Read Sony MEX-N4100BE / MEX-N4100BT / MEX-N4150BT Service Manual online
MEX-N4100BE/N4100BT/N4150BT
MEX-N4100BE/N4100BT/N4150BT
31
31
• Waveforms
– MAIN Board –
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• f : Internal component.
• C : Panel designation.
• C : Panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
• A : B+ Line.
• Power voltages is dc 14.4V and fed with regulated dc
• Power voltages is dc 14.4V and fed with regulated dc
power supply from ACC and BATT cords.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : TUNER (FM)
[ ] : TUNER (AM)
( ) : CD PLAY
[ ] : TUNER (AM)
( ) : CD PLAY
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F :
F :
AUDIO
f :
TUNER
J
: CD PLAY
d :
USB
E :
AUX
a :
Bluetooth
N :
MIC
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• f : Internal component.
•
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• f : Internal component.
•
: Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
Note:
The components identi-
fi
The components identi-
fi
ed by mark 0 or dotted
line with mark 0 are criti-
cal for safety.
Replace only with part
number specifi ed.
cal for safety.
Replace only with part
number specifi ed.
Note:
Les composants identifi és
par une marque 0 sont
critiques pour la sécurité.
Ne les remplacer que par
une pièce portant le nu-
méro spécifi é.
Les composants identifi és
par une marque 0 sont
critiques pour la sécurité.
Ne les remplacer que par
une pièce portant le nu-
méro spécifi é.
• Indication of transistor.
C
B
These are omitted.
E
Q
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
Note: When the complete MAIN board is replaced, it is nec-
essary to replace knob (VOL) (SV) assy simultane-
ously. Also, the destination setting, Bluetooth operation
check and Bluetooth information writing is necessary.
Refer to “DESTINATION SETTING METHOD” on
page 4, “BLUETOOTH FUNCTION CHECKING
METHOD USING A CELLULAR PHONE” on page
7 and “BLUETOOTH INFORMATION WRITING
METHOD” on page 8.
ously. Also, the destination setting, Bluetooth operation
check and Bluetooth information writing is necessary.
Refer to “DESTINATION SETTING METHOD” on
page 4, “BLUETOOTH FUNCTION CHECKING
METHOD USING A CELLULAR PHONE” on page
7 and “BLUETOOTH INFORMATION WRITING
METHOD” on page 8.
Note: When the complete MAIN board is replaced, it is nec-
essary to replace knob (VOL) (SV) assy simultane-
ously. Also, the destination setting, Bluetooth operation
check and Bluetooth information writing is necessary.
Refer to “DESTINATION SETTING METHOD” on
page 4, “BLUETOOTH FUNCTION CHECKING
METHOD USING A CELLULAR PHONE” on page
7 and “BLUETOOTH INFORMATION WRITING
METHOD” on page 8.
ously. Also, the destination setting, Bluetooth operation
check and Bluetooth information writing is necessary.
Refer to “DESTINATION SETTING METHOD” on
page 4, “BLUETOOTH FUNCTION CHECKING
METHOD USING A CELLULAR PHONE” on page
7 and “BLUETOOTH INFORMATION WRITING
METHOD” on page 8.
7
IC503
<zv/ (USB_X2)
50 mV/DIV, 10 ns/DIV
21 ns
180 mVp-p
22.8
Ps
3.5 Vp-p
2
IC705
rk (PIO18)
1 V/DIV, 10
Ps/DIV
3
IC705
rl (PIO19)
1 V/DIV, 200 ns/DIV
354 ns
3.5 Vp-p
4
IC705
yj (XO)
1 V/DIV, 20 ns/DIV
59.6 ns
3.5 Vp-p
1
IC001
es (XTAL_IN)
200 mV/DIV, 50 ns/DIV
83 ns
720 mVp-p
5
IC503
yk (RTC_X2)
1 V/DIV, 20
Ps/DIV
30.8
Ps
1.8 Vp-p
6
IC503
ua (XTAL)
1 V/DIV, 20 ns/DIV
75 ns
3.6 Vp-p
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