XR-C653SP - Sony Car Audio Service Manual (repair manual)

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MICROFILM

East European Model

Tape track

4-track 2-channel stereo

Wow and flutter

0.08 % (WRMS)

Frequency response

30 - 20,000 Hz

Signal-to-noise ratio

TYPE II, III, IV

67 dB

61 dB

TYPE I

64 dB

58 dB

Tuning range

65.0 - 74.0 MHz
(at 30 kHz step)
87.5 - 108.0 MHz
(at 50 kHz step)

Aerial terminal

External aerial connector

Intermediate frequency 10.7 MHz
Usable sensitivity

8 dBf

Selectivity

75 dB at 400 kHz

Signal-to-noise ratio

65 dB (stereo),
68 dB (mono)

Harmonic distortion at 1 kHz

0.5% (stereo),
0.3% (mono)

Separation

35 dB at 1 kHz

Frequency response

30 - 15,000 Hz

Capture ratio

2 dB

Tuning range

MW: 531 - 1,602 kHz
LW: 153 - 281 kHz

Aerial terminal

External aerial connector

Intermediate frequency 10.71 MHz/450 kHz
Sensitivity

MW: 30 µV
LW: 50 µV

Model Name Using Similar Mechanism

XR-C503

Tape Transport Mechanism Type

MG-52B-135

Outputs

Speaker outputs
(sure seal connectors)

Speaker impedance

4 - 8 ohms

Maximum power output

40 W 

× 

4 (at 4 ohms)

Outputs

Line outputs (2)
Power aerial relay control
lead
Power amplifier control
lead

Tone controls

Bass ± 8 dB at 100 Hz
Treble ± 8 dB at 10 kHz

Power requirements

12 V DC car battery
(negative ground)

Dimensions

Approx. 184 

× 

50 

× 

176 mm

(w/h/d)

Mounting dimension

Approx. 182 

× 

53 

× 

163 mm

(w/h/d)

Mass

Approx. 1.3 kg

Supplied accessories

Parts for installation and
connections (1 set)
Front panel case (1)
Rotary remote RM-X2S (1)

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Location of Controls .................................................................. 3
Getting started ........................................................................... 3
Setting the Clock ....................................................................... 4
Cassette Player .......................................................................... 4
Radio ......................................................................................... 5
CD/MD Changer ....................................................................... 6
Additional Information .............................................................. 8
Connections ............................................................................... 9

2-1.   Cover Assy .......................................................................... 11
2-2.   Front Panel Assy ................................................................. 11
2-3.   Sub Panel Assy .................................................................... 12
2-4.   Mechanism Deck Block ...................................................... 12
2-5.   Heat Sink ............................................................................. 13
2-6.   Main Board ......................................................................... 13

Alignment of Rotary Switch .................................................... 14
Gear (LDG-E) .......................................................................... 14
Chassis (S) Assy ...................................................................... 15
Lever (Mode) ........................................................................... 15
Lever (Pinch Selection) ........................................................... 16
Head Plate Assy ....................................................................... 16
Lever (Pinch) Assy .................................................................. 17
Housing ................................................................................... 17
Arm (Suction) .......................................................................... 18
Lever (LDG-A)/(LDG-B) ........................................................ 18
Gear (LDG-FT) ....................................................................... 19
Guide (C) ................................................................................. 19

................................. 20

Deck Section ............................................................................ 20
Tuner Section ........................................................................... 21

6-1.   IC Pin Description ............................................................... 25
6-2.   Block Diagram –Main Section– .......................................... 27
6-3.   Block Diagram –TC Section– ............................................. 29
6-4.   Printed Wiring Boards –Main Section– .............................. 31
6-5.   Schematic Diagram –Main Section– ................................... 35
6-6.   Printed Wiring Boards –Panel Section– .............................. 40
6-7.   Schematic Diagram –Panel Section– .................................. 42

7-1.   Chassis Section ................................................................... 48
7-2.   Front Panel Section ............................................................. 49
7-3.   Mechanism Deck Section-1 ................................................ 50
7-4.   Mechanism Deck Section-2 ................................................ 51

........................................... 52

•

Never reuse a disconnected chip component.

•

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

Dolby noise reduction manufactured under license from Dolby Labo-
ratories Licensing Corporation.
“DOLBY” and the double-D symbol 

a

 are trademarks of Dolby

Laboratories Licensing Corporation.

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This section extracted from

 instruction manual.

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