Read Sony XM-GTX1302 Service Manual online
XM-GTX1302
2
PROTECTOR OPERATION CHECK
Thermal Protect
1. Short across TH501 (short between TP3 and TP4) with the
power
power
on.
2. Verify that the protector is operated and LED901 illuminates green.
When input the signal and verify that there is no output on the
SP-OUT even when the volume is increased.
3. Verify that the protector is released and there is an output on the
SP-OUT when the short is removed.
4. Likewise, perform items 1 to 3 for TH502 (short between TP3 and
TP5) and TH503 (short between TP3 and TP6).
Over Current Protect
1. Short between the positive and negative sides of the speaker output
terminal CN903 (1/3, 2/3) with the power on.
2. Verify that the protector is operated and LED901 illuminates red.
3. Verify that the protector is not released and LED901 remains red
3. Verify that the protector is not released and LED901 remains red
even when the short is removed.
4. Verify that the protector is released and LED901 illuminates green
when the power is turned off and then on again.
Offset Protect
1. Short between the +12V terminal of CN903 (3/3) and the BTL +
or
or
BTL
of the speaker output terminal CN903 (1/3, 2/3).
(Short between +12V terminal and BTL + and between +12V
terminal and BTL
.)
2. Verify that the protector is operated and LED901 illuminates red.
3. Verify that the protector is not released and LED901 remains red
3. Verify that the protector is not released and LED901 remains red
even when the short is removed.
4. Verify that the protector is released and LED901 illuminates green
when the power is turned off and then on again.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-free
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the
lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
•
Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be applied
to the solder joint for a slightly longer time.
to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow) than
ordinary solder so use caution not to let solder bridges occur such as
on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such as
on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also be
added to ordinary solder.
added to ordinary solder.
NOTES ON CHIP COMPONENT REPLACEMENT
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be damaged
by heat.
by heat.
1. GENERAL
Connections
....................................................................
3
2. DISASSEMBLY
2-1. Bottom Plate ................................................................... 7
2-2. MAIN Board Section ...................................................... 8
2-3. MAIN Board ................................................................... 8
2-2. MAIN Board Section ...................................................... 8
2-3. MAIN Board ................................................................... 8
3. DIAGRAMS
3-1. Block
Diagram
................................................................ 11
3-2. Printed
Wiring
Board
...................................................... 12
3-3. Schematic Diagram (1/2) ................................................ 13
3-4. Schematic Diagram (2/2) ................................................ 14
3-4. Schematic Diagram (2/2) ................................................ 14
4. EXPLODED
VIEWS
4-1. Heat Sink (Main) Section ............................................... 15
4-2. Main Board Section ........................................................ 16
4-2. Main Board Section ........................................................ 16
5.
ELECTRICAL PARTS LIST
.................................. 17
TABLE OF CONTENTS
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
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