XR-CA430X, XR-CA440, XRS-CA500 - Sony Car Audio Service Manual (repair manual). Page 2

2

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3

2-1. Disassembly Flow ...........................................................

7

2-2. Mechanism Deck (MG-25L-136) ...................................

7

2-3. MAIN Board ...................................................................

8

2-4. Heat Sink (ISO) ...............................................................

8

3-1. Assembly Flow ................................................................

9

3-2. Housing ........................................................................... 10
3-3. Arm (Suction) ................................................................. 10
3-4. Lever (LDG-A)/(LDG-B) ............................................... 11
3-5. Gear (LDG-FT) ............................................................... 11
3-6. Guide (C) ......................................................................... 12
3-7. Mounting Position of Capstan/Reel Motor (M901) ....... 12

....................... 13

Tape Deck Section .......................................................... 13
Tuner Section .................................................................. 13

6-1. Note for Printed Wiring Boards and

Schematic Diagrams ....................................................... 14

6-2. Printed Wiring Board – MAIN Board – ......................... 18
6-3. Schematic Diagram – MAIN Board (1/3) – ................... 19
6-4. Schematic Diagram – MAIN Board (2/3) – ................... 20
6-5. Schematic Diagram – MAIN Board (3/3) – ................... 21
6-6. Printed Wiring Board – KEY Board – ............................ 22
6-7. Schematic Diagram – KEY Board – .............................. 23
6-8. IC Pin Function Description ........................................... 24

7-1. Chassis Section ............................................................... 26
7-2. Front Panel Section ......................................................... 27
7-3. MAIN Board Section ...................................................... 28
7-4. Mechanism Deck Section (MG-25L-136) ...................... 29

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• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.