XR-CA370, XR-CA370X - Sony Car Audio Service Manual (repair manual). Page 2

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2
XR-CA370/CA370X
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE  OF  CONTENTS
1.
GENERAL
Location of Controls .......................................................
3
Setting the Clock .............................................................
3
2.
DISASSEMBLY
2-1. Disassembly Flow ...........................................................
6
2-2. Sub Panel .........................................................................
6
2-3. Mechanism Deck (MG-36SZ13-32) ...............................
7
2-4. MAIN Board ...................................................................
7
2-5. Heat Sink .........................................................................
8
2-6. Bracket (MD) ..................................................................
8
2-7. DC Motor (Capstan/Reel) (M901) .................................
9
2-8. Main Belt, Sub Belt (C) ..................................................
9
2-9. Magnetic Head (Playback) (HP901) .............................. 10
3.
MECHANICAL  ADJUSTMENTS
....................... 11
4.
ELECTRICAL  ADJUSTMENTS
......................... 11
Tape Deck Section .......................................................... 11
Tuner Section .................................................................. 12
5.
DIAGRAMS
5-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 13
5-2. Printed Wiring Board  – MAIN Board – ........................ 15
5-3. Schematic Diagram  – MAIN Board (1/2) – .................. 16
5-4. Schematic Diagram  – MAIN Board (2/2) – .................. 17
5-5. Printed Wiring Board  – CONTROL Board – ................ 18
5-6. Schematic Diagram  – CONTROL Board – ................... 19
5-7. IC Pin Function Description ........................................... 20
6.
EXPLODED  VIEWS
6-1. General Section ............................................................... 22
6-2. Front Panel Section ......................................................... 23
6-3. Main Board Section ........................................................ 24
6-4. Mechanism Deck Section (MG-36SZ13-32) ................. 25
7.
ELECTRICAL  PARTS  LIST
............................... 26
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