WX-VX55, WX-VX55S - Sony Car Audio Service Manual (repair manual)

wx-vx55, wx-vx55s service manual
Model
WX-VX55 WX-VX55S
Pages
66
Size
5.46 MB
Type
PDF
Document
Service Manual
Brand
Device
Car Audio
File
wx-vx55-wx-vx55s.pdf
Date

Read Sony WX-VX55 / WX-VX55S Service Manual online

SERVICE MANUAL
Published by Sony Techno Create Corporation
Sony Corporation
Audio&Video Business Group
9-887-938-02
2009H04-1
© 
2009.08
Ver. 1.1  2009.08
•  The tuner and CD sections have no adjustments.
– Continued on next page –
WX-VX55/VX55S
SPECIFICATIONS
Saudi Arabia Model
Indian Model
•  The tuner and CD sections have no adjustments.
CD Player section
Signal-to-noise ratio: 90 dB
Frequency response: 10 – 20,000 Hz
Wow and fl utter: Below measurable limit
Signal format system: PAL/NTSC
Cassette Player section
Tape track: 4-track 2-channel stereo
Wow and fl utter: 0.08 % (WRMS)
Frequency response: 30 – 18,000 Hz
Signal-to-noise ratio:
Cassette type
TYPE II, IV
55 dB
TYPE I
52 dB
Tuner section
FM
Tuning range:
 87.5 – 108.0 MHz
Antenna (aerial) terminal:
  External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Usable sensitivity: 9 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz: 0.5 % (stereo),
  0.3 % (mono)
Separation: 35 dB at 1 kHz
Frequency response: 30 – 15,000 Hz
MW
Tuning range:
 531 – 1,602 kHz
Antenna (aerial) terminal:
  External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: 30 
μV
SW
Tuning range:
  SW1: 2,940 – 7,735 kHz
  SW2: 9,500 – 18,135 kHz
  (except for 10,140 – 11,575 kHz)
Antenna (aerial) terminal:
  External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: 30 
μV
Power amplifi er section
Outputs: Speaker outputs (sure seal connectors)
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W × 4 (at 4 ohms)
FM/MW/SW 2DIN MULTI MEDIA PLAYER
CD 
Section
Model Name Using Similar Mechanism
CDX-V6800
CD Mechanism Type
MG-611MM-186//Q1
Optical Pick-up Name
KSS1000E
TAPE 
Section
Model Name Using Similar Mechanism
XR-F5100
Tape Transport Mechanism Type
MG-25L-136//Q1
WX-VX55/VX55S
2
NOTES ON HANDLING THE OPTICAL PICK-UP 
BLOCK   OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the 
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
SERVICE  NOTES
CAUTION
Use of controls or adjustments or performance of procedures other than 
those specifi ed herein may result in hazardous radiation exposure.
If the optical pick-up block is defective, please replace the whole 
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical 
pick-up block.
TEST  DISCS
Please use the following test discs for the check on the voltage and 
the waveforms of the CD section.
 
YDES-18 (Part No. 3-702-101-01)
 
PATD-012 (Part No. 4-225-203-01)
SAFETY-RELATED COMPONET WARNING!
COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 
0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
General
Output:
  Audio outputs terminal (front/rear)
  Subwoofer output terminal (mono)
  Video output terminal
  Power antenna (aerial) relay control terminal
 Power 
amplifi er control terminal
Inputs:
  Telephone ATT control terminal
  Parking break control terminal
  Antenna (aerial) input terminal
  AUX input jack (stereo mini jack)
Tone controls:
  Low: ±10 dB at 60 Hz (XPLOD)
  Mid: ±10 dB at 1 kHz (XPLOD)
  High: ±10 dB at 10 kHz (XPLOD)
Power requirements: 12 V DC car battery
  (negative ground (earth))
Dimensions: Approx. 178 × 100 × 185 mm
 (7
 1/8
 × 4 × 7
 3/8
 in) (w/h/d)
Mounting dimensions: Approx. 178 × 100 × 155 mm
 (7
 1/8
 × 4 × 6
 1/8
 in) (w/h/d)
Mass: Approx. 2.3 kg (5 lb 2 oz)
Supplied accessories:
  Card remote commander: RM-X158
  Parts for installation and connections (1 set)
Design and specifi cations are subject to change
without notice.
Notes on chip component replacement
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
•  Keep the temperature of soldering iron around 270 °C during 
repairing.
•  Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
•  Be careful not to apply force on the conductor when soldering 
or unsoldering.
optical pick-up
semi-fixed resistor
WX-VX55/VX55S
3
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 
heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
This label is located on the bottom of the chassis.
•  CD/Video CD playback
You can play CD-DA, CD-R/CD-RW (MP3 fi les) and Video CD.
Type of discs
Label on the disc
CD-DA
MP3
Video CD
VCD
Notes on CD-R/CD-RW discs
•  Some CD-Rs/CD-RWs (depending on the equipment used for 
its recording or the condition of the disc) may not play on this 
unit.
•  You cannot play a CD-R/a CD-RW that is not fi nalized.
Notes on Video CDs
A compact disc that contains moving pictures. The picture data 
uses the MPEG 1 format (Video CD), worldwide standards of digi-
tal compression technology.
Video CDs also contain compact audio data. Sounds outside the 
range of human hearing are compressed while the sounds we can 
hear are not compressed.
There are 2 versions of Video CDs.
• Version 
1.1:
 
