Read Sony XM-2150GSX Service Manual online
1
SERVICE MANUAL
US Model
Canadian Model
XM-2150GSX
STEREO POWER AMPLIFIER
Other Specifications
Circuit system
OTL (output transformerless) circuit
Pulse power supply
Pulse power supply
Inputs
RCA pin jacks
High level input connector
High level input connector
Outputs
Speaker terminals
Through out pin jacks
Through out pin jacks
Speaker impedance
2 – 8
Ω (stereo)
4 – 8
Ω (when used as a bridging amplifier)
Maximum outputs
300 W
× 2 (at 4 Ω)
760 W (monaural) at 4
Ω
Rated outputs (supply voltage at 14.4 V)
150 W
× 2 (20 Hz – 20 kHz, 0.04% THD,
at 4
Ω)
190 W
× 2 (20 Hz – 20 kHz, 0.1% THD,
at 2
Ω)
380 W (monaural) (20 Hz – 20 kHz, 0.1% THD,
at 4
at 4
Ω)
Frequency response
5 Hz – 100 kHz ( dB)
Harmonic distortion
0.005% or less (at 1 kHz, 4
Ω)
Input level adjustment range
0.2 – 6.0 V (RCA pin jacks)
0.4 – 12.0 V (High level input)
0.4 – 12.0 V (High level input)
High-pass filter
50 – 300 Hz, –12 dB/oct
Low-pass filter
50 – 300 Hz, –12 dB/oct
Low boost
0 – 10 dB (40 Hz)
Power supply voltage
10.5 – 16 V
Current drain
at rated output : 40 A (at 4
Ω)
Remote input : 2 mA
Dimensions
Approx. 14
1/8
× 2
1/4
× 10
1/2
in.
(358
× 50 × 264 mm)
(w/h/d) not incl. projecting parts and controls
Mass
Approx. 3.5 kg (7 lb. 11 oz.) not incl. accessories
Supplied accessories
Mounting screws (4)
Design and specifications are subject to change without
notice.
notice.
SPECIFICATIONS
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION
150 watts per channel minimum continuous average power into
4 ohms, both channels driven from 20 Hz to 20 kHz with no more
than 0.04% total harmonic distortion per Car Audio Ad Hoc
Committee standards.
150 watts per channel minimum continuous average power into
4 ohms, both channels driven from 20 Hz to 20 kHz with no more
than 0.04% total harmonic distortion per Car Audio Ad Hoc
Committee standards.
+0.5
–3
Ver 1.2 2002. 07
9-873-436-03
2002G0400-1
© 2002. 07
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
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TABLE OF CONTENTS
1. GENERAL
Location and Function of Controls .......................................... 3
Connections ............................................................................. 3
Connections ............................................................................. 3
2. DISASSEMBLY
2-1. Bottom Plate ........................................................................ 6
2-2. Main Board ......................................................................... 6
2-3. Front Panel .......................................................................... 7
2-4. Led Board ............................................................................ 7
2-2. Main Board ......................................................................... 6
2-3. Front Panel .......................................................................... 7
2-4. Led Board ............................................................................ 7
3. ELECTRICAL ADJUSTMENT
...................................... 8
4. DIAGRAMS
4-1. Block Diagram .................................................................... 9
4-2. Schematic Diagram –Main Section (1/2)– ........................ 10
4-3. Schematic Diagram –Main Section (2/2)– ........................ 11
4-4. Printed Wiring Boards –Main Section– ............................ 12
4-2. Schematic Diagram –Main Section (1/2)– ........................ 10
4-3. Schematic Diagram –Main Section (2/2)– ........................ 11
4-4. Printed Wiring Boards –Main Section– ............................ 12
5. EXPLODED VIEWS
5-1. Heat Sink Section .............................................................. 14
5-2. Main Board Section .......................................................... 15
5-2. Main Board Section .......................................................... 15
6. ELECTRICAL PARTS LIST
........................................ 16
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
XM-2150GSX
Note for Replacement of FET
Change the both channels of FETs at the output stage.
If one or both parts in the following combination is broken, the
service kit should be ordered.
If one or both parts in the following combination is broken, the
service kit should be ordered.
Service kit part No.
Q108, 112
X-3381-586-1
Q208, 212
Q109, 113
X-3381-587-1
Q209, 213
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XM-2150GSX
SECTION 1
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
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XM-2150GSX