XR-C750 - Sony Car Audio Service Manual (repair manual). Page 2

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SW1, 2 (E model)
Tuning range

SW1 : 2,940 - 7,735 kHz
SW2 : 9,500 - 18,135 kHz
(except for 10,140 - 11,575
kHz)

Antenna terminal

External antenna connector

Intermediate frequency 10.71 MHz/450 kHz
Sensitivity

50 µV

Outputs

Speaker outputs
(sure seal connectors)

Speaker impedance

4 - 8 ohms

Maximum power output 40 W 

×

 4 (at 4 ohms)

US model :
35 W 

× 

4 (at AM band, 4

ohms)
E model :
35 W 

× 

4 (at MW and SW

band, 4 ohms)

Outputs

Line outputs (3)
Power antenna relay
control lead
Power amplifier control
lead

Tone controls

Bass ± 8 dB at 100 Hz
Treble ± 8 dB at 10 kHz

Power requirements

12 V DC car battery
(negative earth)

Dimensions

Approx. 184 

×

 50 

×

 176 mm

(7 

1/4

 

×

 2 

×

 6 

7/8

 in.)

(w/h/d)

Mounting dimensions

Approx. 182 

×

 53 

×

 163 mm

(7 

1/4

 

×

 2 

1/8

 

×

 6 

1/2

 in.)

(w/h/d)

Mass

Approx. 1.3 kg (2 lb. 14 oz.)

Supplied accessories

Parts for installation and
connections (1 set)
Front panel case (1)
Rotary remote RM-X2S (1)
Wireless remote

RM-X45 (1) (E model)

Location of Controls .................................................................. 3
Setting the Clock ....................................................................... 3
Cassette Player .......................................................................... 3
Radio ......................................................................................... 4
Other Functions ......................................................................... 5
CD/MD Changer ....................................................................... 7
Additional Information .............................................................. 9
Connections ............................................................................. 11

2-1.   Cover Assy .......................................................................... 13
2-2.   Front Panel Assy ................................................................. 13
2-3.   Sub Panel Assy .................................................................... 14
2-4.   Mechanism Deck Block ...................................................... 14
2-5.   Heat Sink ............................................................................. 15
2-6.   Main Board ......................................................................... 15

Alignment of Rotary Switch .................................................... 16
Gear (LDG-E) .......................................................................... 16
Chassis (S) Assy ...................................................................... 17
Lever (Mode) ........................................................................... 17
Lever (Pinch Selection) ........................................................... 18
Head Plate Assy ....................................................................... 18
Lever (Pinch) Assy .................................................................. 19
Housing ................................................................................... 19
Arm (Suction) .......................................................................... 20
Lever (LDG-A)/(LDG-B) ........................................................ 20
Gear (LDG-FT) ....................................................................... 21
Guide (C) ................................................................................. 21

................................. 22

Deck Section ............................................................................ 22
Tuner Section ........................................................................... 23

6-1.   IC Pin Descriptions ............................................................. 26
6-2.   Block Diagram –TC Section– ............................................. 29
6-3.   Block Diagram –Main Section– .......................................... 31
6-4.   Printed Wiring Boards –Main Section– .............................. 33
6-5.   Schematic Diagram –Main Section– ................................... 37
6-6.   Printed Wiring Boards –Panel Section– .............................. 42
6-7.   Schematic Diagram –Panel Section– .................................. 44

7-1.   Chassis Section ................................................................... 51
7-2.   Front Panel Section ............................................................. 52
7-3.   Mechanism Deck Section-1 ................................................ 53
7-4.   Mechanism Deck Section-2 ................................................ 54

8. ELECTRICAL PARTS LIST ......................................

55

•

Never reuse a disconnected chip component.

•

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

Dolby noise reduction manufactured under license from Dolby Labora-
tories Licensing Corporation.
“DOLBY” and the double-D symbol 

a

 are trademarks of Dolby Labora-

tories Licensing Corporation.