You can play only moving pictures and sounds.
• Version 
2.0:
 
You can play hi-resolution still pictures and enjoy PBC (Play-
back Control) functions.
This unit conforms to both versions.
WX-VX55/VX55S
4
1. GENERAL
 
Location of Controls .......................................................   5
 Connections 
....................................................................  
6
2. DISASSEMBLY
2-1. Front 
Panel 
Assy 
.............................................................   9
2-2. Sub 
Panel 
Assy 
................................................................   9
2-3.  CD Mechanism Block .....................................................   10
2-4. Top 
Chassis 
.....................................................................  10
2-5.  Tape Mechanism Deck ....................................................   11
2-6.  Main Board Section ........................................................   11
2-7. Main 
Board 
.....................................................................  12
2-8. Chassis 
(T) 
Sub 
Assy 
......................................................  12
2-9.  Roller Arm Assy ..............................................................   13
2-10. Chassis (OP) Assy ...........................................................   13
2-11. Optical Pick-up ...............................................................  14
2-12.  SL Motor (M902) ............................................................   14
2-13.  LE Motor Assy (M903) ...................................................   15
2-14. Servo Board ....................................................................   15
3. ASSEMBLY
3-1. Housing 
...........................................................................  17
3-2. Arm 
(Suction) 
.................................................................  17
3-3. Lever 
(LDG-A)/(LDG-B) 
...............................................  18
3-4. Gear 
(LDG-FT) 
...............................................................  18
3-5. Guide 
(C) 
........................................................................  19
3-6.  Mounting Position of Capstan/Reel Motor (M904) ........   19
4. MECHANICAL 
 
ADJUSTMENTS 
 ......................   20
5. ELECTRICAL 
 
ADJUSTMENTS
 
Tape Deck Section ..........................................................   20
 Tuner 
Section 
..................................................................  
21
6. DIAGRAMS
6-1.  Block Diagram –CD Section– ........................................   23
6-2.  Block Diagram –Main Section– .....................................   24
6-3.  Block Diagram –Key Section– .......................................   25
6-4.  Printed Wiring Boards –CD Mechanism Section– .........   27
6-5.  Schematic Diagram –CD Mechanism Section (1/2)– .....   28
6-6.  Schematic Diagram –CD Mechanism Section (2/2)– .....   29
6-7.  Printed Wiring Board –Main Section– ............................   30
6-8.  Schematic Diagram –Main Section (1/3)– ......................   31
6-9.  Schematic Diagram –Main Section (2/3)– ......................   32
6-10.  Schematic Diagram –Main Section (3/3)– ......................   33
6-11.  Printed Wiring Board –Sub Section- ..............................   34
6-12.  Schematic Diagram –Sub Section- .................................   35
6-13.  Printed Wiring Board –Key Section (1/2)- .....................   36
6-14.  Printed Wiring Board –Key Section (2/2)- .....................   37
6-15.  Schematic Diagram –Key Section- .................................   38
7. 
EXPLODED  VIEWS
7-1. Sub 
Panel 
Section 
...........................................................  46
7-2.  Front Panel Section .........................................................   47
7-3. Chassis 
Section 
(1) 
..........................................................  48
7-4. Chassis 
Section 
(2) 
..........................................................  49
7-5.  Main Board Section ........................................................   50
7-6.  CD Mechanism Section (1) (MG-611MM-186//Q1) ......   51
7-7.  CD Mechanism Section (2) (MG-611MM-186//Q1) ......   52
7-8.  CD Mechanism Section (3) (MG-611MM-186//Q1) ......   53
7-9.  CD Mechanism Section (4) (MG-611MM-186//Q1) ......   54
7-10.  Tape Mechanism Section (MG-25L-136//Q1) ................   55
8. 
ELECTRICAL  PARTS  LIST
  ..............................   56
TABLE  OF  CONTENTS
Page of 66
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