XM-GTX6020, XM-GTX6022 - Sony Car Audio Service Manual (repair manual). Page 2

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XM-GTX6020/GTX6022
2
1. GENERAL
  
Connections ....................................................................   3
2. DISASSEMBLY
2-1.   Bottom Plate ...................................................................   6
2-2.   MAIN Board Section ......................................................   7
2-3.   MAIN Board ...................................................................   7
3. DIAGRAMS
3-1. Block 
Diagram 
................................................................   9
3-2. Printed 
Wiring 
Board 
......................................................  11
3-3. Schematic 
Diagram 
.........................................................  12
4. 
EXPLODED  VIEWS
4-1.  Main Heat Sink Section ..................................................   13
4-2.  MAIN Board Section ......................................................   14
5. 
ELECTRICAL  PARTS  LIST
  ..............................   15
TABLE  OF  CONTENTS
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
PROTECTOR  OPERATION  CHECK
Thermal Protect
1.  Short across TH901 with the power on.
2.  Verify that the protector is operated and D918 illuminates 
green. When input the signal and verify that there is no output 
on the SP-OUT even when the volume is increased.
3.  Verify that the protector is released and there is an output on 
the SP-OUT when the short is removed.
4.  Likewise, perform items 1 to 3 for TH902 and TH903.
Over Current Protect
1.  Short between the positive and negative sides of the speaker 
output terminals CN903 (1/2) with the power on.
2.  Verify that the protector is operated and D918 illuminates red.
3.  Verify that the protector is not released and D918 remains red 
even when the short is removed.
4.  Verify that the protector is released and D918 illuminates 
green when the power is turned off and then on again.
Offset Protect
1.  Short between the +12V terminal of CN903 (2/2) and the 
(BTL) + or (BTL) – of the speaker output terminal CN903 
(1/2).
 
(Short between +12V terminal and (BTL) + and between +12V 
terminal and (BTL) –.)
2.  Verify that the protector is operated and D918 illuminates red.
3.  Verify that the protector is not released and D918 remains red 
even when the short is removed.
4.  Verify that the protector is released and D918 illuminates 
green when the power is turned off and then on again.
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
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