XMM-R5WL, XVM-F65WL - Sony Car Audio Service Manual (repair manual). Page 2

2

Installation kit (1)
Monitor stand (1) (AEP, UK, E, Chinese model)
   (with supplied screws (5))
Connection box XA-126 (1) (AEP, UK model)
Connection box XA-125 (1)
   (US, Canadian, E, Chinese model)
Cordless headphones MV-02HP (1)
   (US, Canadian model)
Rechargeable battery MV-100BAT (1)
   (AEP, UK, E, Chinese model)
Battery rechargeable cable (1)
   (AEP, UK, E, Chinese model)
Card remote commander RM-X709
   (with supplied battery) (1)
Power supply cord (1)
Detach cradle (3 m) (1)
Cigar plug (0.3 m) (1)
Operating Instructions (1 set)

Design and specifications are subject to change
without notice.

................................................

3

Location of Controls ........................................................

4

Connections .....................................................................

6

3-1.

Cabinet (Rear) Assy .........................................................

9

3-2.

Monitor Board .................................................................

9

3-3.

LCD1 ............................................................................... 10

............................................................... 11

5-1.

Equipment Used .............................................................. 12

5-2.

Connection of Equipment ................................................ 12

5-3.

Setup for Adjustment ....................................................... 12

5-4.

DC-DC Converter Adjustment ........................................ 12

     5-4-1.   Frequency Adjustment ............................................. 12
     5-4-2.   5V Voltage Adjustment ............................................ 12
     5-4-3.   Other Voltage Checks ............................................... 12
5-5.

PLL Adjustment .............................................................. 12

5-6.

Inverter High Voltage Check ........................................... 13

     5-6-1.   Voltage Check .......................................................... 13
     5-6-2.   Frequency Check ..................................................... 13
5-7.

OSD Dot Clock Check .................................................... 13

5-8.

NTSC Subcarrier Check .................................................. 13

5-9.

PAL Subcarrier Check ..................................................... 13

5-10. F0 Frequency Adjustment ............................................... 13
     5-10-1.   3.2/3.8 MHz (CH2) Adjustment ............................ 13
     5-10-2.   2.3/2.8 MHz (CH1) Check ..................................... 13
5-11. V COM Voltage/Position Adjustment ............................. 13
5-12. Video Adjustment ............................................................ 14
     5-12-1.   Brightness Signal Contrast Level (Y GAIN) ......... 14
     5-12-2.   Black Limiter Level Adjustment ............................ 14
     5-12-3.   White Limiter Level Adjustment ........................... 14
     5-12-4.   R Sub Brightness Adjustment ................................ 14
     5-12-5.   B Sub Brightness Adjustment ................................ 14
     5-12-6.   R Sub Contrast Adjustment ................................... 14
     5-12-7.   B Sub Contrast Adjustment ................................... 15
     5-12-8.   

γ 1 Adjustment ....................................................... 15

     5-12-9.   

γ 2 Adjustment ....................................................... 15

     5-12-10. VCO Free Run Adjustment .................................... 15
     5-12-11. V POS Adjustment ................................................. 15
     5-12-12. H POS Adjustment ................................................. 15

6-1.

Block Diagram –Connection Box Section– .................... 17

6-2.

Block Diagram –Video Section– ..................................... 18

6-3.

Block Diagram –Display Section– .................................. 19

6-4.

Printed Wiring Board –Connection Box Section– .......... 22

6-5.

Schematic Diagram –Connection Box Section (1/2)– .... 24

6-6.

Schematic Diagram –Connection Box Section (2/2)– .... 25

6-7.

Printed Wiring Boards –Monitor Section– ...................... 26

6-8.

Schematic Diagram –Monitor Section (1/4)– ................. 28

6-9.

Schematic Diagram –Monitor Section (2/4)– ................. 29

6-10. Schematic Diagram –Monitor Section (3/4)– ................. 30
6-11. Schematic Diagram –Monitor Section (4/4)– ................. 31

7-1.

Cabinet (Rear) Section .................................................... 38

7-2.

Cabinet (Front) Section ................................................... 39

7-3.

Connection Box Unit ....................................................... 40

7-4.

Cradle Section ................................................................. 41

.................................. 42

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°C.

Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.

Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged

by heat.