Read Sony XR-C6103SP Service Manual online
MICROFILM
SERVICE MANUAL
FM/MW/LW CASSETTE CAR STEREO
East European Model
Model Name Using Similar Mechanism
NEW
Tape Transport Mechanism Type
MG-25F-136
SPECIFICATIONS
XR-C6103SP
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol
a
are trademarks
of Dolby Laboratories Licensing Corporation.
– Continued on next page –
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TABLE OF CONTENTS
1.
GENERAL
................................................................... 3
2.
DISASSEMBLY
......................................................... 9
3.
ASSEMBLY OF MECHANISM DECK
........... 11
4.
MECHANICAL ADJUSTMENTS
....................... 14
5.
ELECTRICAL ADJUSTMENTS
Test Mode ........................................................................ 14
Tape Deck Section .......................................................... 14
Tuner Section .................................................................. 15
Tape Deck Section .......................................................... 14
Tuner Section .................................................................. 15
6.
DIAGRAMS
6-1. IC Pin Function Description ........................................... 19
6-2. Printed Wiring Board – MAIN Section – ...................... 23
6-3. Schematic Diagram – MAIN Section – .......................... 27
6-4. Printed Wiring Board – PANEL Section – .................... 31
6-5. Schematic Diagram – PANEL Section – ....................... 33
6-2. Printed Wiring Board – MAIN Section – ...................... 23
6-3. Schematic Diagram – MAIN Section – .......................... 27
6-4. Printed Wiring Board – PANEL Section – .................... 31
6-5. Schematic Diagram – PANEL Section – ....................... 33
7.
EXPLODED VIEWS
................................................ 38
8.
ELECTRICAL PARTS LIST
............................... 41
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
– 3 –
SECTION 1
GENERAL
This section is extracted from
instruction manual.
instruction manual.
– 4 –