Read Sony XR-C553SP Service Manual online
Model Name Using Similar Mechanism
NEW
Tape Transport Mechanism Type
MG-52A-135
East European Model
SERVICE MANUAL
XR-C553SP
SPECIFICATIONS
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol
a
are trademarks
of Dolby Laboratories Licensing Corporation.
For RM-X2S (Remote Commander),
please reter to RM-X2S/X3S Service
Manual (9-960-039-
please reter to RM-X2S/X3S Service
Manual (9-960-039-
∏
) previously issued.
FM/MW/LW CASSETTE CAR STEREO
Ver 1.1 2001.08
9-925-531-12
Sony Corporation
2001H0500-1
e Vehicle Company
C
2001.8
Shinagawa Tec Service Manual Production Group
– 2 –
TABLE OF CONTENTS
1.
GENERAL
Location of Controls ..........................................................
3
Setting the Clock ...............................................................
3
Using the Rotary Remote ..................................................
3
Adjusting the Sound Characteristics .................................
4
Muting the Sound ..............................................................
4
Changing the Sound and Beep Tone ..................................
4
Installation .........................................................................
5
Connections .......................................................................
6
2.
DISASSEMBLY
............................................................
9
3.
ASSEMBLY OF MECHANISM DECK
............... 11
4.
MECHANICAL ADJUSTMENTS
......................... 17
5.
ELECTRICAL ADJUSTMENTS
Test Mode .......................................................................... 17
Tape Deck Section ............................................................. 17
Tuner Section ..................................................................... 18
Tape Deck Section ............................................................. 17
Tuner Section ..................................................................... 18
6.
DIAGRAMS
6-1. IC Pin Function Description .............................................. 22
6-2. Block Diagram (1/2) .......................................................... 25
6-3. Block Diagram (2/2) .......................................................... 27
6-4. Printed Wiring Boards –Main Section– ............................ 29
6-5. Schematic Diagram –Main Section– ................................ 33
6-6. Printed Wiring Board –Display Section– ......................... 37
6-7. Schematic Diagram –Display Section– ............................ 39
6-2. Block Diagram (1/2) .......................................................... 25
6-3. Block Diagram (2/2) .......................................................... 27
6-4. Printed Wiring Boards –Main Section– ............................ 29
6-5. Schematic Diagram –Main Section– ................................ 33
6-6. Printed Wiring Board –Display Section– ......................... 37
6-7. Schematic Diagram –Display Section– ............................ 39
7.
EXPLODED VIEWS
.................................................. 44
8.
ELECTRICAL PARTS LIST
.................................. 48
SERVICING NOTES
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚ C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering or
unsoldering .
unsoldering .
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
–
3
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SECTION 1
GENERAL
This section is e
xtr
acted
acted
from instr
uction man
ual.
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4
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