Read Sony XR-C6204J Service Manual online
MICROFILM
SERVICE MANUAL
FM/MW/SW CASSETTE CAR STEREO
Saudi Arabia Model
Model Name Using Similar Mechanism
XR-C6100
Tape Transport Mechanism Type
MG-25F-136
SPECIFICATIONS
XR-C6204J
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol
a
are trade-
marks of Dolby Laboratories Licensing Corporation.
– 2 –
TABLE OF CONTENTS
1.
GENERAL
Location of Controls .......................................................
3
Card Remote Commander ..............................................
4
Resetting the Unit ...........................................................
5
Detaching the Front Panel ...............................................
5
Setting the Clock .............................................................
5
Installation .......................................................................
6
Connections .....................................................................
7
2.
DISASSEMBLY
......................................................... 10
3.
ASSEMBLY OF MECHANISM DECK
........... 11
4.
MECHANICAL ADJUSTMENTS
....................... 14
5.
ELECTRICAL ADJUSTMENTS
Test Mode ........................................................................ 14
Tape Deck Section .......................................................... 14
Tuner Section .................................................................. 15
Tape Deck Section .......................................................... 14
Tuner Section .................................................................. 15
6.
DIAGRAMS
6-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 18
6-2. Printed Wiring Board – MAIN Board – ......................... 19
6-3. Schematic Diagram – MAIN Board (1/2) – ................... 21
6-4. Schematic Diagram – MAIN Board (2/2) – ................... 23
6-5. Printed Wiring Board – KEY Board – ........................... 25
6-6. Schematic Diagram – KEY Board – .............................. 27
6-7. IC Pin Function Description ........................................... 32
6-3. Schematic Diagram – MAIN Board (1/2) – ................... 21
6-4. Schematic Diagram – MAIN Board (2/2) – ................... 23
6-5. Printed Wiring Board – KEY Board – ........................... 25
6-6. Schematic Diagram – KEY Board – .............................. 27
6-7. IC Pin Function Description ........................................... 32
7.
EXPLODED VIEWS
................................................ 35
8.
ELECTRICAL PARTS LIST
............................... 38
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
– 3 –
SECTION 1
GENERAL
This section is extracted from
instruction manual.
instruction manual.
– 4 –