change
without notice.
without notice.
— 3 —
DSC-G1_L2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
1.
Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
connections. Check the entire board surface for solder splashes
and bridges.
2.
Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
"pinched" or contact high-wattage resistors.
3.
Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair. Point
them out to the customer and recommend their replacement.
transistors, that were installed during a previous repair. Point
them out to the customer and recommend their replacement.
4.
Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
of deterioration. Point them out to the customer and
recommend their replacement.
5.
Check the B+ voltage to see it is at the values specified.
6.
FLEXIBLE Circuit Board Repairing
• Keep the temperature of the soldering iron around
350
˚C
during repairing.
• Do not touch the soldering iron on the same conductor of
the circuit board (within 3 times).
• Be careful not to apply force on the conductor when
soldering or unsoldering.
Unleaded solder
This unit uses unleaded solder.
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Be careful to the following points to solder or unsolder.
•
Set the soldering iron tip temperature to 350˚C approximately.
If cannot control temperature, solder/unsolder at high
temperature for a short time.
Caution: The printed pattern (copper foil) may peel away if
If cannot control temperature, solder/unsolder at high
temperature for a short time.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Unleaded solder is more viscous (sticky, less prone
to flow) than ordinary solder so use caution not to
let solder bridges occur such as on IC pins, etc.
Unleaded solder is more viscous (sticky, less prone
to flow) than ordinary solder so use caution not to
let solder bridges occur such as on IC pins, etc.
•
Be sure to control soldering iron tips used for unleaded solder
and those for leaded solder so they are managed separately.
Mixing unleaded solder and leaded solder will cause detachment
phenomenon.
and those for leaded solder so they are managed separately.
Mixing unleaded solder and leaded solder will cause detachment
phenomenon.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Ver. 1.2 2011.03
The changed portions from
Ver. 1.1 are shown in blue.
Ver. 1.1 are shown in blue.
— 4 —
DSC-G1_L2
TABLE OF CONTENTS
1.
SERVICE NOTE
1-1.
Self-diagnosis Function ··················································· 1-1
1-2.
Method for Copying or Erasing the Data in Internal
Memory (Internal Memory/Music) ································· 1-3
Memory (Internal Memory/Music) ································· 1-3
1-3.
Erasing The Latest Recording History ···························· 1-4
1-4.
Precautions after SY-153 Board and
Wireless LAN Module (CP801) were replaced ··············· 1-4
Wireless LAN Module (CP801) were replaced ··············· 1-4
2.
DISASSEMBLY
2-1.
Disassembly ····································································· 2-2
3.
BLOCK DIAGRAMS
3-1.
Overall Block Diagram (1/2) ··········································· 3-1
3-2.
Overall Block Diagram (2/3) ··········································· 3-2
3-3.
Overall Block Diagram (3/3) ··········································· 3-3
3-4.
Power Block Diagram (1/2) ············································· 3-4
3-5.
Power Block Diagram (2/2) ············································ 3-5
4.
PRINTED WIRING BOARDS AND
SCHEMATIC DIAGRAMS
SCHEMATIC DIAGRAMS
4-1.
Frame Schematic Diagram ·············································· 4-1
4-2.
Schematic Diagrams ························································ 4-3
4-3.
Printed Wiring Boards ··················································· 4-23
5.
REPAIR PARTS LIST
5-1.
Exploded Views ······························································· 5-2
5-2.
Electrical Parts List ························································· 5-6
Section
Title
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