XR-C7220R - Sony Car Audio Service Manual (repair manual)

MICROFILM

AEP Model

UK Model

Model Name Using Similar Mechanism

XR-C8100R

Tape Transport Mechanism Type

MG-25D-136

For RM-X4S (Remote Commander),
please refer to RM-X4S Service Manual
(9-925-698-

∏

) previously issued.

Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol 

a

 are trade-

marks of Dolby Laboratories Licensing Corporation.

– 2 –

Location of controls ........................................................

3

Resetting the unit ............................................................

4

Detaching the front panel ................................................

4

Setting the clock ..............................................................

4

Labelling the rotary commander .....................................

4

Using the rotary commander ..........................................

4

Adjusting the sound characteristics ................................

5

Attenuating the sound .....................................................

5

Changing the sound and display settings .......................

5

Installation .......................................................................

6

Connections .....................................................................

7

......................................................... 12

........... 14

....................... 17

Test Mode ........................................................................ 18
Tape Deck Section .......................................................... 18
Tuner Section .................................................................. 19

6-1. Block Diagram – TUNER/TAPE Section – ................... 23
6-2. Block Diagram – MAIN Section – ................................. 25
6-3. Block Diagram

– DISPLAY/KEY CONTROL Section – ........................ 27

6-4. Block Diagram

– BUS CONTROL/POWER SUPPLY Section – ........... 29

6-5. Note for Printed Wiring Boards and

Schematic Diagrams ....................................................... 31

6-6. Printed Wiring Board

– Main Board (Component Side) – ................................ 33

6-7. Printed Wiring Board

– Main Board (Conductor Side) – .................................. 35

6-8. Schematic Diagram – Main Board (1/4) – ..................... 37
6-9. Schematic Diagram – Main Board (2/4) – ..................... 39
6-10. Schematic Diagram – Main Board (3/4) – ..................... 41
6-11. Schematic Diagram – Main Board (4/4) – ..................... 43
6-12. Printed Wiring Board  – KEY Board – ........................... 45
6-13. Schematic Diagram – KEY Board – .............................. 47
6-14. Printed Wiring Board

– SUB/INVERTER Board – ........................................... 49

6-15. Schematic Diagram – SUB/INVERTER Board – .......... 50
6-16. IC Pin Function Description ........................................... 54

................................................ 58

............................... 61

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

– 3 –

This section is extracted from
instruction manual.

– 4 –